A compound (A) of the present invention is represented by the formula (1): wherein each R.sub.1 independently represents a group represented by the formula (2) or a hydrogen atom, and each R.sub.2 independently represents a hydrogen atom or a linear or branched alkyl group having 1 to 6 carbon atoms, provided that at least one R.sub.1 is a group represented by the formula (2); and wherein -* represents a bonding hand.

Provided are: a novel wiring board having flexibility derived from a resin board and the high electrical conductivity derived from a metal wiring as well as high adhesion between the metal wiring and the insulating resin board; and a method for manufacturing the wiring board without using a photolithography process. A wiring board according to the present invention comprises a resin board and a metal wiring, the metal wiring including a sintered body of metal particles, the sintered body including a plurality of voids having opening portions extending toward the resin board, parts of the resin board entering the voids from the opening portions.

An electronics package is disclosed. The electronics package includes a first radio frequency (RF) substrate layer, a second RF substrate layer, and a plurality of conductive layers disposed adjacent to at least one of the first RF substrate layer and the second RF substrate layer and including an inner conductive layer disposed between and adjacent to both the first RF substrate layer and the second RF substrate layer. The inner conductive layer bonds the first RF substrate layer to the second RF substrate layer. The electronics package also includes a plurality of conductive interconnects extending through the first RF substrate layer and the second RF substrate layer and electrically coupled between at least two of the plurality of conductive layers.

A substrate according to an embodiment includes an insulating layer having a grain formed therein extending in a first direction; and a circuit pattern disposed on the insulating layer; wherein the insulating layer includes an upper surface and a plurality of outer side surfaces; wherein the plurality of outer side surfaces includes: a first outer side surface extending in the same first direction as the first direction having the grain formed in the insulating layer; and a second outer side surface extending in a second direction different from the first direction and excluding the first outer side surface, wherein the first outer side surface has a first surface roughness; and wherein the second outer side surface has a second surface roughness different from the first surface roughness.

A nitride-based ceramics resin composite body having thermal conductivity, electrical insulation, and adhesion to adherends equal to conventional products, and having improved heat resistance reliability during the reflow process, and a thermal conductive insulating adhesive sheet using the same are provided. A nitride-based ceramics resin composite body in which a thermosetting resin composition is impregnated in a porous nitride-based ceramics sintered body is provided. The thermosetting resin composition includes a specific epoxy resin and a bismaleimide triazine resin, and a water absorption of the thermosetting resin composition in a completely cured state measured in accordance with method A in JIS K7209 (2000) is 1% by mass or less.

To provide an epoxy resin composition that exhibits excellent low-dielectric properties and that is excellent in copper foil peel strength and interlayer cohesion strength in a printed-wiring board application, as well as an active ester resin that provides the epoxy resin composition. An active ester resin having a polyaryloxy unit containing a dicyclopentenyl group and represented by the following formula (1), and a polyarylcarbonyl unit. Here, R.sup.1 represents a hydrocarbon group having 1 to 8 carbon atoms, R.sup.2 represents a hydrogen atom, or formula (1a) or formula (1b), and at least one R.sup.2 is formula (1a) or formula (1b); and n represents a number of repetitions of 1 to 5.

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A connection structure embedded substrate includes a printed circuit board including a first insulating body and a plurality of first wiring layers disposed on at least one of an external region or an internal region of the first insulating body; and a connection structure embedded in the first insulating body and including first and second substrates. The first and second substrates are disposed adjacent to each other.

An interconnect substrate includes a first insulating layer, an interconnect layer formed on a first surface of the first insulating layer, and a second insulating layer formed on the first surface of the first insulating layer to cover the interconnect layer, wherein the second insulating layer includes a first resin layer and a second resin layer, the first resin layer covering at least part of a surface of the interconnect layer exposed outside the first insulating layer, the second resin layer covering the first resin layer, wherein both the first resin layer and the second resin layer contain a resin and a filler, and wherein a proportion of the resin in the first resin layer per unit area is higher than a proportion of the resin in the second resin layer per unit area.

A device having a color photo resist pattern includes a 3D substrate, at least one color photo resist layer and at least one circuit pattern layer. The at least one color photo resist layer is formed on said 3D substrate and forms a visual pattern together. The at least one circuit pattern layer is formed on said visual pattern formed by said at least one color photo resist layer.

Panels of LED arrays and LED lighting systems are described. A panel includes a substrate having a top and a bottom surface. Multiple backplanes are embedded in the substrate, each having a top and a bottom surface. Multiple first electrically conductive structures extend at least from the top surface of each of the backplanes to the top surface of the substrate. Each of multiple LED arrays is electrically coupled to at least some of the first conductive structures. Multiple second conductive structures extend from each of the backplanes to at least the bottom surface of the substrate. At least some of the second electrically conductive structures are coupled to at least some of the first electrically conductive structures via the backplane. A thermal conductive structure is in contact with the bottom surface of each of the backplanes and extends to at least the bottom surface of the substrate.