H05K1/038

Prepreg, laminate, metal foil-clad laminate, circuit board and LED module

A laminate with superior thermal conductivity, heat resistance, drill workability, and fire retardancy is provided. In a prepreg obtained by impregnating a woven or nonwoven fabric base with a thermosetting resin composition, the thermosetting resin composition contains 80 to 200 parts by volume of an inorganic filler per 100 parts by volume of a thermosetting resin, the inorganic filler contains (A) gibbsite type aluminum hydroxide particles having an average particle diameter (D.sub.50) of 2 to 15 μm and (B) magnesium oxide having an average particle diameter (D.sub.50) of 0.5 to 15 μm, and a compounding ratio (volume ratio) of the gibbsite type aluminum hydroxide particles (A) to the magnesium oxide (B) is 1:0.3 to 3.

Garment integrated electrical interface system and method of manufacture

A system for electrically coupling a garment to a mating object and manufacture method thereof, the system comprising: a fabric interlayer of the garment including a set of ports; an electronics substrate having a first surface adjacent to a second side of the fabric interlayer and including a set of vias through a thickness of the electronics substrate, aligned with the set of ports, and a set of contacts at a second surface opposing the first surface; a mount assembly having a third surface adjacent to the second surface of the electronics substrate and including a set of holes aligned with the set of vias and the set of ports, as well as a set of openings that correspond to and receive portions of the set of contacts, and a fourth surface opposing the third surface and defining a cavity configured to receive and electrically interface the mating object to the electronics substrate; and a set of fasteners that 1) compress the backing plate, the fabric interlayer, the electronics substrate, and the mount assembly by way of the set of ports, the set of vias, and the set of holes in supporting a waterproof seal, and 2) electrically couple the set of embedded ports to the set of vias.

THERMAL SUBSTRATE WITH HIGH-RESISTANCE MAGNIFICATION AND POSITIVE TEMPERATURE COEFFICIENT INK
20220267633 · 2022-08-25 ·

An article comprising a heater that comprises a high-resistance magnification (HRM) PTC ink deposited on a flexible substrate to form one or more resistors. The HRM PTC ink has a resistance magnification of at least 20 in a temperature range of at least 20 degrees Celsius above a switching temperature of the ink, the resistance magnification being defined as a ratio between a resistance of the double-resin ink at a temperature ‘T’ and a resistance of the double-resin ink at 25 degrees Celsius.

Connecting an Electronic Component to an Interactive Textile

This document describes techniques and apparatuses for connecting an electronic component to an interactive textile. Loose conductive threads of the interactive textile are collected and organized into a ribbon with a pitch that matches a corresponding pitch of connection points of the electronic component. Next, non-conductive material of the conductive threads of the ribbon are stripped to expose the conductive wires of the conductive threads. After stripping the non-conductive material from the conductive threads of the ribbon, the connection points of the electronic component are bonded to the conductive wires of the ribbon. The conductive threads proximate the ribbon are then sealed using a UV-curable or heat-curable epoxy, and the electronic component and the ribbon are encapsulated to the interactive textile with a water-resistant material, such as plastic or polymer.

Wiring board and method of manufacturing same
09814137 · 2017-11-07 · ·

A wiring board is provided with: an insulating layer; a base electrode layer layered on one primary surface of the insulating layer in predetermined regions; an insulating covering layer layered on one primary surface of the insulating layer in a state covering parts of edges of the base electrode layer; and a surface electrode layer plated on exposed portions of the base electrode layer not covered by the insulating covering layer, the thickness of covered portions of the base electrode layer covered by the insulating covering layer being less than the thickness of the exposed portions. The surface electrode layer is formed only on the exposed portions of the base electrode layer.

Method and apparatus for attaching chip to a textile
09758907 · 2017-09-12 · ·

Embodiments disclosed herein provide approaches for attaching scan control and other electronic chips to textiles, e.g., on a loom as part of a real-time manufacturing process.

TRIBOELECTRIC ENERGY GENERATION METHODS AND ARTICLES
20220239236 · 2022-07-28 ·

Described herein are triboelectric energy generators that generally include a first flexible layer having a first electron donating material coated on at least a first surface and an electron accepting material coated over the first electron donating material, and a second flexible layer having a second electron donating material coated on at least a first surface. The first and second layers are positioned adjacent each other with their first surfaces facing inward toward each other and separated by a gap distance. An electric potential is generated upon movement between the first and second flexible layers, such as at least alternating contact and no-contact between the first and second flexible layers. The electron donating material may be provided by a particle-free conductive ink.

SYSTEM FOR TRANSMITTING ELECTRICAL SIGNALS
20210410281 · 2021-12-30 · ·

A flexible and/or stretchable structural system for transmitting electrical signal between first and second rigid portions comprises a body structure and said first and second portions arranged to said body structure. The modulus of elasticity of said first portion is lower than the corresponding modulus of elasticity of said second portion. In addition the modulus of elasticity of said body structure is lower than the corresponding modulus of elasticity of said second portion. The system comprises also an interface portion, such as e.g. an electrically conducting fabric, textile or knit, which is arranged to said body structure and between said first and second portions. The interface portion electrically connects said first and second portions. The modulus of elasticity of said interface portion is lower than the corresponding modulus of elasticity of said second portion.

CORE-SHELL STRUCTURED FIBER TYPE STRAIN SENSOR AND METHOD OF MANUFACTURING THE SAME
20210404892 · 2021-12-30 ·

The core-shell structured fiber-type strain sensor of the present disclosure, which includes a fibrous support forming a core and a multilayered shell layer formed on the fibrous support, exhibits improved strength and stiffness due to the core fiber, exhibits improved noise level due to an elastomer layer and allows manufacturing of a fiber-type sensor with improved linearity of measurement signals due to a sandwich-structured conductive layer, is advantageous in that stable strain measurement is possible without acting as a defect in a composite structure.

ELECTRONIC TEXTILES
20220225691 · 2022-07-21 ·

Aspects of the present disclosure generally relate to electronic textiles and more specifically to self-sustaining, interactive electronic textiles, to systems incorporating such electronic textiles, and to uses thereof. In an embodiment, a system to assist with an intended motion of a user is provided. The system includes one or more processors, and an electronic textile. The electronic textile includes a textile substrate, an actuator coupled to the textile substrate, a sensor coupled to the textile substrate, and a battery coupled to the textile substrate, the battery electrically coupled to a conductive yarn, the conductive yarn further electrically coupled to the actuator and the sensor. Embodiments also include a system to assist with blood circulation of a user and a method of assisting blood circulation of a user.