A telematics device includes a housing, and first and second circuit boards. An electronic control unit of the telematics device is arranged on the first circuit board. At least one antenna of the telematics device is arranged on the second circuit board. The first circuit board and the second circuit board are arranged together in the housing. The first circuit board and the second circuit board are coupled by means of at least one electrical connecting element.

In one embodiment, an apparatus generally comprises a printed circuit board comprising a first side, a second side, and a plurality of power vias extending from the first side to the second side, the first side configured for receiving an application specific integrated circuit (ASIC), and a power delivery board mounted on the second side of the printed circuit board and comprising a power plane interconnected with power vias in the power delivery board to electrically couple voltage regulator modules and the ASIC. The voltage regulator modules are mounted on the second side of the printed circuit board.

A liquid ejecting apparatus includes a drive element, and a drive circuit that outputs a drive signal that drives the drive element, wherein the drive circuit includes a modulation circuit that modulates a base drive signal to output a modulation signal, an amplifier circuit that amplifies the modulation signal to output an amplified modulation signal, a demodulation circuit that demodulates the amplified modulation signal to output the drive signal, and a substrate on which the modulation circuit, the amplifier circuit, and the demodulation circuit are provided, wherein the substrate includes a base material includes a metal and a first layer laminated on the base material, wherein the first layer includes a first propagation wire through which at least one of the amplified modulation signal and the drive signal propagates, and wherein the base material has a thickness greater than a thickness of the first layer.

An electronic device is provided. The electronic device includes a housing, a printed circuit board disposed inside the housing and including a first face and a second face that faces away from the first face, a connection member disposed on the first face and electrically connected to the printed circuit board, a switch member disposed on the first face and at least partially overlaps the connection member when viewed from above the first face, and a button member including an electrically conductive member, and disposed to be capable of operating the switch member. The electrically conductive member is electrically connected to the connection member.

An electronic device comprises a supporting substrate, a flexible substrate disposed on the supporting substrate, a plurality of electronic units and a conductive pattern layer. The flexible substrate is bent from a front side to a back side of the supporting substrate, and a portion of the flexible substrate is disposed on the back side of the supporting substrate. The electronic units are disposed within a display region of the flexible substrate. The conductive pattern layer extends from the display region to the portion of the flexible substrate, and the conductive pattern layer electrically connects at least two of the electronic units.

Examples of card fasteners and assemblies for fastening cards to printed circuit boards are discussed. A card fastener comprises a frame comprising a first arm, a second arm, and an intermediate portion joining the first arm and the second arm. A compressive pad is attached to the intermediate portion. The first arm and second arm are to couple to hooks on a printed circuit board of a device and the compressive pad is to come in contact with the card.

An optoelectronic component includes an optical module and a host circuit board. The optical module includes a module circuit board and a gold finger that is located on a first surface of the module circuit board. The host circuit board includes a conductive elastomer corresponding to the gold finger and that is located on a first surface of the host circuit board. The module circuit board is located on the host circuit board, the first surface of the module circuit board and the first surface of the host circuit board face each other, and the gold finger is in contact with the conductive elastomer.

An integral toolless-installation Compression Attached Memory Module (CAMM) bolster plate has a generally flat, parallelepiped body portion configured to contact one surface of a CAMM Printed Circuit Board (PCB) and provide compression between the CAMM and a z-axis compression connector. The bolster plate body defines (a) ramped keyhole(s), each ramped keyhole converts lateral displacement of the toolless-installation CAMM bolster plate into vertical displacement, providing the compression between the CAMM and the z-axis compression connector, by the ramped keyhole(s) sliding along (a) bottom face(s) of (a) head(s) of (a) fixed standoff(s) extending from an information handling system (IHS) PCB, through the z-axis compression connector and the CAMM PCB. The integral toolless-installation CAMM bolster plate may lock in place, laterally displaced, to maintain the compression between the CAMM and the z-axis compression connector. The integral toolless-installation CAMM bolster plate may also have a flange portion extending generally perpendicular from the body portion.

A printed circuit board system includes a plurality of printed circuit board (PCB) assemblies that includes at least three PCB assemblies and a connecting module. The connecting module is coupled to each of the PCB assemblies. The connecting module is adapted to provide electrical and signal communications between each of the PCB assemblies. The connecting module is on different planes with respect to at least one of the PCB assemblies.

A circuit board module includes a first circuit board having a first main surface on which an electronic component that generates heat when the electronic component operates is mounted and a second main surface, a second circuit board having a third main surface on which the first circuit board is mounted and a fourth main surface, and a first thermally-conductive sheet between the first circuit board and the second circuit board. The first circuit board is mounted such that the second main surface faces the third main surface. The first circuit board includes thermally-conductive vias that extend between the first and second main surfaces, the vias being densely distributed in a region near a mounting terminal of the electronic component, filled with a thermally-conductive member, and physically in contact with the first thermally-conductive sheet that covers the third main surface of the second circuit board.