A radiation-emitting semiconductor device and a fabric are disclosed. In an embodiment, a radiation-emitting semiconductor device includes a semiconductor layer sequence having an active region configured to generate radiation and at least one carrier on which the semiconductor layer sequence is arranged, wherein the at least one carrier has at least one anchoring structure on a carrier underside facing away from the semiconductor layer sequence, wherein the at least one anchoring structure includes electrical contact points for making electrical contact with the semiconductor layer sequence, and wherein the at least one anchoring structure is configured to receive at least one thread for fastening the semiconductor device to a fabric and for electrical contacting the at least one thread.

Provided are a surface-treated glass cloth capable of enhancing insulation reliability when used to prepare a prepreg, a prepreg and a printed wiring board using the surface-treated glass cloth. The surface-treated glass cloth includes a surface treatment layer on a surface, a glass constituting the glass cloth has a composition containing 52.0 to 60.0 mass % of SiO.sub.2, 15.0 to 26.0 mass % of B.sub.2O.sub.3, 9.0 to 18.0 mass % of Al.sub.2O.sub.3, 1.0 to 8.0 mass % of MgO, 1.0 to 10.0 mass % of CaO, 0 to 6.0 mass % of SrO, 0 to 6.0 mass % of TiO.sub.2, and 0.1 to 3.0 mass % in total of F.sub.2 and Cl.sub.2, based on the total amount of the glass, the glass cloth has a surface coverage of 75.0 to 100.0% and a thickness of 8 to 95 μm, and the surface treatment layer contains a silane coupling agent having a methacrylic group and contains no surfactant.

The present invention relates to a patterned fiber substrate comprising: a fiber substrate; and a pattern consisting of a functional material and formed on the fiber substrate, wherein at least a part of the functional material that constitutes the pattern is present in inside of the fiber substrate, the fiber substrate has a contact angle of 100 to 170° with pure water on its surface, and the pattern has a narrowest line width of 1 to 3000 μm.

The core-shell structured fiber-type strain sensor of the present disclosure, which includes a fibrous support forming a core and a multilayered shell layer formed on the fibrous support, exhibits improved strength and stiffness due to the core fiber, exhibits improved noise level due to an elastomer layer and allows manufacturing of a fiber-type sensor with improved linearity of measurement signals due to a sandwich-structured conductive layer, is advantageous in that stable strain measurement is possible without acting as a defect in a composite structure.

Systems and methods for bonding an electronic component to substrate with a rough surface. The method comprising: disposing an insulating adhesive on the substrate; applying heat and pressure to the insulating adhesive to cause the adhesive to flow into at least one opening formed in the substrate; curing the insulating adhesive to form a pad that is at least partially embedded in the substrate and comprises a planar smooth surface that is exposed; disposing at least one trace on the planar smooth surface of the pad; depositing an anisotropic conductive material on the pad so as to at least cover the at least one trace; placing the electronic component on the pad so that an electrical coupling is formed between the electronic component and the at least one trace; and bonding the electronic component to the substrate by curing the anisotropic conductive material.

A conductive textile includes a base cloth and a conductive film disposed on the base cloth. The conductive film includes a polyurethane resin and a silver bearing conductor, in which a content of the silver bearing conductor is 55 parts by weight to 80 parts by weight, and a content of the polyurethane resin is 8 parts by weight to 12 parts by weight.

Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.

Various embodiments of the present disclosure are directed to electrically conductive connection between a first electrically conductive element and a second electrically conductive element on a textile carrier material. In one example embodiment, the electrically conductive connection includes an electrically conductive thermal transfer adhesive arranged on the carrier material and creates an electrically conductive connection between the first conductive element and the second conductive element. The electrically conductive connection is positioned in electrically conductive contact with the first conductive element and the second conductive element.

This document describes techniques and apparatuses for connecting an electronic component to an interactive textile. Loose conductive threads of the interactive textile are collected and organized into a ribbon with a pitch that matches a corresponding pitch of connection points of the electronic component. Next, non-conductive material of the conductive threads of the ribbon are stripped to expose the conductive wires of the conductive threads. After stripping the non-conductive material from the conductive threads of the ribbon, the connection points of the electronic component are bonded to the conductive wires of the ribbon. The conductive threads proximate the ribbon are then sealed using a UV-curable or heat-curable epoxy, and the electronic component and the ribbon are encapsulated to the interactive textile with a water-resistant material, such as plastic or polymer.

A printed circuit that comprises a substrate, electrical interconnects and a double-resin ink having a positive temperature coefficient (PTC), wherein the double-resin ink has a resistance magnification of at least 20 in a temperature range of at least 20 degrees Celsius above a switching temperature of the double-resin ink, the resistance magnification being defined as a ratio between a resistance of the double-resin ink at a temperature ‘T’ and a resistance of the double-resin ink at 25 degrees Celsius. The substrate is a fabric or mesh, while the double-resin ink and the electrical interconnects are deposited onto the substrate.