Patent classifications
H05K1/038
Glass composition, glass fiber, glass cloth, and method for producing glass fiber
The present disclosure provides a novel glass composition that has a low permittivity and is suitable for mass production. A glass composition provided satisfies, in wt %, for example, 40≤SiO.sub.2≤60, 25≤B.sub.2O.sub.3≤45, 0<Al.sub.2O.sub.3≤18, 0<R.sub.2O≤5, and 0≤RO≤12, and satisfies at least one of: i) SiO.sub.2+B.sub.2O.sub.3≥80 and SiO.sub.2+B.sub.2O.sub.3+Al.sub.2O.sub.3≤99.9; and ii) SiO.sub.2+B.sub.2O.sub.3≥78, SiO.sub.2+B.sub.2O.sub.3+Al.sub.2O.sub.3≤99.9, and 0<RO<10. Another glass composition provided includes SiO.sub.2, B.sub.2O.sub.3, Al.sub.2O.sub.3, R.sub.2O, and 3<RO<8 at the same contents as the above, and satisfies SiO.sub.2+B.sub.2O.sub.3≥75 and SiO.sub.2+B.sub.2O.sub.3+Al.sub.2O.sub.3<97, where R.sub.2O═Li.sub.2O+Na.sub.2O+K.sub.2O and RO═MgO+CaO+SrO.
ELECTRONIC TEXTILES AND METHODS FOR FABRICATION THEREOF
Electronic textiles and methods of fabrication electronic textiles. Nanoparticles of a conductive material are sprayed along a conductive path into a fabric material so as to penetrate into the fabric. A layer of a second conductor material is coated over the nanoparticles along the conductive path. A layer of an insulator material is coated over the layer of the second conductor material so as to encapsulate the conductive path and form a trace. An electrode configured to contact a subject wearing the fabric material includes a layer of a third conductor material coated over the layer of the second conductor and electrically coupled with the conductive path. An electrical connector is secured to the fabric material and electrically coupled with the conductive path. The nanoparticles are sprayed onto the fabric material using a dual regime spray process implemented with a dual regime spray system.
ELECTRONICS-TO-TEXTILE INTERCONNECTION METHOD AND SYSTEM
An apparatus and method to reliably attach an electronic module to a textile. The overall mechanical assembly of the invention includes: (a) light pipe, (b) top enclosure, (b) magnet, (c) main electronics which contains (d) the main PCB, (e) battery and (f) other electronic components, (g) bottom enclosure, which holds (h) the connector PCB, (i) module dock, (j) top textile PCB which are located above the (j) textile band and under the (k) textile pocket and the (l) bottom textile PCB and (m) fabric and laminate padding, which are located below the textile band. The invention is physically embodied by an electronic module, comprising at least one printed circuit board (PCB), comprising at least one conductive circuit and at least one electronic component; a metallic rivet, grommet or eyelet to mechanically and electrically connect the; and a textile substrate with at least one electrically conductive circuit.
GLASS COMPOSITION, GLASS FIBER, GLASS CLOTH, AND METHOD FOR PRODUCING GLASS FIBER
The present disclosure provides a novel glass composition that has a low permittivity and is suitable for mass production. A glass composition provided satisfies, in wt %, for example, 40≤SiO.sub.2≤60, 25≤B.sub.2O.sub.3≤45, 0<Al.sub.2O.sub.3≤18, 0<R.sub.2O≤5, and 0≤RO≤12, and satisfies at least one of: i) SiO.sub.2+B.sub.2O.sub.3≥80 and SiO.sub.2+B.sub.2O.sub.3+Al.sub.2O.sub.3≤99.9; and ii) SiO.sub.2+B.sub.2O.sub.3≥78, SiO.sub.2+B.sub.2O.sub.3+Al.sub.2O.sub.3≤99.9, and 0<RO<10. Another glass composition provided includes SiO.sub.2, B.sub.2O.sub.3, Al.sub.2O.sub.3, R.sub.2O, and 3<RO<8 at the same contents as the above, and satisfies SiO.sub.2+B.sub.2O.sub.3≥75 and SiO.sub.2+B.sub.2O.sub.3+Al.sub.2O.sub.3<97, where R.sub.2O=Li.sub.2O+Na.sub.2O+K.sub.2O and RO=MgO+CaO+SrO.
Electrical connection on a textile carrier material
Various embodiments of the present disclosure are directed to electrically conductive connection between a first electrically conductive element and a second electrically conductive element on a textile carrier material. In one example embodiment, the electrically conductive connection includes an electrically conductive thermal transfer adhesive arranged on the carrier material and creates an electrically conductive connection between the first conductive element and the second conductive element. The electrically conductive connection is positioned in electrically conductive contact with the first conductive element and the second conductive element.
CONNECTORS FOR INTEGRATING CONDUCTIVE THREADS TO NON-COMPATIBLE ELECTROMECHANICAL DEVICES
An electrical circuit assembly comprising: a circuit component, a fabric-based component, and a fastener is disclosed along with methods for fabricating the electrical circuit assembly and for using the electrical circuit assembly. The circuit component may comprise: a substrate layer comprising an integrated circuit disposed on the substrate layer; and a first conductive linkage electrically coupled to the integrated circuit. The fabric-based component may comprise: a fabric layer comprising a first at least one conductive thread; and a second conductive linkage electrically coupled to the first at least one conductive thread. The fastener may be configured to couple the circuit component and the fabric-based component at the first conductive linkage and the second conductive linkage.
Connectable electric device to a textile electrically conductive band
Electric device with electric connection means suitable for connecting it to an electric power source, comprising a supporting surface for a textile electrically conductive band and retention means for retaining the textile electrically conductive band on supporting surface. Electric connection means comprise piercing means for piercing the textile electrically conductive band which are suitable for conducting an electric current. Textile electrically conductive band is made of double weaving and comprises two mutually parallel electrically conductive guides extending along the band. Each of the electrically conductive guides is located between two layers of textile material of said double weaving.
CONDUCTIVE ELECTRONIC TEXTILES
Disclosed herein are a flexible textile-based silver electrode and a sweat-activated battery. Also disclosed herein is a method of making the flexible textile-based silver electrode by providing a composite material comprising a flexible textile substrate and a polymeric silver electrode wire, and bringing the composite material into contact with an aqueous solution comprising a non-toxic chloride salt and an organic acid for a period of time, wherein the electrode wire comprising an elastomeric material and silver flakes homogeneously distributed throughout the elastomeric material.
Embossed smart functional premium natural leather
A smart functional leather assembly includes a leather substrate, an electronic circuit layer including one or more conductive traces and optional electronic elements arranged on the leather substrate, optionally a pigmented coating arranged on the circuit layer, and an optional anti-soiling layer arranged on the pigmented layer. The entire smart functional leather assembly, including the circuit, are embossed to provide an embossed smart functional leather assembly with an embossed pattern.
Electrical Components Attached to Fabric
An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.