According to an embodiment of the present disclosure, a structure constructed by a sheet includes a sheet body. The sheet body has a plurality of enclosed paths. A plurality of slits and connection portions are arranged along each enclosed path. Each connection portion is located between two adjacent slits. The sheet body is flexible. In an extended state, the slits form extended openings. At least one extended opening is a symmetric opening, so that the sheet body is extended to form a structure constructed by sheet. The structure constructed by sheet forms a stereoscopic curved surface, and the plurality of connection portions is located on a plurality of contours of the stereoscopic curved surface.

The invention provides processes for the manufacture of conductive transparent films and electronic or optoelectronic devices comprising same.

A stretchable display device comprises a display panel that includes a stretchable substrate where a plurality of emission elements is disposed, wherein the stretchable substrate is stretchable in at least one of a first direction and a second direction perpendicular to the first direction; a printed circuit film that includes a first driving circuit chip generating a drive control signal to be applied to the display panel and a second driving circuit chip receiving image data from outside and transferring the image data to the first driving circuit chip, wherein the printed circuit film is stretchable in at least one of the first direction and the second direction with respect to a stretch direction of the display panel.

A printed wiring board includes a laminated base material including an insulating layer and a conductor layer formed on the insulating layer, and a solder resist layer laminated on the laminated material and including photosensitive resin. The resist layer has surface portion and portion in contact with the laminated material, the conductor layer has pattern including conductor pads in contact with the resist layer such that the pads are positioned in openings in the resist layer, and the resist layer satisfies a first condition that a chemical species derived from a photopolymerization initiator has concentration higher in the portion in contact with the laminated material than concentration in the surface portion and/or a second condition that the chemical species derived from the initiator in the portion in contact with the laminated material has photopolymerization initiating ability higher than a chemical species derived from a photopolymerization initiator in the surface portion.

The present invention relates to a halogen-free epoxy resin composition, a prepreg and a laminate containing the same. The halogen-free epoxy resin composition comprises 60 parts by weight of epoxy resin, from 15 to 28 parts by weight of benzoxazine resin, and from 10 to 20 parts by weight of styrene-maleic anhydride. The present invention discloses using from 15 to 28 parts by weight of benzoxazine resin and from 10 to 20 parts by weight of styrene-maleic anhydride to cure 60 parts by weight of epoxy resin, to ensure the Df stability of prepregs at different curing temperature conditions while maintaining low dielectric constant and low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.

A composite structure for use as a constituent of a mounting device, wherein the composite structure comprises an electrically conductive carrier, an intermediate layer comprising adhesion promoting material and being arranged on the electrically conductive carrier, and a thermally conductive and electrically insulating layer on the intermediate layer.

The disclosure provides a method of manufacturing a flexible circuit electrode assembly and an apparatus manufactured by said method. According to the method, an electrically conductive sheet is laminated to an electrically insulative sheet. An electrode is formed on the electrically conductive sheet. An electrically insulative layer is formed on a tissue contacting surface of the electrode. The individual electrodes are separated from the laminated electrically insulative sheet and the electrically conductive sheet. In another method, a flexible circuit is vacuum formed to create a desired profile. The vacuum formed flexible circuit is trimmed. The trimmed vacuum formed flexible circuit is attached to a jaw member of a clamp jaw assembly.

The present invention relates to a composition for forming a conductive pattern and a resin structure having a conductive pattern, wherein the composition makes it possible to form a fine conducive pattern on various polymer resin products or resin layers through a simple process, and can more effectively meet needs of the art, such as displaying various colors.

Provided are circuit board excellent in interlayer adhesion and solder heat resistance, and production method thereof. The circuit board is produced by a method including: preparing a plurality of at least one kind of thermoplastic liquid crystal polymer (TLCP) films, forming a conductor layer on one side or both sides of a film in at least one of the films to obtain a unit circuit board, laminating the films containing the unit circuit board to obtain a stacked material, conducting thermo-compression-bonding of the stacked material under pressurization to a first temperature giving an interlayer adhesion to integrate the stacked material, carrying out structure-controlling thermal treatment by heating the integrated stacked material at a second temperature which is lower than the first temperature and is lower than a melting point of a TLCP having a lowest melting point out of the plurality of TLCP films.

A printed wiring board includes an insulation layer, conductive pads formed on the insulation layer and positioned to connect an electronic component, and a conductive wiring pattern including first and second conductive patterns and formed on the insulation layer such that the conductive wiring pattern is extending between the conductive pads. The first pattern includes first wiring lines, the second pattern includes second wiring lines, the first and second conductive patterns are formed such that the first wiring lines and the second wiring lines are alternately arrayed on the insulation layer, each of the first wiring lines includes a first metal layer formed on an interface with the insulation layer, each of the second wiring lines includes a second metal layer formed on an interface with the insulation layer, and the first metal layer includes a metal material which is different from a metal material forming the second metal layer.