A cable connector module includes a cable card assembly including a circuit card, cables terminated to the circuit card, and a cable holder coupled to the circuit card and holding the cables relative to the circuit card. The cables include cable conductors electrically connected to corresponding cable contacts of the circuit card. The cable holder holds each of the contacts and includes a connecting tab coupled to the circuit card. The circuit card includes front and rear retaining tabs. The cable connector module includes a connector shell having a cavity that receives the cable card assembly. The connector shell includes a front retainer at the front receiving the front retaining tab to hold the front of the circuit card relative to the connector shell. The connector shell includes a rear retainer at the rear receiving the rear retaining tab to hold the rear of the circuit card relative to the connector shell.

A conductive member for a touch panel includes a transparent insulating member; and a plurality of first electrodes extending in a first direction and arranged in parallel in a second direction intersecting the first direction, in which the plurality of first electrodes are constituted by a first mesh conductive film a plurality of fine metal wires are electrically connected, the plurality of first electrodes include a plurality of first main electrodes each having an electrode width Wa defined in the second direction and at least one first sub-electrode having an electrode width Wb smaller than Wa of the first main electrode in the second direction, the first sub-electrode is the first electrode arranged on an outermost side among the plurality of first electrodes, an opening ratio of the first sub-electrode is smaller than that of the first main electrode, and the first main electrode has a first dummy pattern.

A connection structure-embedded substrate includes: a printed circuit board including a plurality of first insulating layers of which at least one has a cavity provided therein, a plurality of first wiring layers disposed as at least one of an outer portion and an inner portion of the plurality of first insulating layers, and a first build-up insulating layer disposed on an upper surface of the plurality of first insulating layers; and a connection structure at least partially disposed in the cavity. The first build-up insulating layer is disposed in the cavity, and each of a lower surface of the connection structure and a lower surface of the cavity is in contact with at least a portion of the first build-up insulating layer, respectively.

A switch assembly, which is part of a chain of switch assemblies, includes a communication unit (CU) configured to receive, from an external controller, a fire command to activate a detonator and a computing core (CC) configured to locally make a decision whether or not to activate the detonator, after receiving the fire command to activate the detonator.

A high-frequency module (1) includes a substrate (10), a first electronic component (30) and a second electronic component (40) mounted on a main surface (10a) of the substrate (10). The substrate (10) has a protruding portion (20) projecting from the main surface (10a), the first electronic component (30) is mounted in a region of the main surface (10a) different from a region in which the protruding portion (20) is provided, and the second electronic component (40) is mounted on the protruding portion (20).

A solder composition for use in solder joints of printed circuit boards (PCBs), including a compound layer comprising an alloy of bismuth and tin; and a graphene coating positioned on the compound layer.

A transformer comprises a first magnetic core that defines a first channel and a second magnetic core that defines a second channel, wherein the first magnetic core is coupled to the second magnetic core. First and second posts are positioned within the first channel and within the second channel, wherein each of the first and second posts extend from the first magnetic core to the second magnetic core. A primary winding and a secondary winding of a transformer are formed around the first post. An inductor winding is formed around the second post. The inductor winding is electrically coupled to the primary winding providing the transformer with increased inductance. A thermal potting compound is disposed between the first and the second cores and used to conduct heat to a heatsink.

Provided is a manufacturing method of circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The third substrate has an opening and includes a first dielectric layer. The opening penetrates the third substrate, and the first dielectric layer fills the opening. Multiple conductive structures are formed so that the first substrate, the second substrate, the third substrate, and the fourth substrate are electrically connected through the conductive structures to define a ground path. A conductive via structure is formed to penetrate the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate. The conductive via structure is electrically connected to the first substrate and the fourth substrate to define a signal path, and the ground path surrounds the signal path.

A printed circuit board according to one embodiment of the present invention comprises an insulation board and a plurality of metal electrodes disposed on the insulation board, wherein: the plurality of metal electrodes include a first electrode and a second electrode; the first electrode includes a first surface parallel to an upper surface of the insulation board, a second surface facing the first surface, a first side surface disposed between the first surface and the second surface, and a second side surface facing the first side surface; a part of the first side surface and a part of the second side surface protrude toward the outside of the first electrode in the direction parallel to the upper surface of the insulation board; the first side surface protrudes farther in an area adjacent to the first surface than in an area adjacent to the second surface; and the second side surface protrudes farther in the area adjacent to the second surface than in the area adjacent to the first surface.

A component carrier and a method for manufacturing a component carrier is described wherein the component carrier includes a carrier body with a plurality of electrically conductive layer structures and/or electrically insulating layer structures and a wiring structure on and/or in the layer structures where the wiring structure is at least partially formed as a three-dimensionally printed structure.