H05K1/0393

Electrical devices with electrodes on softening polymers and methods of manufacturing thereof

Flexible electrical devices comprising electrode layers on softening polymers and methods of manufacturing such devices, including lift-off processes for forming electrodes on softening polymers, processes for forming devices with a patterned double softening polymer layer, and solder reflow processes for forming electrical contacts on softening polymers.

Stretchable wiring member
11596061 · 2023-02-28 · ·

In a stretchable wiring member having a relatively hard portion, such as a contact point, there is provided a solution to malfunction of the stretchable wiring member caused by stress generated at a boundary between the hard portion and a flexible portion. A stretchable wiring member includes a flexible substrate having stretchability, a stretchable wiring line disposed along the flexible substrate and configured to be stretched in association with stretching deformation of the flexible substrate, and a hard member that is harder than the flexible substrate. The flexible substrate has an extension layer portion interposed between the hard member and the stretchable wiring line.

Electronic module, electronic equipment, imaging sensor module, imaging apparatus, and display apparatus

An electronic module has a flexible wiring member, a wiring circuit board, and a conductive connection member. The flexible wiring member has a flexible base, a first wiring layer formed on at least one face of the flexible base, and a first electrode formed of the first wiring layer at the end part that is not covered by a first insulating layer. The wiring circuit board has a base provided with a wiring, a second insulating layer having opening formed on at least one face of the base, and a second electrode formed in the opening. The conductive connection member connects the first electrode and the second electrode to each other. The end of the flexible wiring member is arranged above the opening in plan view.

Method of manufacturing polyimide film
11596065 · 2023-02-28 · ·

Provided are a polyimide film capable of reducing a dielectric constant of a substrate and reducing a thickness and forming a stable via with a low possibility of disconnection, a method for manufacturing the same, and an FPCB including the same. A polyimide film according to an exemplary embodiment of the present invention includes a polyimide layer and a plurality of fluororesin particles dispersed in the polyimide layer. The fluororesin particles have a spherical or flat shape.

Flexible circuits for use with gaskets in electronic equipment and related systems and meters

Systems for reducing leakage at a pressure barrier in a gas meter, are provided including first and second gaskets; a flexible circuit having variable thicknesses, such that a thicker portion of the flexible circuit is provided between the first and second gaskets; and a mounting plate on the flexible circuit, the mounting plate compressing the flexible circuit between the first and second gaskets on a non-pressurized side of the pressure barrier of the gas meter. Related flexible circuits and gas meters are also provided.

Backlit user interface
11589456 · 2023-02-21 · ·

An user interface device includes a lens with a top surface and a bottom surface, where the bottom surface includes at least one graphic that is visible through the top surface of the lens. The user interface device further includes a transparent circuit film with a top surface and a bottom surface, at least one light emitting diode (LED), at least one silver conductor, and a layer of transparent pressure-sensitive adhesive that secures the bottom surface of the lens to the top surface of the transparent circuit film.

SPORTS RETRONIC WEARABLE TERMINAL
20220365556 · 2022-11-17 · ·

The present invention discloses an terminal worn by athletes. The terminal comprises an wrist sleeve portion formed of one or more layers, an plurality of input buttons disposed on its exterior surface and an plurality of smartphone and micro-components coupled to the one or more interior layers. The terminal comprises an display assembly disposed on a exterior layer of the wrist sleeve portion exterior surface configured to display one or more objects via an display. The terminal also comprises an flap assembly coupled to the display assembly, the flap assembly comprises an sack portion which hold an play-card or similar object and a pull-tab which allocates an user to separate the flap assembly from the display assembly. The current invention also discloses a method for determining an location of a object and executing an function of the object based upon an user interaction. The method consisting of moving an object from a first location to a second location and a input circuitry determining a row signal strength and a processor executing the object function on a second user interface based upon a second obtained signal strength.

Semi-flexible component carrier with stepped layer structure

A semi-flexible component carrier includes a stack having at least one electrically conductive layer structure and at least one electrically insulating layer structure. The layer structures are stacked on top of each other in a stacking direction s. A recess extends from a first main surface of the stack into the stack and extends only partially into one of the at least one electrically insulating layer structure so that an electrically insulating layer structure having a stepped portion is formed. The stepped portion provides a flexible region of the stack with respect to a rigid region of the stack.

Four Dimensional Printed Circuit Boards
20220369470 · 2022-11-17 ·

Described herein are ultra-thin nanocellulose flexible electronic device on which SU-8, an epoxy material which can become highly stressed upon UV exposure, is printed on desired areas. Upon UV exposure and then release from the surface it is anchored on, the nanocellulose device will spontaneously self-mold into a desired form due to stress differences between the SU-8 and the nanocellulose sheet. The flexible electronics can be manufactured using standard printed circuit board processing techniques, including electroless metallization and soldering of surface mount components.

Application specific electronics packaging systems, methods and devices
11503718 · 2022-11-15 · ·

Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel (68a, 68b) manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.