A direct type backlight device includes a printed circuit board, a light reflector and plural Mini-LEDs. The light reflector and the Mini-LEDs are disposed over the printed circuit board. The light reflector is arranged between at least part of adjacent Mini-LEDs. Each of the Mini-LEDs includes a non-light-emitting layer and a light-emitting layer arranged on the non-light-emitting layer. A bottom surface of the light-emitting layer of each of the Mini-LEDs is higher than a top surface of the light reflector.

A power supply device includes a housing, a circuit board and a conductive spring contact. The housing has a receiving structure. The circuit board is disposed in the housing. The conductive spring contact is disposed in the receiving structure and includes a base portion, a contact portion and a curved portion. The contact portion is connected to the base portion and is bent relative to the base portion. The contact portion extends between the circuit board and a wall portion of the receiving structure, and the contacts the circuit board. The curved portion is connected to the contact portion and abuts against the wall portion.

An example apparatus includes a first printed circuit board (PCB) having a power layer, a ground layer, and a slot. The slot includes a first power electrical contact that is electrically connected to the power layer and a first ground electrical contact that is connected to the ground layer. The slot extends orthogonally or obliquely through multiple layers of the first PCB. A second PCB includes a second power electrical contact, a second ground electrical contact, and capacitors electrically connected between the second power electrical contact and the second ground electrical contact. The second PCB is configured for insertion into the slot to form an electrical connection between the first power electrical contact and the second power electrical contact and between the first ground electrical contact and the second ground electrical contact.

A variety of active cover plate configurations with prongs configured to contact side screw terminals of electrical receptacles are described. In one illustrative embodiment, an active cover plate includes a multi-gang face plate configured to be installed over a multi-gang light switch installation, the multi-gang faceplate including at least two apertures sized to accept a manually manipulatable element of switches in the multi-gang light switch installation. Prongs extend rearward from the multi-gang faceplate around at least one of the apertures.

A high-frequency module (1) includes a substrate (10), a first electronic component (30) and a second electronic component (40) mounted on a main surface (10a) of the substrate (10). The substrate (10) has a protruding portion (20) projecting from the main surface (10a), the first electronic component (30) is mounted in a region of the main surface (10a) different from a region in which the protruding portion (20) is provided, and the second electronic component (40) is mounted on the protruding portion (20).

Ultra-thin dielectric printed circuit boards (PCBs) are provided. An ultra-thin dielectric layer may be coupled to a first conductive layer on a first side of the ultra-thin dielectric layer. A second conductive layer may be coupled to a second side of the ultra-thin dielectric layer, and the ultra-thin dielectric layer is thinner than at least one of the first conductive layer and the second conductive layer. The second conductive layer may be patterned to form electrical paths. The patterned second conductive layer may be filled with a dielectric filler. One or more conductive layers and one or more ultra-thin dielectric layers may also be coupled to the second conductive layer.

A substrate has a first surface and a second surface opposite to the first surface. The substrate has at least one first recess on the first surface and a second recess on the second surface. The substrate includes electrode pads. The electrode pads are in the at least one first recess. The substrate has the at least one first recess located separate from the second recess in a plan view.

A relay includes a relay main body (10) including a base (20) having a first surface (21), and a relay substrate (30) extending, in a direction intersecting the first surface (21), from a second surface (22) on the opposite side of the base (20) from the first surface (21), the relay substrate (30) being united with the base (20), and a case (50) attached to the relay main body (10) to cover the relay substrate (30), and the case (50) being filled with sealant. The relay main body (10) includes a board connector (23) provided on the first surface (21) of the base (20), an electronic component mounting portion (33) provided on the relay substrate (30), a conducting portion (40) provided on respective surfaces of the base (20) and the relay substrate (30), and an electronic component (34) mounted on the electronic component mounting portion (33).

The present invention relates to a support-attached resin film for an interlayer insulating layer, including a support, and a resin composition layer formed on one side surface of the support in which the support has particles exposed on the one side surface, and an average maximum height of exposed portions of the particles is 1.0 μm or less, or the support has no particles exposed on the one side surface, a multilayer printed wiring board using the support-attached resin film for an interlayer insulating layer, and the multilayer printed-wiring board.

A multi-conductor bus with radially arranged conductor wires on which addressable bead devices that may incorporate light-emitting diodes (LEDs) or other surface mount devices (SMDs) can be easily mounted. The radial bus is designed to provide an improved range of flexibility and motion while allowing for easy addition of bead devices along its length that utilize self-addressing bus protocols such as cascading device protocols. The design of the flexible, interruptible radial bus facilitates the use of pass-through and interrupted paths along the bus that simplifies the installation of addressable devices along the bus such as the bus-mounted bead devices disclosed herein.