A printed-circuit board includes: a film-shaped thermoplastic base member having plasticity; a pattern fuse formed from a metal foil layer provided on a principal surface of the base member; a cover member covering at least part of the pattern fuse from an opposite side of the base member; and a first heat-resistant protection film provided on a region overlapping with at least part of the pattern fuse and covering the pattern fuse from a cover member side.

The present disclosure provides a battery module comprising a circuit board, the circuit board comprises a conductive layer, a first pad and a second pad. The conductive layer is formed with a sampling circuit, the sampling circuit comprises: a sampling end portion; an outputting end portion; a first branch path formed with a first fusing zone; and a second branch path formed with a second fusing zone. The first pad is provided on the sampling end portion, the second pad is provided on the second branch path. When the first fusing zone is fused, the circuit board can be quickly repaired by means of the second branch path and the second pad to electrically connect the sampling end portion and the outputting end portion, thereby achieving the purpose of reusing the circuit board, therefore the entire battery module is not scrapped and the utilization of the battery module is improved.

A film-type cable according to the present disclosure includes an insulating film and a plurality of conducting wires covered by the insulating film and extending in a first direction, each of the plurality of conducting wires separate by a predetermined distance, wherein each of the plurality of conducting wires includes: a fuse pattern section configured to be broken when a current exceeding a rated current flows through the fuse pattern section; and a normal section configured not to be broken when a current exceeding the rated current flows through the normal section, wherein the fuse pattern section may be thinner than the normal section.

A display panel including a substrate, a plurality of bonding pads, and a plurality of conductive traces is provided. The substrate has a substrate edge, a display region, and a peripheral region disposed between the substrate edge and the display region. The plurality of bonding pads are arranged in the peripheral region of the substrate. The plurality of conductive traces are electrically connected to the bonding pads. The conductive traces extend between the bonding pads and the substrate edge and have a plurality of breaks. A method of fabricating the display panel is also provided.

A circuit board with integrated fusing includes an insulating substrate having a circuit trace formed on a surface thereof, the circuit trace including a first circuit trace portion and a second circuit trace portion. A fusible link electrically connects the first circuit trace portion to the second circuit trace portion, the fusible link including a planar surface extending from the first circuit trace portion to the second circuit trace portion. A dielectric reflow encapsulates the fusible link on the planar surface from the first circuit trace portion to the second circuit trace portion.

A flexible printed circuit board (FPCB) including a pattern circuit layer. The pattern circuit layer has a pattern fuse embedded therein, and the pattern fuse includes a first conductive wire made of a metal and having a spiral structure, and a second conductive wire made of a metal and having a spiral structure. The first conductive wire and the second conductive wire have a double helix structure.

A method of running a printed circuit board (PCB) trace on a PCB. The PCB comprising a plurality of PCB layers. The method comprising forming a conductive trace on at least one of the plurality of PCB layers; coupling a first portion of the conductive trace to a capacitor formed on at least one of the plurality of PCB layers; coupling a second portion, different from the first portion, of the conductive trace to a conductive material formed within a first via extending through two or more of the plurality of PCB layers; and configurably setting a length of a conductive path of the conductive trace according to a predetermined impedance. The capacitor is separated laterally in a plan view at a first distance from the first via. The length of the conductive trace in the plan view is greater than the first distance. The conductive path of the conductive trace of the length has the predetermined impedance.

A circuit assembly includes a flexible card having a main panel and an extension panel foldably connected along a fold line and a card circuit disposed on the flexible card and having one or more contact points disposed proximate the fold line, and a circuit board having one or more electrical contacts formed on a surface of the circuit board. The flexible card and the circuit board can be disposed in face-to-face contact with each contact point of the card circuit is in registry with a respective electrical contact of the circuit board, with the extension panel folded at the fold line over the circuit board. The assembly includes a clip disposed over the folded extension panel and main panel to apply a sandwiching force to secure the circuit board and the card circuit in electrical contact.

Method for providing an electrical connection, comprising connecting a first cable to a first conducting structure on a printed circuit board, connecting a second cable to a second conducting structure on the printed circuit board, comparing a propagation delay of a first signal path comprising the first cable and the first conducting structure on the printed circuit board, and a propagation delay of a second signal path comprising the second cable and the second conducting structure on the printed circuit board; and removing conductive material of the first conducting structure and/or of the second conducting structure, in order to modify an electrical length of the first conducting structure and/or of the second conducting structure, to obtain a first conducting path and a second conducting path, in dependence on a result of the comparison, in order to reduce a difference of the propagation delays between the first signal path and the second signal path.

Embodiments of the invention include LED lighting systems and methods. For example, in some embodiments, an LED lighting system is included. The LED lighting system can include a flexible layered circuit structure that can include a top thermally conductive layer, a middle electrically insulating layer, a bottom thermally conductive layer, and a plurality of light emitting diodes mounted on the top layer. The LED lighting system can further include a housing substrate and a mounting structure. The mounting structure can be configured to suspend the layered circuit structure above the housing substrate with an air gap disposed in between the bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate. The distance between the layered circuit structure and the support layer can be at least about 0.5 mm. Other embodiments are also included herein.