H05K1/038

Spread weave induced skew minimization
10973115 · 2021-04-06 · ·

A printed circuit board includes a spread weave of fibers having a first direction and a second direction with corresponding fibers spread more in the first direction than the second direction; and one or more pairs of traces on the spread weave of fibers, wherein the first direction has less differences in dielectric permittivity seen by each trace than the second direction, wherein the one or more pairs of traces are routed according to a routing design that includes one or more fixed regions on the spread weave of fibers, where routing of traces therein is restricted to linear, non-angled routed in the first direction.

Stretchable conductor circuit
10999925 · 2021-05-04 · ·

This disclosure provides a stretchable conductor structure, a garment with a stretchable conductor structure, and a method for producing a stretchable conductor structure. The conductive structure includes a set of conductive wires and a stretchable laminate. The set of conductive wires, each including a protective surface, the set of conductive wires patterned in a mesh structure to accommodate a manipulation while providing electrical conductivity across the set of conductive wires. The stretchable laminate encapsulates the mesh structure, the stretchable laminate can return the mesh structure of the set of conductive wires to an original state after the manipulation.

CONDUCTIVE FABRIC AND ITS PREPARATION AND APPLICATIONS

The present invention provides a conductive fabric comprising base cloth and a conductive metallic circuit structure formed on the surface of the base cloth. The conductive metallic circuit structure comprises at least one metallic seed layer and at least one chemical-plating layer. The metallic seed layer is an evaporation-deposition layer or a sputter-deposition layer and has a circuit pattern. The chemical-plating layer is applied over the surface of the metallic seed layer. The conductive fabric has improved conductivity and heat generation efficiency.

Electronic conductive interconnection for bridging across irregular areas in a textile product

A seam jump connector provides connectivity over an irregular area, such as seam, in a textile. The textile is part of a textile base structure that includes one or more electrically conductive interconnects formed either directly on the textile or on intermediate substrates that are attached to the textile. The intermediate substrates can be TPU sheets having conductive interconnects printed on a surface. The conductive interconnects of the textile base structure are discontinuous at an irregular area on the textile, and the seam jump connector includes a flexible and/or stretchable substrate with conductive interconnects. The seam jump connector is aligned with and stacked onto the conductive interconnects so as to provide electrical connectivity across the irregular area. The seam jump connectors can be configured to be permanently or removably attached to the textile base structure.

Haptic vibrotactile actuators on textiles and related systems and methods

The disclosed haptic vibrotactile actuator may include a textile comprising a first major surface and a second, opposite major surface, an electrode coupled to the first major surface of the textile across at least a majority of a surface area of a first surface of the electrode, and a flexible electroactive material electrically coupled to a second, opposite surface of the electrode. Various other related methods and systems are also disclosed.

THERMAL SUBSTRATE WITH HIGH-RESISTANCE MAGNIFICATION AND POSITIVE TEMPERATURE COEFFICIENT INK
20210130634 · 2021-05-06 ·

An article comprising a heater that comprises a high-resistance magnification (HRM) PTC ink deposited on a flexible substrate to form one or more resistors. The HRM PTC ink has a resistance magnification of at least 20 in a temperature range of at least 20 degrees Celsius above a switching temperature of the ink, the resistance magnification being defined as a ratio between a resistance of the double-resin ink at a temperature T and a resistance of the double-resin ink at 25 degrees Celsius.

METHOD AND APPARATUS FOR ATTACHING CHIP TO A TEXTILE
20210087721 · 2021-03-25 ·

Embodiments disclosed herein provide approaches for attaching scan control and other electronic chips to textiles, e.g., on a loom as part of a real-time manufacturing process.

OPTOELECTRONIC ASSEMBLY, METHOD AND MOLDED PART
20210091283 · 2021-03-25 ·

An optoelectronic assembly comprises at least two electrical contacts on a surface of an optoelectronic component for supplying electrical energy for generating electromagnetic radiation, and at least two meander-shaped contact lugs, each of which comprises a first and a second section. The first section in each case of the at least two meander-shaped contact lugs is coupled to one of the at least two electrical contacts. The second section in each case of the at least two meander-shaped contact lugs comprises a fastening element which is designed to go into a mechanical linkage to a fiber structure of a carrier and to create an electrical connection to the first section.

Wiring film, device transfer sheet, and textile type device

A wiring film is provided between a cloth and an electronic component, wherein the wiring film has a wiring layer including an extensible film and wirings provided along the extensible film inside or on an outer surface of the extensible film and at least a part of the wirings is exposed from a first surface of the wiring layer that faces the electronic component.

Circuit board using non-catalytic laminate with catalytic adhesive overlay
10959329 · 2021-03-23 · ·

A catalytic resin is formed by mixing a resin and either homogeneous or heterogeneous catalytic particles, the resin infused into a woven glass fabric to form an A-stage pre-preg, the A-stage pre-preg cured into a B-stage pre-preg, thereafter held in a vacuum and between pressure plates at a gel point temperature for a duration of time sufficient for the catalytic particles to migrate away from the resin rich surfaces of the pre-preg, thereby forming a C-stage pre-preg after cooling. The C-stage pre-preg subsequently has trenches formed by removing the resin rich surface, the trenches extending into the depth of the catalytic particles, optionally including drilled holes to form vias, and the C-stage pre-preg with trenches and holes placed in an electroless bath, whereby traces form in the trenches and holes where the surface of the cured pre-preg has been removed.