A printed circuit board with an embedded bridge includes: a first connection structure including a first insulating film; a bridge disposed on the first connection structure and having one surface, in contact with the first insulating film; and a second connection structure disposed on the first connection structure, and including a second insulating film. The second insulating film covers at least a portion of the other surface of the bridge.

A system for incorporating electronic functionality into a flexible layer includes a flexible printed circuit board having a spine portion and one or more legs in electronic communication with the spine portion. Multiple pads may be disposed on the flexible printed circuit board. The spine portion and the one or more legs may be structured and arranged to be disposed within one or more pockets of the flexible layer. The system may further include electronic devices, each one of which may be in electronic communication with at least one of the pads. In addition, the system may include a controller in electronic communication with at least one of the pads. The system may be characterized by an absence of any external hard-wire interfaces for communication external to the system.

A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.

A method for manufacturing a board-to-board connecting structure, including providing a first circuit board, including a first dielectric layer, a second dielectric layer stacked on the first dielectric layer, and a first wiring layer sandwiched between the first dielectric layer and the second dielectric layer. A second circuit board is provided, including a third dielectric layer, a fourth dielectric layers stacked on the third dielectric layer, and a second wiring layer sandwiched between the third dielectric layer and the fourth dielectric layer. The first step and the fourth dielectric layer are bonded through a first adhesive layer. The third step and the dielectric layer are bonded through a second adhesive layer. The second step and the fourth step are bonded through the conductive layer.

Aa display device includes a display panel including a plurality of panel pads, a connection board including a plurality of connection lines, and a circuit board including a plurality of board pads. The plurality of connection lines are spaced apart from each other. Each of a connection line among the plurality of connection lines includes: a first end portion at which the connection line is connected to the display panel, the first end portion being in direct contact with a panel pad, and a second end portion opposite to the first end portion and at which the connection line is connected to the circuit board, the second end portion being in contact with a board pad.

A display device includes a display panel, and an input sensor disposed on the display panel. The input sensor includes a detection electrode in an active area of the input sensor, a signal line connected to the detection electrode, a slave chip connected to the signal line and overlapping a non-active area adjacent to the active area, a master chip overlapping the non-active area, and a plurality of connection lines connecting the master chip and the slave chip so that a sensed signal of the detection electrode is delivered to the master chip through the slave chip.

A printed circuit board (PCB) assembly with a first PCB connected to a second PCB with a flexible interconnect and a vapor chamber for positioning between the first PCB and the second PCB. The flexible interconnect allows the PCB assembly to be in an open configuration or a closed configuration. In the closed configuration, the vapor chamber is between the two PCBs. The flexible interconnect supplies a portion of the electric power from the first PCB to the second PCB and a power connector supplies a second portion of the electric power. Grounding springs allow localized grounding of the PCB assembly. The flexible interconnect, the power connector and the grounding springs provide structural support for the second PCB. The vapor chamber may be longer than the PCBs to draw heat away from components and the flexible interconnect may be used as an airflow guide for improving airflow over components.

Provided is a device for transmitting signals, the device including: a first conductive base and a second conductive base parallel to each other, a waveguide at least partially surrounded by side walls located between the first conductive base and the second conductive base and including at least one electromagnetic band gap (EBG) structure, and at least two directional antennas opposite to or facing each other in a direction in which signals are transmitted, wherein each antenna is on a printed circuit board and includes another EBG structure located on an upper layer and a lower layer of the printed circuit board and at least one matching element, at least a part of each of the antennas is located inside the waveguide to form a wireless channel configured to transmit electromagnetic signals in an area between the antennas, and the at least one matching element is located within a specified distance of the wireless channel and is configured to match the antenna with the wireless channel.

An electronic device is provided that includes a first circuit board including a first electronic component and a second electronic component disposed on a side of the first circuit board, a second circuit board spaced apart from the first circuit board and having a side facing the side of the first circuit board on which the first electronic component and the second electronic component are disposed, a first interposer disposed between the first circuit board and the second circuit board to form an inner space between the first circuit board and the second circuit board, and a second interposer disposed between the first circuit board and the second circuit board to divide the inner space into a first region and a second region, wherein the first electronic component on the first circuit board is disposed corresponding to the first region, and the second electronic component on the first circuit board is disposed corresponding to the second region, and wherein the first interposer and the second interposer electrically connect the first circuit board to the second circuit board.

A circuit structure includes a first busbar, a second busbar, an insulating member including an insulating portion located between the first busbar and the second busbar, a first wiring board provided on one main surface of the first busbar, one main surface of the second busbar and the insulating portion, and a first electronic component provided on the first wiring board. The first electronic component has a first connection terminal electrically connected to the first busbar and bonded to the first wiring board, and a second connection terminal electrically connected to the second busbar and bonded to the first wiring board.