A communication module includes: a substrate; a supplementary substrate disposed to surround an electronic element mounted on a lower surface of the substrate; a molding material configured to seal an electronic element mounted on an upper surface of the substrate; and a shielding layer disposed on a side surface and an upper surface of the molding material, a side surface of the supplementary substrate, and a side surface of the substrate. The supplementary substrate includes: a plurality of first pads disposed on an upper surface of the supplementary substrate; a plurality of second pads disposed on a lower surface of the supplementary substrate; a plurality of vias connecting the plurality first pads to the plurality of second pads; and a ground pad disposed on the side surface of the supplementary substrate. The ground pad includes an extender connected to a corresponding first pad and a corresponding second pad.

According to one embodiment, in a semiconductor storage device, a conductive cover is provided on a side of the principal surface, and covers at least a part of the memory and the controller. A substrate has a first notched portion and a second notched portion in an outer edge. The conductive cover has a top plate portion, a first side plate portion, a second side plate portion, a first claw portion, and a second claw portion. The first claw portion is extended from a lower end of the first side plate in a direction intersecting with the principal surface. The first claw portion is fitted into the first notched portion. The second claw portion is extended from a lower end of the second side plate in the direction intersecting with the principal surface. The second claw portion is fitted into the second notched portion.

An electronic component includes a substrate and side wires. The substrate includes a first major surface, a second major surface, and a side surface. The side wires are on the side surface of the substrate and spaced apart from each other in a direction along an outer periphery of the substrate when viewed in plan in a thickness direction of the substrate. At least a portion of each of the side wires is provided indirectly on the side surface of the substrate. The electronic component further includes an electrically insulating layer interposed between the side surface of the substrate and the at least a portion of each of the side wires. Each of the side wires includes a bent portion bent when viewed in plan in the thickness direction of the substrate.

A memory device and an electronic device is provided. The memory device may include a memory module including a module board and a memory connector located on one side of the module board, a first enclosure placed above the memory module and a second enclosure placed below the memory module, wherein the first enclosure includes a first main cover which covers upper faces of the module board and the memory connector, at least one clamping hole which penetrates the main cover at a position overlapping the memory connector, an inter-device fastening pillar protruding downward from a lower face of the first main cover, and a coupling hole which is located inside the inter-device fastening pillar on a plane and penetrates the inter-device fastening pillar and the main cover.

A card, e.g. a printed circuit board (PCB), has one or more conductive layers and one or more non-conductive layers disposed and alternating upon one another to form a stack. One or more of the conductive layers has one or more wiring elements within the conductive layer. The PCB/card has one or more card edges. The PCB also has a plurality of dual-level pad structures on each of one or more of the card edges. The dual-level pad structures each have an upper level, a lower level, and two or more walls. The lower level is a conductive pad with conductive surface. At least one of the conductive pads electrically connects to one or more of the wiring elements and/or one or more vias. In each of the dual-level pad structures, the walls and upper level may be made of an electrically non-conductive, insulating, or dielectric material or may be covered with a conductive material that electrically connects to conductive surface. There are different non-limiting embodiments of the structures and methods of making the structures.

A display screen, a spliced display screen, and a splicing method for the spliced display screen are provided. The display screen includes a substrate and at least one first flexible printed circuit FPC. The substrate is provided with at least one set of first signal lines on a side edge of the substrate, where each set of first signal lines is coupled with a first connecting portion of a corresponding first FPC, and for each first FPC, a second connecting portion of the first FPC faces the side edge of the substrate where the at least one set of first signal lines is disposed.

Embodiments of the present disclosure provide a connector, an electronic device and an open pluggable specification (OPS) device. The connector includes a plurality of first pins and a plurality of second pins. A pair of adjacent first pins are configured to transmit a first signal. The plurality of the second pins are arranged on both sides of the pair of the first pins. The plurality of the second pins are configured to be grounded or transmit a second signal. A transmission rate of the first signal is greater than that of the second signal.

A display device includes a base film, a driving chip disposed under the base film, a first pad disposed under the base film and connected to the driving chip, and a display panel including a first connection pad connected to the first pad, where one side of the first pad has a first inclined surface which is angled at a first angle with respect to a top surface of the first pad, and the first angle is an acute angle.

A plug connector provides an electrical connection to a conductor track connection of a printed circuit board. The plug connector has a first printed circuit board with a conductor track connection and a plugging region for plugging the printed circuit board into the plug connector. The plugging region extends parallel to the first printed circuit board. A contact element and/or a spring element is provided in the plug connector. The plugging region and the contact element and/or the spring element are arranged in such a way that, in a plugged state of the plug connector, the printed circuit board which is plugged into the plugging region is arranged parallel to the printed circuit board and the conductor track connection is arranged opposite the conductor track connection. An electrical connection of the conductor track connection to the conductor track connection is provided by the contact element and/or the spring element.

Disclosed is a wiring board, including: an insulating substrate containing aluminum oxide; and a metallized layer that includes a metal phase containing a metal material and a first glass phase containing a glass component and that is disposed on the insulating substrate. At least one of the insulating substrate and the metallized layer further contains mullite. In the metallized layer, the metal phase continues in a three-dimensional network shape, and the first glass phase is embedded between the metal phase.