A circuit board including an adhesive part, a ceramic board part with the adhesive part, and a printed circuit board part with the adhesive part. The ceramic board and printed circuit board parts are made of different materials. The adhesive part includes: an adhesive layer including an adhesive material, an adhesive part opening, and a conductive paste filled in an inside of the adhesive part opening.

A method including providing a ceramic board part, providing a printed circuit board part, and producing an adhesive part. Batch-bonding the printed circuit board part, the adhesive part, and the ceramic board part with one another. Producing the adhesive part includes: bonding a protection layer on two surfaces of an adhesive layer, forming an adhesive part opening penetrating the adhesive layer and the protection layer, filling the adhesive part opening with a conductive paste, and removing the protection layer.

Disclosed are a method of directly patterning a stretchable substrate; and a stretchable electrode fabricated by the method. More particularly, the method of directly patterning a stretchable substrate includes: forming a hydrophilic group on a surface of a stretchable substrate by UV-ozone treatment; forming at least one layer to be etched on the hydrophilic group-formed stretchable substrate, wherein the at least one layer to be etched includes an adhesion enhancing material; forming a photoresist layer on the at least one layer to be etched; exposing the photoresist layer; and patterning the at least one layer to be etched using the exposed photoresist layer, wherein a carbon chain included in the adhesion enhancing material forms ether bonding (R—O—R) with a hydrophilic group formed on the surface of the stretchable substrate.

There is disclosed a transferable composition being applicable to a membrane serving to transfer a pattern of the composition to an intended substrate. The transferable composition comprises a swellable polymer swelled by a swelling agent and particles dispersed therein. Methods of preparing the composition, applying it to a transfer membrane as a pattern, and transferring the pattern to a substrate, as well as articles made thereby, are also provided. The transferred patterns may serve a decorative and/or functional purpose and the transferable compositions may accordingly include decorative and/or functional particles. When the functional particles are or can be rendered electrically conductive, a pattern formed therewith can be part of a conductive circuit and can serve, for example, for the manufacturing of a solar cell.

Systems and methods of additively manufacturing passive electronic components are provided. An additive manufacturing device may deposit a material to create a passive electronic component. A sensor may continuously measure an electrical property of the passive electronic component across two electrical contacts as the material is deposited during manufacturing. The sensor may transmit the measured electrical property to a processor whereby the processor may adjust a material deposition rate of the additive manufacturing device. The continuous measurement of the electrical property and adjustment of the material deposition rate as the passive electronic component is produced allows for passive electronic components to be manufactured to a high degree of accuracy of the electrical property.

Water-based nanoparticle inks may be formulated to be compatible with printed electronic direct-write methods. The water-based nanoparticle inks may include a functional material (nanoparticle) in combination with an appropriate solvent system. A method may include dispersing nanoparticles in a solvent and printing a circuit in an aerosol jet process or plasma jet process.

Provided are: a novel wiring board having flexibility derived from a resin board and the high electrical conductivity derived from a metal wiring as well as high adhesion between the metal wiring and the insulating resin board; and a method for manufacturing the wiring board without using a photolithography process. A wiring board according to the present invention comprises a resin board and a metal wiring, the metal wiring including a sintered body of metal particles, the sintered body including a plurality of voids having opening portions extending toward the resin board, parts of the resin board entering the voids from the opening portions.

The invention relates to a medical device comprising a printable electrical component (1), the printable electrical component (1) comprising a plastic substrate (L1) wherein at least electrical component (E) is applied to the plastic substrate, wherein the electrical component (E) comprises a dried conductive ink, wherein the plastic substrate is selected from the group comprising polycarbonate, cycloolefin copolymers, polymethylacrylate, polypropylene and wherein the dried conductive ink comprise silver and/or gold, wherein the electrical component (E) comprises feather-like and/or meander-like and/or spiral-shaped sections, whereby the medical device further comprises a fluid line, wherein the printable electrical component is located on the outside of the fluid line. The invention also relates to a medical device comprising a printable electrical component (1) the printable electrical component (1) comprising a plastic substrate (L1), wherein at least one electrical component (E) is applied to the plastic substrate, wherein the electrical component (E) comprises a dried conductive ink, wherein the plastic substrate is selected from a group comprising polycarbonate, cycloolefin copolymers, polymethyl-methacrylate, polypropylene and wherein the dried, conductive ink comprises silver and/or gold, wherein the electrical component (E) comprises at least one conductor section or at least two electrodes, characterized in that the electrical component (E) is part of an expansion sensor and/or a pressure sensor and/or a thermal flow sensor.

Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel (68a, 68b) manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.

Provided is a composition having moderate viscosity for coating properties and ejection properties, being applicable for firing at low temperatures, and leaving an extremely small amount of ash after firing. The composition of the present disclosure contains a miscible material of a compound represented by Formula (1) below and a compound (A) represented by Formula (A) below. In Formula (1) below, R.sup.1 represents a linear aliphatic hydrocarbon group having from 10 to 25 carbons; R.sup.2 and R.sup.3 are identical or different and represent an aliphatic hydrocarbon group having 2, 4, 6, or 8 carbons; R.sup.4 represents an aliphatic hydrocarbon group having from 1 to 8 carbons; R.sup.5 and R.sup.6 are identical or different and represent an aliphatic hydrocarbon group having from 1 to 3 carbons or a hydroxyalkyl ether group; and L.sup.1 to L.sup.3 represent an amide bond. In Formula (A) below, in the formula, R.sup.a and R.sup.c are identical or different and represent a hydrogen atom or an aliphatic hydrocarbon group that has from 1 to 12 carbons and may have a substituent; R.sup.b represents an aliphatic hydrocarbon group that has from 1 to 12 carbons and may have a substituent; and the substituents are each an amino group and/or a hydroxyl group.

There is provided a method of forming a thin film-based microfluidic electronic device. The method includes: providing a first elastomeric thin film layer on a substrate; depositing a first elastomer on the first elastomeric thin film by direct ink writing to form an elastomeric structure configured to define a microfluidic channel on the first elastomeric thin film layer; providing a second elastomeric thin film layer over the elastomeric structure to cover the microfluidic channel; providing a sacrificial layer on the second elastomeric thin film; depositing liquid metal into the microfluidic channel to form a conductor in the microfluidic channel; and electrically connecting the conductor to an electronic component. The thin film-based microfluidic electronic device is a tissue or skin adhesive sensor including a skin adhesive acoustic device.