In one example, an electronic device housing may include a substrate, an insulating adhesive layer formed on a surface of the substrate, a patterned electroless plating layer formed on the insulating adhesive layer, and a patterned electrolytic plating layer formed on the patterned electroless plating layer.

A circuit board includes an insulating substrate including a wiring conductor and a first resin substrate that is made of a resin different from the insulating substrate and is laminated on the insulating substrate. The first resin substrate has a plurality of internal conductors located from a surface thereof facing the insulating substrate to a surface on a side opposite to the insulating substrate. Each of the plurality of internal conductors includes a part that is inclined with respect to a perpendicular to the surface facing the insulating substrate. Intervals at which the plurality of internal conductors are located on the side opposite to the insulating substrate are narrower than intervals at which the plurality of internal conductors are located on an insulating substrate side.

A switch assembly, which is part of a chain of switch assemblies, includes a communication unit (CU) configured to receive, from an external controller, a fire command to activate a detonator, a voltage measuring unit configured to locally measure a voltage (V) at the switch assembly after receiving the fire command to activate the detonator, a computing core (CC) configured to locally make a decision whether or not to activate the detonator, after receiving the fire command to activate the detonator and after measuring the voltage (V), based on whether or not the measured voltage (V) at the switch assembly is larger than a threshold value.

A wiring substrate includes an insulating layer including inorganic fillers and resin, and a conductor layer formed on a surface of the insulating layer and having a conductor pattern. The surface of the insulating layer has an arithmetic average roughness Ra in the range of 0.05 μm to 0.5 μm, the conductor layer includes a metal film formed on the surface of the insulating layer, and the inorganic fillers include a first inorganic filler including particles such that each of the particles has a portion of a surface separated from the resin and forming a gap with respect to the resin of the insulating layer and that the metal film of the conductor layer includes part formed in the gap between the first inorganic filler and the resin.

A method for embedding a line in a substrate. A line embedding head in positioned relative to a surface of the substrate. The line from an output port in the line embedding head is output at an angle relative to the embedding head such that the line is embedded in the substrate.

A substrate has a first surface and a second surface opposite to the first surface. The substrate has at least one first recess on the first surface and a second recess on the second surface. The substrate includes electrode pads. The electrode pads are in the at least one first recess. The substrate has the at least one first recess located separate from the second recess in a plan view.

A connector assembly includes a first signal pin formed to be in contact with a signal line of a circuit board; a first insulator surrounding the first signal pin; and a first housing accommodating the first signal pin and the first insulator and having a hole at a rear thereof corresponding to the first signal pin, wherein the first housing includes at least one clamping arm disposed on at least one side of the hole, protruding to a rear of the first housing, and having a lower surface formed to be in contact with an upper surface of the circuit board and the connector assembly further includes a ground plate disposed below the clamping arm and having an upper surface formed to be in contact with a lower surface of the circuit board; a clamping plate movably disposed below the ground plate; and a fastening member.

A printed structure comprises a device comprising device electrical contacts disposed on a common side of the device and a substrate non-native to the device comprising substrate electrical contacts disposed on a surface of the substrate. At least one of the substrate electrical contacts has a rounded shape. The device electrical contacts are in physical and electrical contact with corresponding substrate electrical contacts. The substrate electrical contacts can comprise a polymer core coated with a patterned contact electrical conductor on a surface of the polymer core. A method of making polymer cores comprising patterning a polymer on the substrate and reflowing the patterned polymer to form one or more rounded shapes of the polymer and coating and then patterning the one or more rounded shapes with a conductive material.

Isolators for high frequency signals transmitted between two circuits configured to operate at different voltage domains are provided. The isolators may include resonators capable of operating at high frequencies with high bandwidth, high transfer efficiency, high isolation rating, and a small substrate footprint. In some embodiments, the isolators may operate at a frequency not less than 30 GHz, not less than 60 GHz, or between 20 GHz and 200 GHz, including any value or range of values within such range. The isolators may include isolator components galvanically isolated from and capacitively coupled to each other. The sizes and shapes of the isolator components may be configured to control the values of equivalent inductances and capacitances of the isolators to facilitate resonance in operation. The isolators are compatible to different fabrication processes including, for example, micro-fabrication and PCB manufacture processes.

Medical devices include an elongate tubular shaft having a first and opposite second end; an electrical component located proximate the first end; a plurality of electrical conductors extending through the shaft and in electrical communication with the electrical component; and an interposer element mechanically and electrically coupling electrical conductors to the electrical component. The interposer element includes a backing element defining a longitudinal axis thereof and having a first and opposite second end portion. The first end portion having a forward edge defined by a center forward edge portion and first and second lateral forward edge portions on opposite sides thereof. The first and second lateral forward edge portions angularly extend relative to the center forward edge portion. The forward edge being shaped to facilitate, during assembly of the medical device, advancement of the interposer element through the elongate shaft with electrical conductors pre-attached to the interposer element.