Methods, systems, and apparatus for a module electronics package. The modular electronics package includes a main circuit. The first main circuit board is configured to provide electrical interconnections to form an electric circuit. The modular electronics package includes a first power module. The first power module includes a first power device card and a first expansion slot. The first power device card is configured to be inserted into the first expansion slot and to be electrically coupled to the main circuit board via the first expansion slot.

The invention relates to A nose cone assembly for a munition, comprising a transducer array operably linked to a transmission assembly, wherein the transducer array is operably connected to a transducer housing, said transducer housing comprising a first and second surface, wherein said transmission assembly is reversibly operably connected to the second surface of said transducer housing, said transmission assembly comprising a control board and a plurality of electronic circuit boards, wherein at least one electronic circuit board is a transceiver circuit board, said electronic circuit boards being reversibly connected to the control board and being arranged along their longest dimension, at an axis substantially perpendicular to the control board and further arranged such that the electronic circuit boards extend radially inwardly to a substantially rotational centre of the control board.

A microwave or radio frequency (RF) device includes an insulating substrate having a first surface and a second surface opposing the first surface. The device also includes a crossover conductor disposed on the first surface extending between a first edge of the first surface and a second edge of the first surface. The device also includes a depression in the second surface defined at least in part by (i) a third surface recessed in relation to the second surface, and (ii) at least one sidewall that extends between the second surface and the third surface. The device further includes a conductive coating formed over at least a portion of the second surface, the third surface, and the at least one sidewall, where the conductive coating is insulated from the crossover conductor by the insulating substrate.

Disclosed is an industrial control device including a point-to-point backplane/point module architecture providing RIUP (Removal and Insertion Under Power) functionality where data communications between modules is maintained after the removal of a point module from the backplane. According to an exemplary embodiment, a backplane includes a plurality of passive mechanical bypass switches controlled by the insertion and removal of respective point modules, whereby data communicated bypass a removed point module interface and point-to-point data communications are provided to an inserted point module after an initial routine is executed by a microcontroller associated with the inserted point module.

The present disclosure provides a power converter including a first capacitor, a second capacitor, and a power module. The first capacitor and the second capacitor are connected in series. The power module is electrically connected to the first capacitor and the second capacitor and includes a circuit board, an absorption capacitor, a primary switch circuit, a magnetic component, and a secondary circuit. The absorption capacitor, the primary switch circuit, the magnetic component and the secondary circuit are disposed on the circuit board. A primary winding and a secondary winding of the magnetic component are electrically connected to the primary switch circuit and the secondary circuit respectively.

An example of an apparatus may comprise a first set of compression contact pads formed on a first side of a circuit board, a second set of compression contact pads formed on a second side of the circuit board opposite to the first side of the circuit board, where the first set of compression contact pads are respectively electrically connected to the second set of compression pads. An example of the circuit board may include a memory board. An example stackable memory module may include memory devices mounted to both sides of the memory board. Other examples are disclosed and claimed.

System for enabling circuit board surface-slot-edge connections. A main board includes a slot through its surfaces. At least one edge of the slot includes electrical contacts to the main board. An auxiliary board includes a connector component mounted on a surface that opposes a surface of the main board. When the connector component is aligned with the slot, the connector component can protrude vertically through the slot, in addition to moving laterally towards an edge of the slot. Electrical contacts on the edge of the slot can engage with electrical contacts in the connector component. This enables two boards to be arranged closely, without extending the main surface in an orthogonal or lateral direction, using a secure connection provided by a connector attached to the auxiliary board, rather than the main board.

An endoscope device and a cable assembly thereof are provided. The cable assembly includes a first substrate, a second substrate, and a wire. The first substrate includes a first body and a first solder pad disposed on the first body. The second substrate is correspondingly disposed on the first substrate and includes a second body, a second solder pad disposed on the second body and corresponding to the first solder pad, and an accommodating portion corresponding to the second solder pad. The wire includes a soldering portion disposed in the accommodating portion. The first solder pad and the second solder pad are coupled to each other by at least one of a first solder and a second solder, and the soldering portion and the second solder pad are coupled to each other by the first solder.

A receiver or transmitter designed for a broad range of frequencies requires a pre-select filter for incoming signals or a post-select filter for outgoing signals to minimize spurious signal responses. In conventional receivers, several discrete RF filters are used and a switched filter bank is created utilizing a large amount of space. A filter bank comprising a plurality of stacked shielded filters would enable different filter technologies and topologies to be used together, as other passive and active circuits may be combined into the one surface mountable component in order to save on PCB space.

A power module structure includes a first metal layer, a second metal layer, a third metal layer and a fourth metal layer, wherein the fourth metal layer is connected to the second metal layer via a connecting bridge; at least one first switch including a first end connected to the third metal layer and a second end connected to the second metal layer; and at least one second switch including a third end connected to the fourth metal layer and a fourth end connected to the first metal layer; wherein the projection of the first metal layer and the projection of the third metal layer are overlapped to form a first overlapping area; wherein the direction of the current flowing through the first metal layer is opposite to the direction of the current flowing through the third metal layer.