A polymer film is provided, the polymer film comprises a liquid crystal polymer, comprising a soluble liquid crystal polymer and an insoluble liquid crystal polymer; and a polyimide polymer, accounting for 5 wt % or more of the polymer film. A method for manufacturing the polymer film is also provided, the method for manufacturing the polymer film comprises steps: providing a liquid crystal polymer powder, a particle size of the liquid crystal polymer powder is 0.1 um to 20 um; providing a liquid crystal polymer glue, a solid content of which is greater than 3 wt %; providing a polyamic acid glue; mixing the liquid crystal polymer powder, the liquid crystal polymer glue and the polyamic acid glue into a mixed solution, the mixed solution is made into a gel film, and the gel film is baked at a temperature of 300° C. to form a polymer film.

A number of user interface devices are described. In one example, a user interface device includes a lens having a graphic visible through the lens, a transparent circuit film comprising a top surface and a bottom surface, a reflector film bonded to the bottom surface of the transparent circuit film, the reflector film including an embossed area which defines a pocket between the reflector film and the bottom surface of the transparent circuit film, a light emitting diode (LED) bonded to the bottom surface of the transparent circuit film and positioned within the pocket between the reflector film and the bottom surface of the transparent circuit film, and a layer of transparent pressure-sensitive adhesive interposed between the bottom surface of the lens and the top surface of the transparent circuit film.

An electronic component (1) is connected to a conductive track (2) on a flexible substrate (3). A connection layer (4) of a composition comprising a thermoplastic material (TPM1) is provided on the conductive track (2). The connection layer (4) has at least one cutout (5) aligned to overlap the conductive track (2). A thermosetting material (TSM1) in liquid state is used to fill the cutout (5). The electronic component (1) is provided on top of the connection layer (4). By applying heat, a temperature of the connection layer (4) is raised to above a softening temperature of the thermoplastic material (TPM1). Pressure is applied to form a mechanical connection. By the application of heat (H) a temperature of the thermosetting material (TSM1) is raised above its thermosetting temperature for olidifying the thermosetting material (TSM1) and forming an electrical connection (E).

The present invention discloses a method for manufacturing a multi-layer flexible circuit board, comprising the steps of: (1) manufacturing a double-sided FPC flexible board; (2) manufacturing a novel material layer structure; (3) hot pressing at least one group of upeer novel material layer structures on the circuits on the upper and/or lower surfaces of the double-sided FPC flexible board; forming a protective layer on the circuits of an outermost novel material layer structure and/or on exposed circuits of the double-sided FPC flexible board so as to obtain a multi-layer flexible circuit board. The present invention also discloses a multi-layer flexible circuit board manufactured by performing the above-mentioned method. The manufacturing process of the present invention is simplified, convenient and efficient; the multi-layer flexible circuit board not only greatly simplifies the novel material layer structure and reduces the overall thickness, but also has the function of high-speed transmission of high-frequency signals, especially suitable for new 5G technology products. It can protect and resist the migration of copper ions when it is energized between circuits so as to ensure the safety and normal operation of circuits.

Described herein are methods for forming resistive heaters and force sensing elements on a flexible substrate, and devices that include these elements to provide a force responsive conductive heater, such as a seat heater in a vehicle. The methods include printing a conductive ink on a flexible substrate that is heated to 30° C. to 90° C. before and/or during the printing process and curing the substrate to produce a conductive pattern thereon. The conductive inks generally include a particle-free metal-complex composition formulated from at least one metal complex and a solvent, and optionally, a conductive filler material.

A film for an electronic substrate according to an embodiment has a moisture-absorption rate of less than 0.3% of the initial weight when immersed in water for 24 hours, and thus is less susceptible than existing films for electronic substrates are to changes in dimension or degradation in electrical characteristics caused by containing moisture according to changes in temperature and humidity. Also, the film for an electronic substrate is equal or superior to existing films in terms of flexibility and physicochemical characteristics, and thus may be applied to the manufacture of laminates with a conductive film such as FCCL and electronic substrates such as FPCB to improve processability, durability, transmission capacity, etc.

The present disclosure relates to a substrate processing apparatus and a substrate processing method, for manufacturing a flexible circuit board, and more specifically, to a substrate processing apparatus and a substrate processing method, for manufacturing a flexible circuit board, capable of manufacturing a flexible circuit board with a fine line width without undergoing a photolithographic process using a mask.

The substrate processing apparatus and the substrate processing method, for manufacturing a flexible circuit board, according to the present disclosure, can efficiently manufacture a flexible circuit board having a fine line width at low costs.

A method of producing a functional vehicle component includes fixing a leather sheet over a surface of a vehicle component, applying a flexible electronic circuit to an A-surface of the leather sheet, and arranging a pigmented coating over the circuit. The pigmented coating inhibits or prevents the circuit from being visible through the pigmented coating. The method may include attaching an electronic element, such as a light source, a sensor, a wireless transmitter, or a switch, to the circuit. When the circuit includes a light source, the pigmented coating inhibits or prevents the light source from being visible through the pigmented coating, but light emitted by the light source is visible through the pigmented coating.

In an electronic device, a circuit board connects different systems or structures such that heat of a system with a relatively large amount of heat can be transferred to a position or a heat dissipation structure with a relatively small amount of heat, thereby mitigating local high temperatures in the electronic device and distributing heat more evenly throughout the electronic device.

An organic board of the present disclosure has a resin component comprising at least one resin selected from the group consisting of an epoxy resin, a polyimide resin, a phenolic resin, an amino resin, a polyester resin, a polyphenylene resin, a cyclic olefin resin, and a Teflon (registered trademark) resin as the main component, and a non-resin component including at least one of an inorganic filler and a flame retardant, in which the non-resin component is dispersed in the resin component, at least a part of the non-resin component is agglomerated to form an aggregate, a part of the resin component forms a resin material part having a particle shape, the resin material part exists within the aggregate, or the resin component forms a matrix phase surrounding the aggregate, and there are voids at some interfaces between the resin component and the aggregate.