The present disclosure generally relates to a multi-layer printed circuit board. The multi-layer printed circuit board may include a core layer and a first prepreg layer adjacent the core layer. The core layer may include a first biodegradable material sandwiched between two electrically conducting layers. A method for forming a multi-layer printed circuit board is also provided herein.

A cellulosic substrate-based device is described, including a cellulosic substrate comprising a functionalized surface covalently functionalized by a chemical moiety in an amount sufficient to provide an omniphobic or hydrophobic surface; and a material printed on the functionalized surface, wherein the printed material has a line edge roughness of less than about 15 m and/or a line lateral resolution of less than about 50 m.

A printed graphene-based laminate for wireless wearable communications can be processed at low temperature so that it is compatible with heat-sensitive flexible materials like papers and textiles. The printed graphene-based laminate is of high conductivity, high flexibility, light weight and low cost, making it perfect candidate for wireless wearable devices. As a proof of concept, printed graphene-based laminate enabled transmission lines (TLs) and antennas were designed, fabricated and characterized. To explore its potentials in wearable communications applications, mechanically flexible transmission lines and antennas under various bended cases were experimentally studied. The measurement results demonstrate that the printed graphene laminate can be used for RF signal transmitting, radiating and receiving, which represents some of the essential functionalities of RF signal processing in wireless wearable communications systems. This work brings a step closer the prospect to implement all graphene enabled wireless wearable communications systems in the near future.

The present invention relates to an electrically conductive paper structure and a method for its production, as well as the use of the electrically conductive paper structure, for example as a heating element.

A plastic-cladding filament structure includes a combined arrangement of a thermoplastic elastomer and at least one conductive filament. The thermoplastic elastomer includes a rigid chain segment and a flexible chain segment. The at least one conductive filament is enclosed and housed in the thermoplastic elastomer so that the conductive filament may be attachable, through heating, melting, and bonding of the thermoplastic elastomer, in which through the property that the thermoplastic elastomer is solid in room temperature and gets melted to become liquid when heated to a predetermined temperature and gets solidified and bonded after being cooled, the thermoplastic elastomer that encloses and houses the conductive filament is allowed to attached to a fabric article or a base layer through solidification and bonding resulting from cooling, thereby improving utilization thereof.

Film for use in preparing a printed circuit board (PCB) along with methods for making a PCB and producing a printable film are described herein. The film includes a first layer formed of a radiation-transparent material, a second layer formed of a curable adhesive material, a third layer formed of an electrically conductive material, and optionally, a fourth layer formed of an adhesive and a fifth layer formed of a removable material. Through the adhesive layers, the layers are bonded together to produce the printable film. To produce a PCB, the first layer is covered in ink distributed in a pattern representing the PCB, and the ink-covered film is exposed to radiation until the non-ink-covered portions of the second layer have cured. Then, the fifth layer is removed tearing away the electrically conductive material associated with the non-ink-covered portions of the second layer producing the PCB.

The method for producing a electroconductive sheet having a substrate, in particular made of paper, and an electroconductive layer include the steps of: a/ preparing a multi-layer structure with an anti-adhesive coating inserted between a plastic film and a base layer, b/ cross-laminating the multi-layer structure and the substrate, and c/ removing the plastic film and the anti-adhesive coating from the base layer. The base layer is a layer of an electroconductive material or is covered with an electroconductive layer by an additional step consisting of: d1/ depositing an electroconductive film on the base layer; or d2/ printing the base layer with at least one ink having electrical properties, with the base layer being a printable layer with a binder base of which the rate is 15% greater in dry weight in relation to the total dry matter weight of this layer.

Disclosed are an insulating material (high-k layer) which includes a fiber assembly mainly composed of a cellulose nanofiber, and an electroconductive metal material supported by the fiber assembly; and a passive element (capacitor) which includes a high-k layer which is composed of the insulating material, and an electroconductive part stacked on the high-k layer.

A disclosed circuit arrangement includes a substrate, an integrated circuit (IC) component attached to the substrate, first and second cross wires attached to the substrate and disposed proximate the electronic device, and one or more wire segments attached to the substrate. The one or more wire segments have first and second portions attached at a third portion of the first cross wire and at a fourth portion of the second cross wire, respectively. The first and second cross wires and the one or more wire segments are round wires having round cross sections. The first portion and the third portion have flat areas of contact, and the second and fourth portions have flat areas of contact. A first bond wire is connected to the electronic device and to the first portion of the one or more wire segments, and a second bond wire is connected to the electronic device and to the second portion of the one or more wire segments.

A mass produced identifier providing device with sufficiently high yield, even when forming a conductive layer pattern having an extremely small thickness/minimum area using a minimum amount of silver paste. The identifier-providing device has a conductive layer pattern formed on a rear surface of a base material as an insulator. The silver paste forming the conductive layer pattern contains only silver flakes, as silver particles, that have a particle size in a range of 3.0 to 5.0 m and that has a thickness of 100 nm at a largest thickness portion, while having a thickness of 50 nm at a smallest thickness portion. The conductive layer pattern is formed to have a film thickness of 10 m or less by laminating the silver flakes in the thickness direction. The silver flakes forming the conductive layer are in a fused state or an aggregating/cohering state at the smallest thickness portion.