Patent classifications
H05K1/0386
CAPACITIVE TOUCH DEVICE
A method of assembling a capacitive touch device is disclosed. The method comprises providing a flexible sheet having first and second faces and first and second wings divided by a fold line. The flexible sheet supports capacitive touch switches, contact lands and conductive tracks interconnecting the capacitive touch switches and the contact lands on the first face of the flexible sheet. The method comprises providing adhesive on the first face of the flexible sheet so as to bond the first and second wings and to bond a circuit board to flexible sheet. The method comprises placing a circuit board on the flexible sheet, the circuit board having contact pads which are aligned with the contact lands and folding the flexible sheet along the fold line so as to bond the first and second wings with the circuit board interposed between the first and second wings.
Method for forming thin film conductors on a substrate
A method for forming thin film conductors is disclosed. A thin film precursor material is initially deposited onto a porous substrate. The thin film precursor material is then irradiated with a light pulse in order to transform the thin film precursor material to a thin film such that the thin film is more electrically conductive than the thin film precursor material. Finally, compressive stress is applied to the thin film and the porous substrate to further increase the thin film's electrical conductivity.
Monitoring circuitry
In an example, monitoring circuitry includes a first and second coupling, at least one of which is to capacitively couple the monitoring circuitry to a monitored circuit on a product packaging. The monitored circuit has a resistance which is indicative of a status of a product stored in the product packaging, and the monitored circuit is to be connected in series between the first coupling and the second coupling. The monitoring apparatus may determine the resistance of the monitored circuit via the first and second couplings.
Printing of nanowire films
Provided is a novel printing process for fabricating metallic, conductive and transparent ultra-thin nanowires and patterns including same on a substrate. The process includes two different controllable steps, each designed to achieving a useful and efficient pattern.
Security wrap with tearable substrate
An electronic device is protected from unauthorized access by use of a security wrap having a security screen connected to an alarm circuit of the electronic device. The security screen has a pair of screen terminals interconnected by a conductor. The conductor is formed on a substrate. The substrate is arranged such that attempts to remove the security wrap will result in the substrate being torn and the conductor being damaged or broken whereby the resistance of the conductive path formed by the conductor changes to indicate an alarm condition.
PRINTED WIRING BOARD AND METHOD OF PRODUCING THE SAME
An ink layer of an electrically conductive ink is formed on a sheet-like base and then the base is bent-deformed before the ink layer is cured, followed by curing the ink layer, thereby forming wiring. The ink layer is pliable during the bending deformation of the base, preventing breakage of the ink layer associated with the bending deformation of the base, and preventing damage to the wiring even when the wiring is finely formed.
Integrated electrical component within laminate
A laminate having an integrated electrical component disposed within the laminate is disclosed. The laminate includes a first paper layer having at least first and second vias through the first paper layer; a first electrically-conductive layer, comprising an electrically-conductive material, disposed over a portion of the first paper layer; a second electrically-conductive layer, comprising the electrically-conductive material, disposed over another portion of the first paper layer; an electrical component disposed over the first and second electrically-conductive layers; and an insulating layer disposed over the electrical component. The first paper layer and the insulating layer encapsulate the first electrically-conductive layer, the second electrically-conductive layer, and the electrical component. The first and second vias are in electrical contact with the first electrically-conductive layer and a first terminal of the electrical component, and with the second electrically-conductive layer and a second terminal of the electrical component, respectively.
METHOD AND DEVICE FOR CREATING AT LEAST A PART OF ELECTRONIC CIRCUIT, AND ELECTRONIC CIRCUIT
Method of creating at least a part of an electronic circuit, comprising the steps of providing at least one carbonizable substrate, in particular a cellulose based substrate, and position-selectively irradiating at least one part of the substrate to a temperature exceeding the carbonization temperature of said substrate, such that the irradiated part of the substrate is carbonized to form at least one electrically conductive track and/or pad; and device comprising: at least one irradiation source, in particular a laser, such as a CO2 laser, being configured to position-selectively irradiate at least one part of a carbonizable substrate to a temperature exceeding the carbonization temperature of said substrate, such that the irradiated part of the substrate is carbonized to form at least one electrically conductive track and/or pad.
METHOD AND SYSTEM FOR FABRICATING FLEXIBLE ELECTRONICS
A method of fabricating at least one electronic circuit component comprises: patterning a conductive material on a fibrous substrate by aerosol jet printing in a pattern corresponding to said at least one electronic circuit component; and sintering the conductive material by hot air sintering. The fibrous substrate may be paper, for example cellulose fibre paper.
FUNCTIONAL PAPER FOR ELECTRONICS PRINTING AND METHODS OF MAKING
Provided herein is an uncoated functional paper formed from a slurry comprising about 10 wt % to 90 wt % cellulosic fibers and about 1% to 25% sizing solution per total weight of the fibers. The sizing solution can be applied during papermaking and/or applied in a size press or coater. The paper can be calendered at a temperature greater than 50° C. Methods of making are also provided. Also provided are flexible electronics including a functional paper substrate printed with a conductive ink.