A display apparatus and an antenna assembly are provided. The display apparatus includes: a display; a first circuit board including at least one electronic part configured to process an image signal for displaying an image on the display; a second circuit board including at least one antenna configured to transmit and receive a radio frequency (RF) signal for communication between the display apparatus and an external apparatus; and a spacer provided between the first circuit board and the second circuit board, and configured to space the first circuit board and the second circuit board apart from each other. Thus, radiation performance in the antenna is improved with easy design based on the structure of the display apparatus. Thus, radiation performance in the antenna is improved with easy design based on the structure of the display apparatus.

A display device is provided. The display device includes an auxiliary substrate, a display substrate, and a circuit board. The auxiliary substrate includes an auxiliary circuit. The display substrate is disposed on the auxiliary substrate. The display substrate includes a circuit. The circuit board is electrically connected to the auxiliary substrate. The circuit of the display substrate is electrically connected to the auxiliary circuit through a first conductive via, and the circuit board provides a signal to the auxiliary circuit.

A storage drive, including: a main module, including: a main printed circuit board (PCB) having a first side positioned opposite to a second side; flash memory components positioned on the main PCB at a first end of the storage drive, a controller module positioned on the main PCB at a second end of the storage drive opposite to the first end; and a capacitor module, including: a module printed circuit board (PCB) having a first side positioned opposite to a second side; a plurality of capacitors positioned on the module PCB on the first side of the module PCB, wherein the capacitor module is coupled to the main module such that the capacitor module is positioned at the first end of the storage drive and the first side of the capacitor module faces the first side of the main module.

A method includes forming a plurality of dielectric layers, forming a plurality of redistribution lines in the plurality of dielectric layers, etching the plurality of dielectric layers to form an opening, filling the opening to form a through-dielectric via penetrating through the plurality of dielectric layers, forming a dielectric layer over the through-dielectric via and the plurality of dielectric layers, forming a plurality of bond pads in the dielectric layer, bonding a device die to the dielectric layer and a first portion of the plurality of bond pads through hybrid bonding, and bonding a die stack to through-silicon vias in the device die.

A motherboard including a main circuit board, a first connector, a power circuit board and a second connector. The first connector is disposed on the main circuit board. A periphery of the power circuit board is spaced apart from a periphery of the main circuit board. The second connector is disposed on the power circuit board. The first cable electrically connects the first connector with the second connector.

An electronic assembly that includes a rigid printed circuit board having an upper surface with a first plurality of lands. The electronic assembly further includes a flexible printed circuit board having a second plurality of lands on an upper surface. The lower surface of the flexible printed circuit board is directly attached to the upper surface of the rigid printed circuit board. The electronic assembly further includes a plurality of wires. Each of the wires is bonded to the first plurality of lands on the upper surface of the rigid printed circuit board and the second plurality of lands on the upper surface of the flexible printed circuit board.

A circuit board assembly includes a first circuit board, a second circuit board having a first side extending adjacent to a first side of the first circuit board, and a metal fitting including a portion bent at the angle and spanning both the first side of the first circuit board and the first side of the second circuit board. The second circuit board is in a posture having an angle other than 180° to the first circuit board. The metal fitting is fixed to both the first circuit board and the second circuit board.

Aspects of the disclosure provide a printed circuit board (PCB) system that includes an integrated circuit (IC) package, a first PCB and a PCB module. The IC package has a package substrate and an IC chip that is coupled to a top surface of the package substrate. The first PCB is configured to electrically couple with first contact structures that are disposed on a bottom surface of the package substrate. The PCB module includes a second PCB and one or more electronic components electrically coupled to the second PCB. The PCB module is configured to electrically couple with second contact structures that are disposed on the top surface of the package substrate.

Disclosed is an antenna module including a first printed circuit board (PCB) including a first surface facing a first direction and a second surface facing a second direction opposite the first direction, a second PCB including a third surface facing the first direction spaced from the first PCB and a fourth surface facing the second direction spaced from the first surface, a radio frequency integrated circuit (RFIC) disposed on the first surface, and a connection member comprising a conductive material connecting the first surface to the fourth surface. The at least one first conductive pattern is connected to the RFIC. The at least one third conductive pattern is connected to the RFIC via the connection member. The at least one first conductive pattern and the at least one third conductive pattern at least partially overlap with each other at least partly, when viewed from above the second surface.

A module, comprising: a printed circuit board (PCB); a power and management connector disposed on the PCB to connect to a computing device via a first cable; a data connector disposed on the PCB to connect to the computing device via a second cable; and a memory slot, to accept a memory device, disposed on the PCB and connected to the power and management connector and the data connector.