Provided are a transparent conductor and a display device including the same, the transparent conductor including: a substrate layer; and a transparent conductive pattern layer formed on the substrate layer, and the transparent conductive pattern layer includes a plurality of conductive areas and non-conductive areas, the non-conductive areas are formed every between neighboring conductive areas, the non-conductive area in the transparent conductive pattern layer has a deviation as calculated by Equation 1 herein, which has a value larger than about 1 and equal to or smaller than about 1.25, and the non-conductive areas have a minimum line width of 40 μm or less.

Methods, apparatus and systems are described. An apparatus includes a module body made of a polymer material. The module body includes a mounting surface adjacent a potting area. At least two lead frame elements are embedded in the polymer material of the module body. Each of the at least two lead frame elements has a first terminal side and a second terminal side in the component potting area. An LED element is on the mounting surface of the module body and electrically coupled to the first terminal side of the at least two lead frame elements.

A wiring board includes: a first insulating layer; a first pad region provided above the first insulating layer and having a first connection pad; a second insulating layer provided above the first connection pad and having a first opening to expose the first connection pad; a second pad region provided above the second insulating layer and having a second connection pad electrically connected to the first connection pad; and a third insulating layer provided above the second connection pad, and having a second opening to exposes the first and second connection pads. The first connection pad region is smaller than the second connection pad region.

Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods are disclosed herein. In one embodiment, a substrate includes a first pair and a second pair of electrical contacts on a first surface of the substrate. The first pair of electrical contacts can be configured to receive a first surface-mount capacitor, and the second pair of electrical contacts can be configured to receive a second surface-mount capacitor. The first pair of electrical contacts can be spaced apart by a first space, and the second pair of electrical contacts can be spaced apart by a second space. The first and second spaces can correspond to first and second distances between electrical contacts of the first and second surface-mount capacitors.

Surface mount device (SMD) placement to control a signal path in a printed circuit board (PCB), including: adding, to a PCB, a plurality of signal path segments, each signal path segment of the plurality of signal path segments ending at corresponding pad of a plurality of pads, wherein a first pad of the plurality of pads is couplable to a second pad of the plurality of pads to create a first signal path and is couplable to a third pad of the plurality of pads to create a second signal path; and coupling, via a discrete SMD, the first pad and the second pad to create the first signal path comprising a first signal path segment of the plurality of signal path segments and a second signal path segment of the plurality of signal path segments.

The present invention provides for an electronic isolator device such as a universal isolator and having isolation and possible safety functionality and comprising an isolator module (550), and a base module (500), and wherein the isolator module is arranged for removable physical/electrical connection to the base module and in at least two orientations/positions relative to the base module, wherein electrical connection to the base module in each of the at least two orientations/positions serves to configure the type/functionality of the isolator device.

An apparatus may include a breadboard. The breadboard may include a substantially flat board, which may include a top surface and a bottom surface. The top surface may be disposed opposite the bottom surface. The board may include one or more openings disposed in the board. The apparatus may include a pallet. The pallet may include a top surface and a bottom portion disposed opposite the top surface. The pallet may include a plurality of risers, which may be disposed on the bottom portion and extend in a direction opposite the top surface. The bottom surface of the breadboard may be mountable to the top surface of the pallet. One or more circuit breakers may be disposable on the top surface of the board of the breadboard. The breadboard and pallet may be reusable in transporting circuit breakers.

In example implementations, a printed circuit assembly (PCA) is provided. The PCA includes vertical connector pads and right angle connector pads. The vertical connector pads includes a first row of pads and a second row of pads. The right angle connector pads include the first row of pads of the vertical connector pads and additional pads located between adjacent pads of the first row of pads of the vertical connector pads.

There is provided a method for implementing an electronic card. The method can include providing the electronic card with a printed circuit board. The method further includes selecting one of a first side and a second side as a specified side on which only connection hardware is to be mounted. The first side is located at a first x-y plane and the second side is located at a second x-y plane, the first and second x-y planes being separated by a length equal to a thickness of the PCB. The first and second x-y planes are parallel.

This electrical connection structure for wiring boards comprises: a plurality of wiring boards which are arranged along one side of a display panel and distribute electric power and/or an electric signal for driving the display panel; and a connector which is mounted on the wiring boards adjacent to each other, and electrically connects the wiring boards via a belt-like wiring material. Terminal connecting region and connector fixing region of the wiring board are configured to enable both first mounting of the connector with a direction in which the belt-like wiring material is inserted from the display panel end and second mounting of the connector with a direction in which the belt-like wiring material is inserted from an end opposite to the display panel. Thus, the present invention provides an electrical connection structure for wiring boards, in which an insertion direction of a connector can be reversed.