An object of the present invention is to decrease the resistance of a power supply line, to suppress a voltage drop in the power supply line, and to prevent defective display. A connection terminal portion includes a plurality of connection terminals. The plurality of connection terminals is provided with a plurality of connection pads which is part of the connection terminal. The plurality of connection pads includes a first connection pad and a second connection pad having a line width different from that of the first connection pad. Pitches between the plurality of connection pads are equal to each other.

A printed circuit board for mounting electrical components thereupon include: a first side; a second side opposite the first side; electrical connection points disposed on the surface of an exterior edge of the printed circuit board; and wherein the exterior edge of the printed circuit board is between the first side and the second side. Further a method of manufacturing a printed circuit board for mounting electrical components thereupon includes the steps of disposing interconnect structures within the printed circuit board adjacent to at least one edge of the printed circuit board; and removing material from the printed circuit board edge to expose the interconnect structures such that the exposed interconnect structures correspond to a component connection footprint.

A lighting device contains a first circuit board and a second circuit board. The first circuit board has one or more connecting sections having overall at least two contact areas. The second circuit board has an opening through which the connecting section of the first circuit board can extend. At least two contact elements, which are electrically connected to conductive tracks of the second circuit board, are arranged on the second circuit board. Each contact element has a contact region by which the contact element butts against one of the contact areas of the first circuit board. As a result, an electrical connection is produced between the two circuit boards.

A power system includes a power module, an electronic load and a system board. The power module includes a first surface, a second surface, a switch and a plurality of conductive parts, wherein the switch is disposed on the first surface of the power module and the plurality of conductive parts are disposed on the second surface of the power module. The electronic load includes a plurality of conductive parts. The power module and the electronic load are disposed on two opposite sides of the system board, the power module delivers power to the electronic load through the system board, and gaps and networks of the plurality of conductive parts of the power module correspond to those of the plurality of conductive parts of the electronic load.

A cable assembly comprising a connector with a termination that enables high density and high signal integrity. Shields of cables are terminated to a paddle card via a conductive structure attached to a surface of the paddle card. The signal conductors of the cables are terminated to pads on the paddle card that are exposed within openings of the conductive structure. Such a structure creates a ground structure per cable that provides low insertion loss and low crosstalk, even when multiple cables are aligned side by side and terminated in one or more rows. The cables may be drainless, enabling a large number of cables, such as eight cables, to be packed within the width of a paddle card specified in high density standards such as QSFP-DD or OSFP. The cables may nonetheless have large diameter signal conductors, enabling 2.5 or 3 meter assemblies with less than 17 dB insertion loss.

A connection structure is provided. The connection structure includes a first conductive pad, a first insulating layer, a second conductive pad, a second insulating layer, and a third conductive pad. The first insulating layer is disposed on the first conductive pad and includes a first through-hole. The second conductive pad is disposed on the first insulating layer and electrically connected to the first conductive pad through the first through-hole. The second insulating layer is disposed on the second conductive pad and includes a second through-hole and a first recessed portion. The first recessed portion overlaps the first through-hole. The third conductive pad is disposed on the second insulating layer and electrically connected to the second conductive pad through the second through-hole. The third conductive pad extends on a surface of the first recessed portion.

A pad configuration adaptable to a display system includes a plurality of input bond pads, via which a driver of the display system is mounted and signals are inputted to the driver; and a plurality of output bond pads, via which the driver is mounted and signals are outputted to a display panel of the display system. Input and output bond pads corresponding to one of two neighboring drivers are point symmetric with input and output bond pads corresponding to the other of the two neighboring drivers.

A cable includes a wiring assembly with a knuckle and wires bundled together. The cable also includes a connector assembly with a connector having connections for the wires, where the connections are arranged along a longitudinal axis. In some embodiments, the connector assembly captures an end of the wiring assembly, and the knuckle of the wiring assembly is pivotally connected to the connector assembly. In some embodiments, the cable includes circuitry configured to authenticate the cable to a device connected to the cable by the connector and/or to authenticate the device connected to the cable. A control system includes control elements and/or subsystems coupled with a backplane adjacent to one another and cables configured to connect to the control elements and/or subsystems. Wiring assemblies of the cables can articulate to be parallel to each respective connector. Further, each cable can authenticate the cables and/or the control elements or subsystems.

A resource circuit board is configured for use by a physical migration system, the resource circuit board including at least one common interface shaped and configured to connect to an interconnect of a base circuit board; and at least one migration-support interface the at least one common interface being different from the at least one migration-support interface, the at least one migration-support interface: shaped to connect to at least one corresponding migration-support interface of the physical migration system; and configured to provide at least one of power and connectivity to the resource circuit board during a physical migration of the resource circuit board.

The embodiments of the present disclosure provide a chip on flex (COF), a touch assembly, and a display device. The chip on flex includes a flexible base provided with a first opening, the flexible base includes a bonding area provided with a plurality of metal bonding pads; on the flexible base, a spacing area with a preset range is provided between the first opening and the bonding area; wherein, the flexible base is provided with a reinforcement sheet thereon, the reinforcement sheet is located on a portion of the flexible base other than the first opening, the spacing area and the bonding area.