H05K1/117

FLEXIBLE SUBSTRATE, FLEXIBLE SUBSTRATE-ATTACHED COMPONENT, AND MANUFACTURING METHOD OF FLEXIBLE SUBSTRATE-ATTACHED COMPONENT

A flexible substrate has an insulating base member and a conductive layer that is formed on the base member and includes an electrical connecting portion fixed to a component and electrically connected to the component, and the flexible substrate includes: a main portion on which the electrical connecting portion is formed; and a protruding portion provided so as to protrude from a portion of the main portion in which the electrical connecting portion is formed, wherein the main portion is bent along a first bending line extending in a first direction, and wherein the protruding portion can be bent along a second bending line extending in a second direction intersecting the first direction and is adapted to reduce stress occurring at the electrical connecting portion by the protruding portion being bent along the second bending line.

CONNECTING MULTI-CONDUCTOR CABLES WITH SURFACE CONTACTS

A system includes a cage and a first coil. The cage includes a first end and a second end opposite the first end. The first end is arranged to receive an electrical connector. The second end is arranged to receive a pluggable module such that the electrical connector forms an electrical connection with the pluggable module. The first coil is positioned on or in the cage such that the first coil is arranged to deliver electric power to the pluggable module by inducing an electric current in a second coil positioned in or on the pluggable module when the pluggable module is connected to the electrical connector in the cage.

Printed wiring board and method for manufacturing the same

A printed wiring board includes a main substrate, a standing substrate, a first electrode portion, and a second electrode portion. The second electrode portion is connected to the first electrode portion with solder while a support portion is inserted in a slit. The first electrode portion is provided to reach the slit. The second electrode portion is disposed to span from a bottom surface to a height position higher than or equal to a midpoint between a top surface and the bottom surface.

Plug connector

A plug connector includes: an insulative housing including a main body, a reinforcement projecting forward from the main body, and a pair of baffle plates; and a printed circuit board partially received in the insulative housing, the printed circuit board extending forward from the main body and beyond the reinforcement, the reinforcement wrapping on the printed circuit board, wherein a width of a front end of the printed circuit board exposed outside the main body in a horizontal direction is greater than a width of the reinforcement, and a limiting groove is formed between the baffle plate and the printed circuit board for guiding the plug connector to mate with a socket connector.

Flexible display panel

The present application provides a flexible display panel including a flexible substrate and a flexible circuit board electrically connected to the flexible substrate. Pins on the flexible substrate and the flexible circuit board are disposed to be inclined at a certain angle. When pitches of the pins on the flexible circuit board are changed due to expansion and contraction of the flexible circuit board itself, an accurate alignment of the pins on the flexible substrate and the flexible circuit board can be realized by adjusting the position of the flexible circuit board relative to the flexible substrate before connecting the flexible circuit board to the flexible substrate, thereby ensuring the quality of the flexible display panel and improving product yield of the display panel.

Modular connector with printed circuit board wafer to reduce crosstalk

A circuit board for use in a modular electrical connector. The circuit board has a first surface and an oppositely facing second surface. Signal pathways are provided on the first surface. The signal pathways have signal pathway ends abutting a mounting end of the circuit board. First ground pathways are provided on the first surface. The first ground pathways are positioned adjacent at least one of the signal pathways. The first ground pathways have first ground pathway ends abutting the mounting end of the circuit board. One or more second ground pathways are provided on the second surface. The one or more second ground pathways have second ground pathway ends abutting the mounting end of the circuit board. The positioning of the signal pathway ends, the first ground pathway ends and the second ground pathway ends abutting the mounting end reduces crosstalk between signal pairs.

Voltage regulator module
11488764 · 2022-11-01 · ·

A voltage regulator module includes a first circuit board assembly and a magnetic core assembly. The first circuit board assembly includes a first printed circuit board, a plurality of switch elements and a first molding compound layer. The switch elements are mounted on a first surface of the first printed circuit board. The first molding compound layer is formed on the first surface of the first printed circuit board to encapsulate the switch elements. The magnetic core assembly is arranged beside a second surface of the first printed circuit board, and includes a magnetic core portion and at least one first U-shaped copper structure. The magnetic core portion includes a plurality of openings. Each first U-shaped copper structure is penetrated through two corresponding openings to define two inductors. A first terminal of each inductor and the corresponding switch element are connected in series to define a phase circuit.

Flexible printed circuit board and liquid crystal display

The disclosure is related to a flexible printed circuit board. The flexible printed circuit board comprises a connecting area and a plurality of gold fingers disposed inside the connecting area, wherein the widths of the gold fingers are different. By the above manner, the disclosure is able to increase the number of the gold fingers without changing the size of the flexible printed circuit board so as to solve the impedance matching problem of the gold fingers of the flexible printed circuit board.

Module substrate and semiconductor module including the same

A module substrate for a semiconductor module including a wiring substrate having an upper surface and a lower surface opposite to each other and including a wiring formed therein, the wiring substrate having at least one through groove in at least one sidewall and extending in a thickness direction, and a through-groove test terminal including at least one contact pad, a surface of the contact pad being exposed from an inner wall of the through-groove, the contact pad being spaced apart from a vertical plane extending from the sidewall of the wiring substrate may be provided.

OPTICAL MODULE
20220061159 · 2022-02-24 ·

An optical module includes: an optical sub-assembly; and a flexible substrate including an insulating film, an interconnection pattern, and a spacer layer, the flexible substrate being connected to the optical sub-assembly. The insulating film has some projections, the projections protruding from a basic area in a first direction, the projections being arranged in a second direction perpendicular to the first direction, the insulating film having a flat shape with a recess between an adjacent pair of the projections. The interconnection pattern includes some pads in the basic area on a first surface of the insulating film, the pads being arranged in the second direction. The pads include some first pads adjacent to the respective projections, the pads including at least one second pad adjacent to the recess. The spacer layer is on the first surface and at each of the protrusions.