Provided is a novel printing process for fabricating metallic, conductive and transparent ultra-thin nanowires and patterns including same on a substrate. The process includes two different controllable steps, each designed to achieving a useful and efficient pattern.

A mass produced electrically conductive device with sufficiently high yield, even when forming a conductive layer pattern having an extremely small thickness/minimum area using a minimum amount of silver paste. The identifier-providing device has a conductive layer pattern formed on a rear surface of a base material as an insulator. The silver paste forming the conductive layer pattern contains only silver flakes, as silver particles, that have a particle size in a range of 3.0 to 5.0 m and that has a thickness of 100 nm at a largest thickness portion, while having a thickness of 50 nm at a smallest thickness portion. The conductive layer pattern is formed to have a film thickness of 10 m or less by laminating the silver flakes in the thickness direction. The silver flakes forming the conductive layer are in a fused state or an aggregating/cohering state at the smallest thickness portion.

In an example, monitoring circuitry (307) includes a first ( ) and second (502) coupling, at least one of which is to capacitively couple the monitoring circuitry to a monitored circuit on a product packaging (101). The monitored circuit has a resistance which is indicative of a status of a product (702) stored in the product packaging, and the monitored circuit is to be connected in series between the first coupling and the second coupling. The monitoring apparatus (300) may determine the resistance of the monitored circuit via the first and second couplings.

The invention provides transient printed circuit board devices, including active and passive devices that electrically and/or physically transform upon application of at least one internal and/or external stimulus.

Graphene ink compositions comprising nitrocellulose and related methods of use comprising either thermal or photonic annealing.

An LED light source module comprises a double-sided circuit board and two rivets electrically connected to both sides of the double-sided circuit board. The rivet includes a nail head, a shank, and a transition section connecting the nail head and the shank. The length of the nail head in a section along the thickness direction of the circuit substrate is greater than the width of the shank, and the transition section is a trapezoid. The short side of the trapezoid is connected to the shank, and the length of the long side of the trapezoid is smaller than the length of the nail head. The nail head is connected to the first wiring layout, and the shank is electrically connected to the second wire pattern by soldering tin. The first and second wiring layouts are electrically connected by the rivet, and the copper plating process with more serious pollution is not used, thereby reducing the cost of pollution control, and the circuit substrate of the lower-level material can be used, and further the competitiveness of the lamp having the LED light source module can be improved.

Method for manufacturing a furniture or construction element (1), comprising the steps of providing a workpiece (2), which preferably consists at least in part of wood, wood material, plastic or the like, applying a coating material (4) to at least a portion of the surface of the workpiece (2), and providing at least one electronic component (10, 10) on the coating material (4), characterised in that at least one electronic component (10, 10) is printed at least in part onto the coating material (4).

A laminate contains conductive circuit patterns, a substrate material, and an adhesive pattern or other bond. Each conductive circuit pattern and the substrate material are interconnected by the adhesive pattern or other bond, having its size and shape substantially matching the main outlines of each conductive circuit pattern. Each conductive circuit pattern has thin lines and thin interline spaces, patterned on top of the adhesive pattern or other bond by a removal of conductive material, such that the circuit pattern's thin interline spaces may have residues of the adhesive patterns or other bond. Outside the conductive circuit patterns' main outlines, the substrate material is substantially void of an adhesive or other bond, with the exception of edge areas of the main outlines.

An ink layer of an electrically conductive ink is formed on a sheet-like base and then the base is bent-deformed before the ink layer is cured, followed by curing the ink layer, thereby forming wiring. The ink layer is pliable during the bending deformation of the base, preventing breakage of the ink layer associated with the bending deformation of the base, and preventing damage to the wiring even when the wiring is finely formed.

Electronic stickers may be manufactured on flexible substrates as layers and packaged together. The package may then have an adhesive applied to one side to provide capability for sticking the electronic devices to surfaces. The stickers can be wrappable, placed on surfaces, glued on walls or mirrors or wood or stone, and have electronics which may or may not be ultrathin. Packaging for the electronic sticker can use polymer on cellulose manufacturing and/or three dimensional (3-D) printing. The electronic stickers may provide lighting capability, sensing capability, and/or recharging capabilities.