The disclosure provides a bonding method, the bonding method includes: bonding first areas of a plurality of flexible printed circuit boards on a substrate, the plurality of flexible printed circuit boards being sequentially arranged along a direction parallel to a first side of the substrate, and a second area of each of the flexible printed circuit boards exceeds the first side; cutting at least one of the flexible printed circuit boards to enable second sides of all the flexible printed circuit boards to be flush and parallel to the first side, wherein each of the second sides is a side of the second area away from the first area; and bonding second areas of the flexible printed circuit boards with a connection circuit board.

An electromagnetic wave shielding sheet according to the disclosure is configured by a protection layer, a metal layer, and a conductive adhesive layer. The metal layer has a plurality of openings, and an aperture ratio of the opening is 0.1%-20%. In addition, a tensile breaking strength of the electromagnetic wave shielding sheet is 10 N/20 mm-80 N/20 mm.

A display device includes a display panel including a first signal pad portion including first signal pads, a second signal pad portion including second signal pads, and a first dummy pad portion disposed between the first signal pad portion and the second signal pad portion and including at least one first dummy pad, and a flexible circuit board including a first terminal portion including first terminals, a second terminal portion including second terminals, and a first cut portion disposed between the first terminal portion and the second terminal portion. The flexible circuit board is compressed to the display panel. The first terminals are electrically connected to the first signal pads. The second terminals are electrically connected to the second signal pads. The first cut portion overlaps the first dummy pad portion.

Disclosed are film packages and methods of fabricating package modules. The film package includes a film substrate that includes a chip region and a peripheral region facing each other in a first direction, a plurality of output pads that are arranged in the first direction on the chip region and on the peripheral region, and a semiconductor chip on the chip region and electrically connected to the output pads. The output pads on the chip region are arranged at regular first intervals along the first direction. The output pads include a plurality of first output pads that are arranged at a first pitch along the first direction on the chip region and a plurality of second output pads on the peripheral region. The second output pads are arranged at a second pitch greater than the first pitch of the first output pads.

A method of fabricating an electromagnet includes obtaining a first flexible PCB that includes one or more first conductive coiled traces and obtaining a second flexible PCB that includes one or more second conductive coiled traces. The first flexible PCB is bent into a shape having at least one curve or corner. With the first flexible PCB having been bent into the shape, the second flexible PCB is then bent into the shape: the second flexible PCB is positioned adjacent to the first flexible PCB to conform with the first flexible PCB.

A flexible printed circuit board including a terminal includes a flexible printed circuit board that includes an electrically conductive line and the terminal soldered to the flexible printed circuit board. The flexible printed circuit board includes a land and a soldering restricting section. The land is electrically connected to the electrically conductive line and has a metal surface and is soldered to the terminal. The soldering restricting section has a non-metal surface and is not soldered to the terminal. The terminal includes an overlapping section and a protrusion section. The overlapping section overlaps the land and is soldered to the land and includes a removed section that is formed in such a manner that a portion is partially removed in a predefined area. The protruding section is continuous from the overlapping section and protrudes to an area that does not overlap the flexible printed circuit board.

A circuit design includes a flexible film, an electrode pattern, and a connecting circuit. The flexible film has a visible area and a bending area and includes an external conductive connection. The electrode pattern is disposed in the visible area of the flexible film. The connecting circuit is electrically connected to the electrode pattern and disposed in the bending area of the flexible film. The bending area has a first portion and a second portion. The first portion is located between the visible area and the second portion. A width of one end of the second portion connected to the first portion is smaller than a width of the first portion. The external conductive connection is electrically connected to the connecting circuit and located at another end of the second portion.

Various embodiments disclosed in the disclosure relate to a flexible connection member and an electronic device comprising same, the flexible connection member having an RF line for signal transmission formed therein, wherein an impedance of the RF line is prevented from being changed even when a flexible printed circuit board is bent. According to one embodiment, a connection member may be provided, the connection member comprising, a first conductive layer including a first logic line, and a second conductive layer in contact with the first conductive layer and including a bonding sheet layer, wherein the second conductive layer includes, a second logic line formed on part of the second conductive layer, and an RF line formed on other part of the second conductive layer, the bonding sheet layer includes, the second conductive layer adhered over the second logic line and the RF line, a first insulating layer formed between the first conductive layer and the second conductive layer, and pins formed on one side of the first conductive layer and the second conductive layer and configured to be electrically connected to connection pins of an external module, and the second conductive layer includes at least one via formed between the second logic line and the RF line so as to energize between the layers included in the second conductive layer. Such a flexible connection member may vary according to embodiments, and an electronic device comprising the flexible connection member may be provided according to various other embodiments.

A display device according to an exemplary embodiment of the present invention includes: a first substrate and a second substrate; a plurality of signal lines that are formed on the first substrate or on the second substrate; and a plurality of side wires that are disposed in a side surface of a first edge of the first substrate and a side surface of a second edge of the second substrate, wherein the plurality of side wires are disposed apart from each other along a direction in which the first edge extends, and are connected with the plurality of signal lines, and a first thickness of side wires disposed at an end of the first edge and at and end of the second edge is different from a second thickness of the side wire disposed at inside of the edges of live first edge and the second edge.

The present invention relates to an LED filament lamp (10) comprising a two-dimensional flexible printed circuit board (100), PCB, having a first and a second opposing connection end portions (110, 120). The two-dimensional flexible PCB (100) comprises a plurality of filaments lines (130a-d) extending from the first connection end portion (110) to the second connection end portion (120), wherein each filament line (130a) comprises an array of LEDs (130.sub.a1-130.sub.aN). The two-dimensional flexible PCB (100) is arranged in a cylinder shape by connecting the first and the second opposing connection end portions (110, 120) such that each (130a) of the plurality of filament lines (130a-d) is connected to another (130b) one of the plurality of filament lines (130a-d) thereby a spiral LED filament (150) is formed by the plurality of filament lines (130a-d).