A flexible printed circuit board according to an embodiment includes a substrate, a circuit pattern disposed on the substrate, and a protective layer on the circuit pattern, wherein the substrate includes a chip mounting region, the circuit pattern includes a first circuit pattern and a second circuit pattern connected to a chip of the chip mounting region, the second circuit pattern includes a plurality of second wiring portions and a third pad portion and a fourth pad portion connected to the second wiring portion, the second wiring portion includes a first wiring region connected to the fourth pad portion and a second wiring region bent in the first wiring region, a first space of the first wiring region is greater than a second space of the second wiring region, and a length of the first wiring region is 100 .Math.m or more.

A printed circuit board according to an embodiment includes an insulating layer; and a via portion disposed on the insulating layer; wherein the via portion includes: a first pad disposed under the insulating layer; a second pad disposed on the insulating layer; and a via part disposed between the first and second pads in the insulating layer; and wherein a width of the first pad is less than or equal to a width of a lower surface of the via part.

An example electronic device includes a housing, a first board and a second board disposed in an interior of the housing and disposed to face each other in a first direction, an interposer extending to surround an interior space between the first board and the second board, a first conductive layer disposed to face the first board and including a first conductive area, a second conductive layer disposed to face the second board and including a second conductive area, an insulation layer disposed between the first conductive layer and the second conductive layer, a first insulation part disposed between the first conductive layer and the first board and covering the first conductive area, a second insulation part disposed between the second conductive layer and the second board and covering the second conductive area, a first plating area extending from the first conductive layer to the second conductive layer, on a first side surface of the insulation layer, and a second plating area extending from the first conductive layer to the second conductive layer, on a second side surface of the insulation layer.

The present invention is directed to a wire comb. The wire comb includes a flat body which includes a first end and a second end. The ends are connected by an arcuate section which has an upper and lower surface. The upper surface of the arcuate section has a wire mount area that includes at least one opening formed in the upper surface with each opening including a shape selected to receive and hold a wire within. A mounting feature extends from at least one of the first end and the second end. The mounting feature is adapted to engage a printed circuit board.

A circuit board includes a circuit substrate, a solder, and a surrounding portion. The circuit substrate includes a connecting pad. The solder is formed on a surface of the connecting pad. The surrounding portion is formed on the surface of the connecting pad and cooperates with the connecting pad to form a groove receiving the solder. The surrounding portion surrounds the solder and is spaced from the solder. A method for manufacturing a circuit board is also provided.

A circuit board structure includes a rigid circuit board, a flexible circuit board, a plurality of conductive bumps, and a plurality of spacers. The rigid and flexible circuit boards are stacked one above the other. The conductive bumps are formed between the rigid and flexible circuit boards. The spacers are formed between the rigid and flexible circuit boards and spaced apart from the conductive bumps.

A solder member mounting method includes providing a substrate having bonding pads formed thereon, detecting a pattern interval of the bonding pads, selecting one of solder member attachers having different pattern intervals from each other, such that the one selected solder member attacher of the solder member attachers has a pattern interval corresponding to the detected pattern interval of the bonding pads, and attaching solder members on the bonding pads of the substrate, respectively, using the one selected solder member attacher.

A flexible printed circuit and a manufacturing method thereof, an electronic device module and an electronic device are provided. The flexible printed circuit includes a main sub-circuit board and a bridge sub-circuit board; the main sub-circuit board includes a first substrate, and a first bridge end, a second bridge end, a first wiring portion, and a second wiring portion on the first substrate, the first wiring portion and the second wiring portion are spaced apart from each other and are electrically connected to the first bridge end and the second bridge end, respectively; the bridge sub-circuit board includes a second substrate, and a third bridge end, a fourth bridge end, and a third wiring portion for a first functional wiring line on the second substrate, the third bridge end and the fourth bridge end are electrically connected by the third wiring portion, the first substrate and the second substrate are not in direct contact, and the bridge sub-circuit board is configured to be mounted on the main sub-circuit board by electrically connecting the third bridge end and the fourth bridge end to the first bridge end and the second bridge end, respectively. The wiring layout of the flexible printed circuit is simple and is easy to be manufactured.

A multilayer ceramic capacitor includes a ceramic main including first internal electrodes each drawn out to and reaching a pair of end surfaces and second internal electrodes each drawn out to and reaching a pair of side surfaces. A pair of end-surface external electrodes are respectively provided on the pair of end surfaces to be connected to the first internal electrodes, and a pair of side-surface external electrodes are respectively provided on the pair of side surfaces to be connected to the second internal electrodes. Each of the second internal electrodes has drawn-out parts that extend from an electrode main part and reach the pair of side surfaces, and with respect to each of the pair of side surfaces, two or more of the drawn-out parts are provided to extend from the electrode main part and reach the side surface.

A drive backboard includes: a first conductive layer including bonding pins and first connecting lines, an insulating layer including first via holes and second via holes, a second conductive layer including connecting electrodes and second connecting lines and a conductive protective layer including first protective structures and second protective structures. The first via hole exposes the bonding pin, one end of a first connecting line electrically connects a bonding pin, and the other end reaches the second via hole. One end of a second connecting line electrically connects a connecting electrode, and the other end electrically connects the first connecting line through the second via hole. The first protective structure covers the bonding pin, and the second protective structure covers the second connecting line formed at the position of the second via hole. The pattern of the conductive protective layer is complementary to the pattern of the insulating layer.