A receptacle connector includes an insulative housing defining a base and a mating tongue extending from the base, the mating tongue defining a thicken step structure around a root thereof adjacent to the base; two rows of contacts disposed in the insulating housing with contacting sections exposed upon the mating tongue and mount tails out of the base; and a shielding plate embedded within the insulative housing and disposed between the two rows of contacts. The shielding plate defines a pair of locking sides for locking with an internal latch of a corresponding plug and the locking sides protruding beyond corresponding lateral sides of the mating tongue. The insulative housing and the shielding plate are integrally formed via an insert molding process while at least one row of the contacts are configured to be forwardly assembled to corresponding passageways in the insulating housing.

A wiring board includes a plurality of first terminal parts for electrically connecting with a control circuit and disposed corresponding to a plurality of first electrode parts, and first terminal wiring parts for electrically connecting the plurality of first electrode parts and the corresponding first terminal parts. Each of the first terminal wiring parts has, in at least a portion thereof falling in a circle with a radius of 10 mm centering around a boundary part between the first terminal wiring parts and the corresponding first terminal parts, a portion having a line width of 5 μm to 100 μm inclusive, the wiring resistance value of the first terminal wiring parts connected to the first terminal parts being 100 ohms to 10 kohms inclusive.

A connector assembly comprises a connector including an insulating housing formed with a slot extending in a longitudinal direction and having at least one open end. A first circuit board is inserted into the slot and includes an electrical contact pad for electrically contacting a conductive terminal arranged within the slot, the electrical contact pad of the first circuit board extends in the longitudinal direction outside of the insulating housing of the connector via the open end of the slot.

Systems and techniques are described for a sensor designed to connect to and monitor devices in an ecosystem. In some implementations, a system monitors a property that includes the sensor configured to generate sensor data reflecting an attribute of the property. The sensor includes a host board that generates the sensor data and a core board connected to the host board. The core board identifies a type of the host board and communicates with a monitor control unit. The monitor control unit receives a request for firmware associated with the type of the host board from the sensor. In response, the monitor control unit accesses the firmware and transmits the firmware to the sensor. The core board of the sensor receives the firmware and stores the firmware. The core board receives the sensor data from the host board and transmits the sensor data to the monitor control unit.

A surface mount module form factor comprises a substrate having a bottom surface, a top surface, and an outer periphery, with at least one electronic component mounted on the substrate, and a plurality of land grid array pads mounted on the bottom surface of the substrate. At least some of the land grid array pads are coupled to the at least one electronic component. A plurality of castellated edge pads are mounted around the outer periphery of the substrate, with at least some of the castellated edge pads coupled to the at least one electronic component. At least some of the land grid array pads are mapped to at least some of the castellated edge pads.

An electrical connector may include a cord comprising wires and a plug extending from the cord. The plug may include a first top row of contacts included in a top portion of the plug and a first bottom row of contacts included in a bottom portion of the plug. The first top row of contacts may be coupled to the plurality of wires and include a first top differential signaling pair configured to carry signals according to a first communication protocol, and a second top differential signaling pair configured to carry signals according to a second communication protocol. The first bottom row of contacts may be coupled to the first top row of contacts and arranged to maintain a same arrangement of contacts and electrical paths the first top row of contacts to the plurality of wires when the plug is rotated one hundred and eighty degrees.

A surface mounted electronic component is provided. The component includes a first and a second connection portion for performing connection to a mounting board. The first connection portion includes a joint region arranged on a lower surface. The second connection portion includes a lower surface region arranged on the lower surface, and a side surface region connected to the lower surface region and arranged on a side surface. In a direction along the side, the lower surface region is arranged apart from the joint region, a length of the lower surface region in the direction is longer than a length of the joint region, a length of the side surface region in the direction is shorter than the length of the lower surface region, and the side surface region is spaced apart from an end of the side surface.

The present disclosure relates to a connecting adapter configured to connect to a terminal assembly. The connecting terminal assembly includes a plurality of electrical connecting terminals. The connecting adapter includes a printed circuit board that includes a comb-type conducting structure. The comb-type conducting structure includes a plurality of comb teeth, and each comb tooth includes an electrical contact surface. The connecting adapter also includes an electrical plug connector interface including a plug connector. The electrical plug connector interface includes electrical terminals electrically connected to the electrical contact surfaces of the comb teeth. The electrical plug connector interface is arranged on the printed circuit board.

An electronic component containing package includes a substrate including a placement region for placing an electronic component in an upper face thereof; a frame disposed on the upper face of the substrate surrounding the placement region, and including a penetration part opening; and an input/output member disposed in the frame closing the penetration part, including a plurality of wiring conductors which extend inward and outward of the frame and are electrically connected to the electronic component. The input/output member includes via conductors which are connected to the wiring conductors and embedded at sites overlapping with the wiring conductors within a region surrounded by the frame in the input/output member, and a ground layer disposed in a surrounding of lower ends of the via conductors being spaced from the via conductors. Improved high frequency characteristics can be achieved.

Apparatuses and systems associated with expansion card design with a coherent connector to provide for coherent communication are disclosed herein. In embodiments, a circuit card may comprise an integrated circuit (IC), a first connector to couple the IC to a processor of a computer device, the first connector to provide for non-coherent communication between the IC and the processor, and a second connector to couple the IC to the processor, the second connector to provide for coherent communication between the IC and the processor. Other embodiments may be described and/or claimed.