An electronic device is disclosed. In one example, the electronic device comprises a carrier board, a metal inlay having a cavity and being arranged in the carrier board. At least one electronic component is arranged at least partially in the cavity and embedded in the carrier board. Electric contacts are located at a castellated edge of the carrier board.

A printed circuit board (PCB) assembly with a first PCB connected to a second PCB with a flexible interconnect and a vapor chamber for positioning between the first PCB and the second PCB. The flexible interconnect allows the PCB assembly to be in an open configuration or a closed configuration. In the closed configuration, the vapor chamber is between the two PCBs. The flexible interconnect supplies a portion of the electric power from the first PCB to the second PCB and a power connector supplies a second portion of the electric power. Grounding springs allow localized grounding of the PCB assembly. The flexible interconnect, the power connector and the grounding springs provide structural support for the second PCB. The vapor chamber may be longer than the PCBs to draw heat away from components and the flexible interconnect may be used as an airflow guide for improving airflow over components.

Please replace the Abstract with the following: In an embodiment a LED chip insert for a printed circuit board includes a lead frame in which a number of electrically conductive strings with respective ends are formed by punching, the strings having support surfaces which are configured for mounting on the printed circuit board and which form a common plane, wherein the lead frame has a region formed as a recess with respect to the ends, an injection molded frame including an electrically insulating material and annularly surrounding a surface of the lead frame exposed within the region formed as the recess facing the ends of the strings, and thereby effecting an overall trough-like structure; and at least one LED chip which is placed in the region formed as the recess and has a first electrical contact terminal and a second electrical contact terminal, the first electrical contact terminal being electrically conductively connected to a first one of the strings and the second electrical contact terminal being electrically conductively connected to a second one of the strings.

The electronic module including a metal base, a ceramic substrate, and a die-capacitor is disclosed. The ceramic substrate is mounted on the metal base via eutectic solder. The ceramic substrate includes a main substrate having a back surface facing the metal base and a front surface opposite to the back surface, and a back metal layer placed on the back surface of the main substrate and joined to the eutectic solder. The die-capacitor is mounted on the front surface of the ceramic substrate along one edge of the ceramic substrate. The back surface of the ceramic substrate is provided with an exposure region where the back metal layer is not provided. The exposure region includes a main region corresponding to an outer shape of the die-capacitor spreading along the front surface and an edge region extending from the main region to the one edge of the ceramic substrate.

Embodiments of the present disclosure provide a robot arm apparatus including a fastener for fastening a first electronic component to a second electronic component, and a movable part configured to move the fastener. The fastener includes an arm connected to the movable part, a head connected to the arm and configured to contact the first electronic component, and a lock configured to be in contact with the arm when the first electronic component is moved to a reference space, and to be spaced apart from the arm when the first electronic component is fastened to the second electronic component after the first electronic component is moved to the reference space.

A power module includes at least one electrically conductive power substrate; and a plurality of power devices arranged on and connected to the at least one electrically conductive power substrate. The power module further includes at least one elevated signal element electrically connected to the plurality of power devices and/or at least one elevated power plane electrically connected to the at least one electrically conductive power substrate and electrically connected to the plurality of power devices.

A connection structure embedded substrate includes a printed circuit board including a first insulating body and a plurality of first wiring layers disposed on at least one of an external region or an internal region of the first insulating body; and a connection structure embedded in the first insulating body and including first and second substrates. The first and second substrates are disposed adjacent to each other.

A packaging method includes steps of: forming first and second wiring layers electrically connected to each other on two opposite surfaces of a substrate; then configuring mother substrate interconnecting bumps on the first wiring layer and along perimeter of a daughter substrate unit, and then cutting along the perimeter of the daughter substrate unit to expose lateral faces of the mother substrate interconnecting bumps and configuring solder materials thereon; then configuring first and second chips on the first and the second wiring layers to form electrical interconnection between the two chips. A package structure enables interconnecting two chips through one single daughter substrate unit with its wiring layers directly connecting with lateral face contacts of the mother carrier substrate through the mother substrate interconnecting bumps. Hence, area of the daughter substrate unit is reduced; lengths of the interconnection paths are shortened, and qualities of communication and space utilization are enhanced.

An electronic device is disclosed, including: a housing including a first surface, a second surface parallel to the first surface, and a side surface surrounding a space formed between the first surface and the second surface, a first printed circuit board (PCB) disposed on the first surface of the housing, a second PCB disposed on the first surface of the housing and spaced apart from the first PCB, a flexible printed circuit board (FPCB) connecting the first PCB and the second PCB, a conductive sheet disposed on the second surface of the housing and spaced apart from the first PCB, the second PCB, and the FPCB, and an insulating member disposed on one surface of the FPCB and contacting the conductive sheet.

Various embodiments of the disclosure relate to a printed circuit for transmitting a signal in a high-frequency band and an electronic device including the same. The printed circuit board may include a flexible circuit board configured to transmit a signal in a high-frequency band, and the flexible circuit board may include: first multiple layers including a power line configured to transmit power; and second multiple layers stacked in a first direction of the first multiple layers and including a first signal line and a second signal line configured to transmit a signal in the high-frequency band. The first multiple layers may include a first punched region in which at least a portion overlapping the first signal line and the second signal line is removed, the second multiple layers may include a second punched region in which at least a portion overlapping the power line is removed, and at least a portion of the second punched region and the first punched region overlap each other forming a slit penetrating the flexible circuit board in the first direction.