A method is disclosed for applying an electrical conductor to a solar cell, which comprises providing a flexible membrane with a pattern of groove formed on a first surface thereof, and loading the grooves with a composition comprising conductive particles. The composition is, or may be made, electrically conductive. Once the membrane is loaded, the grooved first surface of the membrane is brought into contact with a front or/and back of a solar cell. A pressure is then applied between the solar cell and the membrane(s) so that the composition loaded to the grooves adheres to the solar cell. The membrane(s) and the solar cell are separated and the composition in the groove is left on the solar cell surface. The electrically conductive particles in the composition are then sintered or otherwise fused to form a pattern of electrical conductor on the solar cell, the pattern corresponding to the pattern formed in the membrane(s).

A circuit board is formed from a catalytic laminate having a resin rich surface with catalytic particles dispersed below a surface exclusion depth. Trace channels and apertures are formed into the catalytic laminate, electroless plated with a metal such as copper, filled with a conductive paste containing metallic particles, which are then melted to form traces. In a variation, multiple circuit board layers have channels formed into the surface below the exclusion depth, apertures formed, are electroless plated, and the channels and apertures filled with metal particles. Several such catalytic laminate layers are placed together and pressed together under elevated temperature until the catalytic laminate layers laminate together and metal particles form into traces for a multi-layer circuit board.

A moldable interconnect device for providing an electrical connection between two or more opposing arrays of contacts for establishing an electrical circuit. The moldable interconnect device having an insulting substrate and an array of conductive elements held in the insulating substrate, the conductive elements are made of an elastomeric conductive composite. The composite having a polymeric matrix comprising a crosslinked polymer. The polymer having a curing agent for catalyzing crosslinking of the polymer matrix and conductive metal particles and non-conductive compressible rubber particles dispersed with the polymer matrix. The non-conductive compressible rubber particles having a greater compressibility than the elastomeric conductive composite that is the same as the elastomeric conductive composite but free of non-conductive compressible rubber particles.

Described herein are methods for forming resistive heaters and force sensing elements on a flexible substrate, and devices that include these elements to provide a force responsive conductive heater, such as a seat heater in a vehicle. The methods include printing a conductive ink on a flexible substrate that is heated to 30° C. to 90° C. before and/or during the printing process and curing the substrate to produce a conductive pattern thereon. The conductive inks generally include a particle-free metal-complex composition formulated from at least one metal complex and a solvent, and optionally, a conductive filler material.

Printed circuit boards may be formed using ceramic substrates with high thermal conductivity to facilitate heat dissipation. Metal nanoparticles, such as copper nanoparticles, may be used to form conductive traces and fill through-plane vias upon the ceramic substrates. Multi-layer printed circuit boards may comprise two or more ceramic substrates adhered together, wherein each ceramic substrate has one or more conductive traces defined thereon and the one or more conductive traces are formed through consolidation of metal nanoparticles. The one or more conductive traces in a first ceramic substrate layer are in electrical communication with at least one second ceramic substrate layer adjacent thereto.

Provided is a long laminate for a printed wiring board, which has reduced thickness of a resin layer and increased signal transmission speed, and which, while being excellent in dimensional stability and folding endurance, has no wrinkles in a fluororesin layer. The long laminate contains a metal layer of a long metal foil, a fluororesin layer containing a fluororesin and contacting the metal layer, and a heat-resistant resin layer containing a heat-resistant resin and contacting the fluororesin layer. Each fluororesin layer is 1 to 10 μm thick. The ratio of the total thickness of the fluororesin layer to the total thickness of the heat-resistant resin layer is 0.3 to 3.0. The sum of the total thickness of the fluororesin layer and the total thickness of the heat-resistant resin layer is at most 50 μm. Also provided are a method for producing the long laminate, and the printed wiring board.

Provided is a copper-based paste capable of bonding a chip component and a substrate more firmly and obtaining a copper-based bonding material having high thermal conductivity. This copper oxide paste includes copper-containing particles, a binder resin, and an organic solvent. The copper-containing particles contain Cu.sub.2O and CuO. The total amount of copper element constituting Cu.sub.2O and copper element constituting CuO is 90% or more of the copper element contained in the copper-containing particles. The copper-containing particles have a 50% cumulative particle size (D.sub.50) of 0.20-5.0 μm inclusive; the 50% cumulative particle size (D.sub.50) and the 10% cumulative particle size (D.sub.10) satisfy 1.3≤D.sub.50/D.sub.10≤4.9; the 50% cumulative particle size (D.sub.50) and the 90% cumulative particle size (D.sub.90) satisfy 1.2≤D.sub.90/D.sub.50≤3.7, and the BET specific surface area of the copper-containing particles is 1.0 m.sup.2/g to 8.0 m.sup.2/g inclusive.

A resin flux solder paste includes a solder powder, and a flux, in which the flux contains at least an epoxy resin, a curing agent, a curing accelerator, and an activator, the epoxy resin contains 10% to 90% by weight of one or more of a biphenyl aralkyl type epoxy resin, a naphthalene type epoxy resin, and a dicyclopentadiene type epoxy resin, having an epoxy equivalent of 200 to 400, with respect to a total amount of the epoxy resin, and the curing agent contains 30% to 95% by weight of a biphenyl aralkyl phenol resin having a hydroxyl group equivalent of 150 to 350 with respect to a total amount of the curing agent, and 5% to 70% by weight of a phenol novolac resin having an allyl group having a hydroxyl group equivalent of 100 to 200 with respect to the total amount of the curing agent.

A squeegee drip collection system is configured to receive assembly material from at least one squeegee blade of the print head assembly. The squeegee drip collection system includes a paste shield coupled to the print head gantry and configured to be moved between a retracted position in which the paste shield is spaced from the at least one squeegee blade and an extended position in which the paste shield is positioned under the at least one squeegee blade. The squeegee drip collection system further includes a paste shield removal assembly configured to uncouple the paste shield from the print head gantry and to remove the paste shield.

The present invention relates to a method for manufacturing an electronic or electrical system, the method comprising the layer-free production of at least one physical structure (101, 102) which is designed to guide electromagnetic waves, using at least one additively operating apparatus, wherein the layer-free production of the spatial, layer-free structure comprises the simultaneous or sequential application and/or removal of one or more materials in the spatial arrangement, as a result of which the electronic or electrical system is partially or completely formed. The invention further relates to a system which is manufactured in accordance with the method.