An optical module includes: an optical element; a housing configured to house the optical element; as electrical terminal arranged on an outer peripheral surface of the housing and electrically connected to an inside of the housing; and a positioning unit configured to determine a relative position of a wiring board electrically connected to the electrical terminal from outside of the housing, with respect to the electrical terminal.

A circuit board structure includes a rigid circuit board, a flexible circuit board, a plurality of conductive bumps, and a plurality of spacers. The rigid and flexible circuit boards are stacked one above the other. The conductive bumps are formed between the rigid and flexible circuit boards. The spacers are formed between the rigid and flexible circuit boards and spaced apart from the conductive bumps.

An intraluminal ultrasound imaging device includes a flexible elongate member configured to be inserted into a body lumen of a patient, the flexible elongate member comprising a proximal portion and a distal portion. The device also includes an ultrasound scanner assembly disposed at the distal portion of the flexible elongate member. The ultrasound scanner assembly includes a flexible substrate; a transducer region positioned on the flexible substrate; and a control region positioned on the flexible substrate, wherein the transducer region and the control region are radially arranged relative to one another. Associated devices, systems, and methods are also described.

Described herein are ultra-thin nanocellulose flexible electronic device on which SU-8, an epoxy material which can become highly stressed upon UV exposure, is printed on desired areas. Upon UV exposure and then release from the surface it is anchored on, the nanocellulose device will spontaneously self-mold into a desired form due to stress differences between the SU-8 and the nanocellulose sheet. The flexible electronics can be manufactured using standard printed circuit board processing techniques, including electroless metallization and soldering of surface mount components.

A flexible printed circuit and a manufacturing method thereof, an electronic device module and an electronic device are provided. The flexible printed circuit includes a main sub-circuit board and a bridge sub-circuit board; the main sub-circuit board includes a first substrate, and a first bridge end, a second bridge end, a first wiring portion, and a second wiring portion on the first substrate, the first wiring portion and the second wiring portion are spaced apart from each other and are electrically connected to the first bridge end and the second bridge end, respectively; the bridge sub-circuit board includes a second substrate, and a third bridge end, a fourth bridge end, and a third wiring portion for a first functional wiring line on the second substrate, the third bridge end and the fourth bridge end are electrically connected by the third wiring portion, the first substrate and the second substrate are not in direct contact, and the bridge sub-circuit board is configured to be mounted on the main sub-circuit board by electrically connecting the third bridge end and the fourth bridge end to the first bridge end and the second bridge end, respectively. The wiring layout of the flexible printed circuit is simple and is easy to be manufactured.

A surface-mount device platform includes a surface-mounting region, a connection region, and a bendable region therebetween, each including a respective part of a base substrate. The base substrate includes electrically-conductive layers interspersed with electrically-insulating build-up layers. Each of the surface-mounting region, the connection region, and the bendable region spans between a bottom substrate-surface and a top substrate-surface of the base substrate. The surface-mounting region further includes an electrically-insulating first top rigid-layer, and device bond-pads exposed on a top surface of the first top rigid-layer facing away from the top substrate-surface in the surface-mounting region. The connection region further includes an electrically-insulating second top rigid-layer and a plurality of connector bond-pads each exposed on a top surface of the second top rigid-layer facing away from the top substrate-surface in the connection region, and electrically connected to a respective device bond-pad via at least one of the electrically conductive layers.

A multilayer printed circuit board including a first printed circuit board portion, including a first inserting connector, including a plurality of contacts for creating a first removable bus connection; a second printed circuit board portion, including a second inserting connector, including a plurality of contacts for creating a second removable bus connection; a third printed circuit board portion, connected between the first printed circuit board portion and to the second printed circuit board portion, wherein a rigidity of the third printed circuit board portion is less than a rigidity of each of the first printed circuit board portion and the second printed circuit board portion; wherein the multilayer printed circuit board is foldable along the third printed circuit board portion and, if so folded, the first printed circuit board portion is arranged on top of the second printed circuit board portion.

Flexible devices including conductive traces with enhanced stretchability, and methods of making and using the same are provided. The circuit die is disposed on a flexible substrate. Electrically conductive traces are formed in channels on the flexible substrate to electrically contact with contact pads of the circuit die. A first polymer liquid flows in the channels to cover a free surface of the traces. The circuit die can also be surrounded by a curing product of a second polymer liquid.

A portable electronic device includes a housing, a display at least partially within the housing, a front cover coupled to the housing and positioned over the display, a rear cover coupled to the housing and defining a first portion of a rear exterior surface of the portable electronic device, a protrusion defining a sensor array region of the rear cover and a second portion of the rear exterior surface, and an internal surface opposite the second portion of the rear exterior surface. The portable electronic device also includes a sensor array mounted within the housing along the sensor array region and comprising a frame member coupled to the rear cover along the internal surface and defining a wall structure defining a first container region and a second container region, a camera module positioned in the first container region, and a depth sensor module positioned in the second container region and attached to the internal surface of the rear cover.

A method and apparatus of electrode interfaces for stimulating neurons and nerve cells that provides micro-fabricated electrode interfaces configured for conformal placement adjacent to neuron, nerves and neural tissue to thereby allow the neuron, nerves and neural tissue to grow around the electrode interfaces and allow for the creation depending on configuration of local or far electrical fields and current flows to stimulate them.