Embodiments generally relate to devices and methods for production of fibers and threads for use in electronic device manufacturing. Described here, fibers can be produced and manipulated using a dual-surfaced sizing material. The dual-surfaced sizing material has a surface which binds a fiber and a surface which binds a resin. Thus, the dual-surfaced sizing material can be left attached to the fibers without adversely affecting the resin binding in later production steps.

This document describes an interactive object with multiple electronics modules. An interactive object (e.g., a garment) includes a grid or array of conductive thread woven into the interactive object, and an internal electronics module coupled to the grid of conductive thread. The internal electronics module includes a first subset of electronic components, such as sensing circuitry configured to detect touch-input to the grid of conductive thread. An external electronics module that includes a second subset of electronic components (e.g., a microprocessor, power source, or network interface) is removably coupled to the interactive object via a communication interface. The communication interface enables communication between the internal electronics module and the external electronics module when the external electronics module is coupled to the interactive object.

A flexible circuit may be provided that allows for the monitoring of a physical object. The flexible circuit includes a plurality of flexible conductive segments that are disposed in a geometric pattern. The flexible conductive segments include nodes, and the physical object is monitored by analyzing changes in electrical resistance in the conductive segments between the nodes. The flexible circuit may also include sensors disposed on the nodes for monitoring additional conditions. A processor monitors the flexible conductive segments and sensors. and may provide an output regarding the status of the physical object.

Provided are: a resin-containing sheet in which not only the mechanical strength of a cellulose nanofiber nonwoven fabric but also the flexural resistance of a substrate are improved; and a structure and a wiring board which include the same. The resin-containing sheet includes: a specific cellulose nanofiber nonwoven fabric (11); a fixing agent (2) which fixes together fibers (1) in the cellulose nanofiber nonwoven fabric (11); and a resin (3) which is in contact with the cellulose nanofiber nonwoven fabric (11) and the fixing agent (2), wherein the storage modulus of the fixing agent (2) is higher than that of the resin (3). The structure is obtained by tightly adhering the resin-containing sheet to a substrate. The wiring board includes this structure.

A compliant interconnect with a cylindrical bellows structure is configured to reduce a stress between a substrate and a PCB board. The stress can be caused by a CTE (coefficient of thermal expansion) mismatch, a physical movement, or a combination thereof. The compliant interconnect can be solder to and/or immobilized on one or more coupling structure. Alternatively, the compliant interconnect can include an instant swapping structure (such as a socket) that makes the upgrade of the electronic components easier.

An electrical circuit board includes a first conductive layer and a second conductive layer. And an interlayer forming a thermal barrier is placed between the first conductive layer and the second conductive layer, wherein the thermal barrier reduces heat transfer between the first conductive layer and the second conductive layer.

A device comprising a first and a second electrically conductive textile portion is provided, wherein the first and second textile portions are electrically isolated from each other. The device also comprises an electrical element having a first contact pad which is electrically connected to the first textile portion and a second contact pad which is electrically connected to the second textile portion, wherein the first and second textile portions are adapted to supply the electrical element with electrical power. An improved textile device is thereby provided, which is capable of supplying an electrical element with electrical power.

Electric device with electric connection means suitable for connecting it to an electric power source, comprising a supporting surface for a textile electrically conductive band and retention means for retaining the textile electrically conductive band on supporting surface. Electric connection means comprise piercing means for piercing the textile electrically conductive band which are suitable for conducting an electric current. Textile electrically conductive band is made of double weaving and comprises two mutually parallel electrically conductive guides extending along the band. Each of the electrically conductive guides is located between two layers of textile material of said double weaving.

A component carrier, wherein the component carrier includes: i) a layer stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, ii) a bendable portion which forms at least a part of the layer stack, and iii) a metal layer which forms at least a part of the bendable portion. Hereby, the metal layer extends over at least 75% of the area of the bendable portion.

A fabric-based item may include fabric formed from intertwined strands of material. The fabric may include first and second fabric layers that at least partially surround a pocket. Initially, the pocket may be completely enclosed by the first and second layers of fabric. A shim may be placed in the pocket before the pocket is closed. An opening may be formed in the first layer of fabric to expose a conductive strand in the pocket. The shim may prevent the cutting tool from cutting all the way through to the second layer of fabric. After cutting the hole in the first layer of fabric, the shim may be removed and an electrical component may be soldered to the conductive strand in the pocket. A polymer material may be injected into the pocket to encapsulate the electrical component. The polymer material may interlock with the surrounding pocket walls.