H05K1/117

ELECTRO-OPTICAL PANEL, ELECTRO-OPTICAL DEVICE, AND ELECTRONIC DEVICE
20220057669 · 2022-02-24 · ·

An electro-optical panel including a display region includes a first terminal group including a plurality of first terminals arranged along a first side of a liquid crystal panel; and a second terminal group disposed between the first terminal group and the display region and including a plurality of second terminals arranged along the first side, in which the number of the plurality of second terminals is smaller than the number of the plurality of first terminals.

Latch for communication module
09798099 · 2017-10-24 · ·

A communication module includes a printed circuit board, a housing including a left and right sidewall, a top and bottom panel, and a catch pin extending from the bottom panel, the housing enclosing the circuit board and configured to be inserted into and removed from the host device, and a delatch assembly slidably engaged with the bottom panel of the housing, including first and second delatch arms extending underneath the bottom panel of the housing and configured to removably engage with the host device, and a delatch cross-member extending underneath the bottom panel of the housing, including a hooking member configured to selectively engage the catch pin as the delatch assembly slides along the housing.

PRINTED WIRING BOARD

A printed wiring board includes one or more substrates, the one or more substrates including at least a first substrate, the first substrate being formed with a pad and a ground layer at any one of main surfaces of the first substrate, the pad being to be electrically connected to a connector as another component, the ground layer being formed to surround the pad from a circumference of the pad and have an inner edge at a location separated from an outer edge of the pad with a predetermined distance, the ground layer being to be grounded to a ground contact.

Memory systems with multiple modules supporting simultaneous access responsive to common memory commands

Described are memory systems in which a memory controller issues commands and addresses to multiple memory modules that collectively support each read and write transactions. A common set of control signal lines from the controller communicates the same command and address signals to the modules. For write commands, the controller sends subsets of write data to each module over a respective subset of data lines. For read commands, each module responds with a subset of the requested data over the respective subset of data lines. The memory modules can be width configurable so that a single full-width module can connect to both subsets of data lines to convey full-width data, or two half-width modules can connect one each to the subsets of data lines.

Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same

A three-dimensional structure in which a wiring is provided on a surface is provided. At least a part of the surface of the three-dimensional structure includes an insulating layer containing filler. A recessed gutter for wiring is provided on the surface of the three-dimensional structure, and at least a part of a wiring conductor is embedded in the recessed gutter for wiring.

Wiring board and electronic device
09795034 · 2017-10-17 · ·

There is provided a wiring board capable of strengthening the bonding between an external terminal and a wiring of an external circuit board. A wiring board includes an insulating substrate having two main surfaces facing each other, side surfaces connecting to the two main surfaces and concave portions concave from the side surfaces and connecting to at least one of the two main surfaces; and external terminals disposed from one of the main surfaces to inner surfaces of the respective concave portions, each of the external terminals having a convex-shaped section disposed on one main surface side along each of the concave portions.

Semiconductor module having a tab pin with no tie bar
09793034 · 2017-10-17 · ·

A semiconductor module includes a printed circuit board including an integrated circuit chip, connecting terminals at an edge of the printed circuit board, and signal lines respectively connecting electrical connection pads of the integrated circuit chip to the connecting terminals. The connecting terminals are plated using via-holes of the printed circuit board respectively connected to the signal lines.

Waterproof, dual-polarity decorative light string
11258219 · 2022-02-22 · ·

Disclosed is a waterproof LED light string that provides outdoor lighting in a simple and reliable manner. Waterproof bulb assemblies are used with replaceable LED light sources. The bulb assemblies are easily suspended from a rope or wire, screwed to a support, or magnetically supported from a ferrous metal support. Duplicate circuitry in the LED light source allows the LED light source to be connected in either direction.

CONNECTION ELEMENT FOR AN ELECTRONIC COMPONENT ARRANGEMENT AND PROCESS TO PRODUCE SAME, ELECTRONIC COMPONENT ARRANGEMENT AND PROCESS TO PRODUCE THE SAME
20170294724 · 2017-10-12 ·

A connection element for an electronic component assembly includes a support, a first contact pad, and a second contact pad. The first contact pad and the second contact pad are electrically connected. A first contact conductor has a first conductor surface electrically connected to the first contact pad at a first section, and is configured to form a welded connection in a second section of the first conductor surface, and/or on the second conductor surface. The invention also relates to an electronic component assembly which includes such a connection element, and which has at least one component welded to the contact conductor.

Storage device and information processing device
11258195 · 2022-02-22 · ·

According to one embodiment, a storage device is disclosed. The storage device includes a substrate, a first connector provided on the substrate and including a notch, and a nonvolatile memory provided on the substrate. The storage device further includes a first conductive part provided on the first connector and being adjacent to the notch.