Sheet comprising a flexible support and a coating at least partially covering at least one face of the support, the support being made of a support material exhibiting dielectric properties, the coating being made of a coating material different from the support material and exhibiting magneto-dielectric properties or dielectric properties.

Embodiments include an electronic package that includes a radio frequency (RF) front end. In an embodiment, the RF front end may comprise a package substrate and a first die attached to a first surface of the package substrate. In an embodiment, the first die may include CMOS components. In an embodiment, the RF front end may further comprise a second die attached to the first surface of the package substrate. In an embodiment, the second die may comprise amplification circuitry. In an embodiment, the RF front end may further comprise an antenna attached to a second surface of the package substrate. In an embodiment, the second surface is opposite from the first surface.

A method for manufacturing a double-sided, single conductor laminate includes providing a laminated substrate that includes a conductive layer, an adhesive layer and a support layer; dry milling a trace pattern in the laminated substrate by removing selected areas of the conductive layer and the adhesive layer; and attaching a first cover layer using a first adhesive layer to the conductive layer. The first cover layer includes one or more precut access holes that align with one or more traces of the trace pattern.

Aspects of the present disclosure relate to an apparatus comprising: a substrate; communication circuitry deposited on said substrate; and ballot circuitry deposited on said substrate. The ballot circuitry comprises: a plurality of voting circuitry elements, each voting circuitry element being responsive to a voting operation to change a conductive state of that voting circuitry element; and logic circuitry communicatively coupled with each of the plurality of voting circuitry elements and with the communication circuitry. The logic circuitry is configured to: detect the conductive state of each of the plurality of voting circuitry elements; and transmit, via the communication circuitry and based on the conductive state of each of the plurality of voting circuitry elements, a voting result.

Various embodiments of the disclosure relate to a printed circuit for transmitting a signal in a high-frequency band and an electronic device including the same. The printed circuit board may include a flexible circuit board configured to transmit a signal in a high-frequency band, and the flexible circuit board may include: first multiple layers including a power line configured to transmit power; and second multiple layers stacked in a first direction of the first multiple layers and including a first signal line and a second signal line configured to transmit a signal in the high-frequency band. The first multiple layers may include a first punched region in which at least a portion overlapping the first signal line and the second signal line is removed, the second multiple layers may include a second punched region in which at least a portion overlapping the power line is removed, and at least a portion of the second punched region and the first punched region overlap each other forming a slit penetrating the flexible circuit board in the first direction.

A reel-to-reel method to laser-ablate a circuitry pattern on the fly in a reel-to-reel machine as part of a process to fabricate a printed flexible circuit. The laser ablation method includes using an appropriate laser to irradiate a metal sheet thus ablating the edges of an intended circuitry pattern. Slugs can be removed by using an optional sacrificial liner, and the slugs can be optionally ablated into smaller parts first. The laser ablation can also include an optional method of creating tie bars to provide structural support to the web of circuitry patterns.

A system for manufacturing a printed circuit board includes a coverlay supply apparatus configured to supply a coverlay; a printed circuit board supply apparatus configured to supply a printed circuit board; and a pre-bonding apparatus configured to pre-bond the coverlay supplied from the coverlay supply apparatus onto the printed circuit board supplied from the printed circuit board supply apparatus, thereby discharging a first composite board.

A printed circuit board and an antenna module including the same are provided. The printed circuit board includes a core layer; a first build-up structure disposed on an upper side of the core layer, including first insulating layers and first bonding layers, alternately stacked, and further including first wiring layers disposed on upper surfaces of the first insulating layers, respectively, and embedded in the first bonding layers, respectively; and a second build-up structure disposed on a lower side of the core layer, including second insulating layers and second bonding layers, alternately stacked, and further including second wiring layers disposed on lower surfaces of the second insulating layers, respectively, and embedded in the second bonding layers, respectively. The printed circuit board has a through-portion penetrating through the core layer and the second build-up structure, and has a region in which the through-portion is disposed as a flexible region.

A film for an electronic board, according to one embodiment, has a low dielectric constant of 2.9 or lower at a frequency of 10-40 GHz, and thus can cause the signal transmission rate for a high frequency use, such as fifth generation (5G) mobile communication, to be superior to that of a conventional film for an electronic board. In addition, the film for an electronic board has flexibility and physicochemical characteristics that are greater than or equal to those of a conventional film, so as to be applicable to the manufacture of a laminate of a conductive film such as FCCL and an electronic board such as a FPCB, thereby enabling processability, durability, transmission capacity and the like to be improved.

Provided is a roll-to-roll copper foil laminating device. The device comprises a dry film holder shaft, a copper foil holder shaft, and a dry film roll connected to the dry film holder shaft; an outer surface of the copper foil frame shaft is wound with a copper foil roll. Before the dry film roll contacts a diffuser roller, the dry film roll goes through an EPC correction structure and remain in a state of active bonding; the distance from the dry film roll to the diffuser roller is 1.5 times a distance from the copper foil roll to the diffuser roller; a rotation axis of the dry film holder shaft and a rotation axis of the copper foil holder shaft move synchronously with an outer spin column.