Patent classifications
H05K1/0298
CIRCUIT BOARD STRUCTURE
A circuit board structure includes a dielectric substrate, at least one embedded block, at least one electronic component, at least one first build-up circuit layer, and at least one second build-up circuit layer. The dielectric substrate includes a through cavity penetrating the dielectric substrate. The embedded block is fixed in the through cavity. The embedded block includes a first through hole and a second through hole. The electronic component is disposed in the through hole of the embedded block. The first build-up circuit layer is disposed on the top surface of the dielectric substrate and covers the embedded block. The second build-up circuit layer is disposed on the bottom surface of the dielectric substrate and covers the embedded block.
TEMPERATURE MEASUREMENT DEVICE
A temperature measurement device includes: a case fixed to a measurement target product; a flexible printed circuit board attached to the case; and a thermistor element mounting portion having a thermistor element to be electrically connected to a wiring provided on the flexible printed circuit board, the case has a holding portion for holding the thermistor element mounting portion and a support portion for supporting the holding portion, the holding portion is connected through a hinge portion to a case body provided with the support portion, and the holding portion is supported by the support portion in such a manner that the holding portion is folded back to bend the hinge portion.
DEVICES, SYSTEMS, AND METHODS FOR SERIAL COMMUNICATION OVER A GALVANICALLY ISOLATED CHANNEL
Devices, systems, and methods for serial communication over a galvanically isolated channel are disclosed. A device includes a first IC device interface, first TO components connected to the first IC device interface, a second IC device interface, second IO components connected to the second IC device interface, an insulator layer having a first major surface and a second major surface, at least one pair of capacitor plates and corresponding interconnection paths on the first major surface, and at least one pair of capacitor plates and corresponding interconnection paths on the second major surface, wherein the at least one pair of capacitor plates on the first major surface of the insulator layer are aligned with the at least one pair of capacitor plates on the second major surface of the insulator layer to form at least one pair of capacitors.
Driving device
A driving device includes an electric motor, a rotating shaft, a motor housing, a printed circuit board, an electric power converting circuit, a rear frame end working as a heat radiating member, gel working as a heat transfer member, multiple mounted parts and so on. The heat radiating member is located on a side of the printed circuit board and facing a motor-side surface of the printed circuit board, to which multiple switching elements are mounted. The gel is plastically deformed and adhered to the switching elements and the heat radiating member for transferring heat of the switching elements to the heat radiating member. At least one of the mounted parts is mounted to the printed circuit board and located at a position between a through-hole opposing area and one of the switching elements, which is located at a position closest to a rotational angle sensor mounted to the printed circuit board in the through-hole opposing area.
High-frequency module, high-frequency circuit, and communication device
A filter includes a first input/output electrode and the second input/output electrode, and is arranged on a first main surface of a mounting substrate. The mounting substrate includes a first land electrode, a second land electrode, a ground terminal, and a plurality of via conductors. The first land electrode is connected to the first input/output electrode. The second land electrode is connected to the second input/output electrode. The ground terminal is located closer to a second main surface side than the first main surface in a thickness direction of the mounting substrate. The plurality of via conductors is arranged between the first main surface and the second main surface, and is connected to the ground terminal. The plurality of via conductors is located between the first land electrode and the second land electrode in a plan view from the thickness direction of the mounting substrate.
Routing structure and method of forming the same
The present disclosure provides a routing structure. The routing structure includes a substrate having a first circuit region and a boundary surrounding the first circuit region. The routing structure also includes a first conductive trace coupled to a first conductive pad disposed in the first circuit region. The first conductive trace is inclined with respect to the boundary of the substrate. A method of forming a routing structure is also disclosed.
FLEX-PCB INTEGRATED PACKAGING FOR SILICON PHOTONICS LIDAR
Various embodiments disclosed relate to LiDAR systems. The present disclosure includes a method and assemblies for connection photonics modules to LiDAR systems. In an example, a connection assembly can include a system board, a flex printed circuit board (PCB) connected to the system board through an interface, a photonics integrated circuit die mounted on a first side of the flex PCB and an electronic integrated circuit die mounted on a second side of the flex PCB, opposite the first side.
Wiring circuit board assembly sheet, producing method thereof, and producing method of wiring circuit board
A wiring circuit board assembly sheet includes a support sheet having two end edges parallel with each other and a plurality of wiring circuit boards disposed at spaced intervals to each other in the support sheet. The wiring circuit board includes a metal-based portion having a generally rectangular frame shape. The metal-based portion includes a first piece along a first direction perpendicular to a thickness direction of the support sheet, and a second piece along a second direction perpendicular to the thickness direction and the first direction. Both the first piece and the second piece are inclined with respect to the end edge of the support sheet.
Stator and rotor design for periodic torque requirements
Disclosed is a motor or generator comprises a rotor and a stator, wherein the rotor has an axis of rotation and is configured to generate first magnetic flux parallel to the axis of rotation, the stator is configured to generate second magnetic flux parallel to the axis of rotation, and at least one of the rotor or the stator is configured to generate a magnetic flux profile that is non-uniformly distributed about the axis of rotation. Also disclosed is a method that involves arranging one or more magnetic flux producing windings of a stator non-uniformly about an axis of rotation of a rotor of an axial flux motor or generator.
Wiring board
A wiring board includes: an insulating layer; and a connection terminal formed on the insulating layer. The connection terminal includes a first metal layer laminated on the insulating layer, a second metal layer laminated on the first metal layer, a metal pad laminated on the second metal layer, and a surface treatment layer that covers an upper surface and a side surface of the pad and that is in contact with the upper surface of the insulating layer. An end portion of the second metal layer is in contact with the surface treatment layer, and an end portion of the first metal layer is positioned closer to a center side of the pad than the end portion of the second metal layer is to form a gap between the end portion of the first metal layer and the surface treatment layer.