A conducting structure is provided and includes a first layer; a first terminal on the first layer; a second layer overlapping the first layer via the first terminal; a second terminal on the second layer; a first hole which penetrates the second layer and the second terminal; an organic insulating layer located between the first terminal and the second layer, and having a second hole connected to the first hole; and a connecting material provided in the first and second holes to electrically connect the first terminal and the second terminal to each other, wherein a diameter of the second hole is greater than a diameter of the first hole.

A board mount connector includes: a housing having a press-fitting hole; and a terminal press-fitted into the press-fitting hole. The terminal includes: a first terminal portion including a first contact portion contacting and conductively connected to the counterpart terminal when the first contact portion is connected to the counterpart terminal, and a press-fitting portion that is press-fitted into the press-fitting hole; and a second terminal portion including a bent portion extending from the first terminal portion and bent around a bending axis along an axis line of the first terminal portion, and a second contact portion located at a position offset from the first contact portion in an intersecting direction intersecting the axis line of the first terminal portion and conductively connected to the conductor pattern when the boar mount connector is mounted on the circuit board.

A fan structure automatically mountable on a system circuit board includes a fan. The fan includes a fan frame main body. A connector connection section is disposed on the fan frame main body for connecting with a fan end connector, whereby the fan end connector can be assembled with the fan frame main body. Accordingly, when the fan is mounted on the system circuit board, the fan end connector can be directly pressed down by means of an automated device to plug into the circuit board end connector. Therefore, the manufacturing process can be automated.

A circuit board has an edge connector with signal traces. The signal traces are formed on a dielectric layer of the circuit board. A reference trace is formed within the dielectric layer or on another surface of the dielectric layer. Parameters of the reference trace are adjusted to set an impedance of a single-ended signal trace or a differential impedance of two adjacent signal traces.

A method for improving flexibility of a circuit board, e.g., comprising a touch-based sensor, and reducing manufacturing costs by eliminating routing around a border of the touch-based sensor is presented herein. The method comprises forming an array of touch sensors on a first side of the circuit board, in which portions of the circuit board located between three edges of the circuit board and a border of the array of touch sensors exclude traces; and forming first traces between respective second traces in a singular direction on a second side of the circuit board, in which the first traces are electrically coupled, using a first group of vias, to respective rows of the array of touch sensors, and the second traces are electrically coupled, using a second group of vias, to respective columns of the array of touch sensors.

A circuit board assembly includes a first circuit board and a second circuit board. The first circuit board includes a first contact pad and defines a stamped protrusion being correspondingly positioned relative to a position of the first contact pad, the first contact pad being outside the stamped protrusion. The second circuit board includes a second contact pad. The first contact pad on the stamping protrusion is in contact with the second contact pad to achieve electronic connections between the first circuit board and the second circuit board. A method for manufacturing the circuit board assembly is further disclosed.

A printed circuit board includes a first electrically conductive reference plane configured to distribute a first reference voltage applied thereto across a surface area of the first reference plane, and a second electrically conductive reference plane extending parallel to the first reference plane, and configured to distribute a second reference voltage applied thereto across a surface area of the second reference plane. A first layer is provided, which extends between the first reference plane and the second reference plane, and includes one or more first signal lines extending adjacent the first reference plane. The first layer is divided into: (i) a first region in which the one or more first signal lines are disposed, (ii) a second region containing an additional plane that is configured to receive a third voltage and has smaller surface area relative to the surface areas of the first and second reference planes, and (iii) a third region containing a dielectric layer. A second layer is provided, which extends between the first reference plane and the second reference plane, and includes one or more second signal lines extending adjacent the second reference plane. The second signal lines have linewidths that vary as a function of whether they are vertically aligned with the first region, the second region, or the third region.

An IMS printed circuit board comprises a card edge connector with a first face and a second face, the second face being in electric contact with the metallic core and the card edge connector comprising a plurality of signal traces. At least one of the signal traces is a ground trace which is in electrical connection with a ground connection of the printed circuit board and is intended to be connected to a ground pin comprised in a card edge connector socket. The IMS printed circuit board also provides a card edge connector socket with a plurality of pins, one of the pins being a ground pin and being configured to receive the ground trace of the printed circuit board. An electronic assembly comprises the printed circuit board and the card edge connector socket and a lighting device are also provided.

An edge connector includes a first row of golden fingers and a second row of golden fingers. The first row of golden fingers is adjacent to a plugging end of the edge connector, and the second row of golden fingers is adjacent to the first row of golden fingers. In a plugging direction of the edge connector, each golden finger in the first row of golden fingers has a first end proximate to the plugging end and a second end opposite to the first end. A first end of a grounded golden finger in the first row of golden fingers is protruded from other golden fingers, and second ends of two or more than two golden fingers in the first row of golden fingers are not aligned with each other.

A hybrid edge connector includes an insulative housing with a slot lined with signal terminals, in a signal portion, and power terminals in a power portion. The power terminals may be made with multiple layers, with each layer formed into one or more fingers. Each finger may be configured to make contact with an edge of a card inserted in the slot such that each terminal has multiple contact points to the card and can carry a large current. To support a large current, the card may be a hybrid card, with a signal portion formed using a conventional PCB manufacturing techniques and a power portion formed with one or more blades mechanically coupled to the signal portion. The slot in the connector housing may have different widths in the signal and power portions and the center lines of those portions may be offset with respect to each other.