A method for manufacturing a wiring board capable of improving adhesion between an underlayer and a seed layer. An electrically conductive underlayer is disposed on the surface of an insulating substrate and a seed layer containing metal is disposed on the surface of the underlayer to prepare a substrate with seed-layer. A diffusion layer in which elements forming the underlayer and seed layer are mutually diffused is formed between the underlayer and the seed layer, by irradiating the seed layer with a laser beam. A metal layer is formed on the surface of the seed layer by disposing a solid electrolyte membrane between an anode and the seed layer as a cathode and applying voltage between the anode and the underlayer. An exposed portion without the seed layer of the underlayer is removed from the insulating substrate.

A wiring substrate includes an insulating layer including resin and filler particles, and an embedded wiring layer including wirings and embedded in the insulating layer such that the wirings are filling grooves formed on a surface of the insulating layer, respectively. The embedded wiring layer is formed such that the smallest line width of the wirings in the embedded wiring layer is in the range of 2 μm to 8 μm, and the insulating layer is formed such that the maximum particle size of the filler particles is 50% or less of the smallest line width of the wirings in the embedded wiring layer.

A circuit board has an edge connector with signal traces. The signal traces are formed on a dielectric layer of the circuit board. A reference trace is formed within the dielectric layer or on another surface of the dielectric layer. Parameters of the reference trace are adjusted to set an impedance of a single-ended signal trace or a differential impedance of two adjacent signal traces.

This application provides a planar transformer and a switching power adapter. The planar transformer includes a PCB winding and two magnetic cores. The two magnetic cores wrap two sides of a winding body of the PCB winding to form a closed magnetic loop. A first group of welding points is disposed on a primary-side wire side of the PCB winding, and a second group of welding points is disposed on a secondary-side wire side of the PCB winding. The planar transformer is directly welded to an external circuit board by using the first group of welding points and the second group of welding points. In this way, no pin needs to be welded on the PCB winding board. In addition, the planar transformer can be vertically installed on the external circuit board by using the first group of welding points and the second group of welding points.

A circuit board according to an embodiment includes a first substrate including an antenna feeder line formed thereon to connect an antenna driving unit and an antenna, a second substrate including a data line formed thereon to transmit data processed in the antenna driving unit to an electronic component, and a third substrate which is disposed between the first substrate and the second substrate, and includes a power supply line formed thereon to supply a power to the antenna driving unit.

The present disclosure relates to an electronic device, and the electronic device may include a circuit board provided within a main body of the electronic device, on which a conductive layer made of a conductive material and a dielectric layer made of an insulating material are alternately laminated; at least one or more patch antennas disposed on the circuit board; a core layer located at a central portion inside the circuit board, and configured with any one of the dielectric layers; a ground layer disposed below the core layer; and an EBG structure located inside the circuit board in a symmetrical shape at the top and bottom with respect to the core layer, and the EBG structure restricts operating frequency signals radiated from the respective patch antennas from being interfered with each other.

A bulkhead passthrough connector containing a printed circuit board (PCB) for transferring electrical signals across a bulkhead to an electronic valve actuator, an electronic valve actuator configured to operate and communicate with a valve using a PCB through a bulkhead, the electronic valve actuator, and a method of assembling a bulkhead passthrough connector incorporating a PCB. The embodiments may include a passthrough partition which separates one side of the bulkhead from another. A PCB retainer may also be secured to the passthrough partition. The PCB is attached to the PCB retainer and extends from one side to another side of the bulkhead through the passthrough partition. The PCB further includes electrical paths printed on the PCB and electrical connectors located on both sides of the bulkhead to enable communication with external devices.

A semiconductor composite device is provided that includes a voltage regulator, a package board, and a load, and converts an input DC voltage into a different DC voltage to supply the converted DC voltage to the load. The VR includes a semiconductor active element. The package board includes a C layer in which a capacitor is formed, and an L layer in which an inductor is formed. A plurality of through holes penetrate the C layer and the L layer in a direction perpendicular to the mounting face in the package board. The capacitor is connected to the load through the through hole. The inductor is connected to the load through the through hole and to the VR through the through hole.

A transmission line board includes an insulating substrate including a first principal surface, first and second signal lines, first and second signal electrodes, which are provided at the insulating substrate. The first signal electrode is connected to the first signal line, and is connected by capacitive coupling to a different circuit board. The second signal electrode is connected to the second signal line, and is connected to the different circuit board via a conductive binder. The first signal line is provided to transmit a signal in a first frequency band, and the second signal line is provided to transmit a signal in a second frequency band lower than the first frequency band.

A circuit structure includes a circuit board, microstrips, a stripline, and vias. The circuit board includes conductive levels. A first and second transceiving circuits are disposed on a first conductive level. A first microstrip is disposed on the first conductive level, and configured to couple a first pin of the first transceiving circuit to a second pin of the second transceiving circuit. A second and third microstrips are disposed on the first conductive level, and coupled to a third pin of the first transceiving circuit and a fourth pin of the second transceiving circuit, respectively. The stripline is disposed on a second conductive level. A first and second vias cross the first and second levels, and couple the second and third microstrips to the stripline. The first and third pins are an inner and outer pins of a front line of a BGA of the first transceiving circuit, respectively.