An enclosed electrical device such as a battery pack for an electric powertrain system includes an enclosure having a tray and cover. The tray and cover together define an enclosure cavity. A radio frequency (RF) receiving node is located within the cavity. Printed circuit board assemblies (PCBAs) include an RF transmitting node. The PCBAs(s) are spaced apart from one another within the cavity. An RF shield guide layer is positioned between the PCBAs and the cover, such that the RF shield guide layer covers the PCBAs without covering the RF transmitting node. A battery pack and an electric powertrain system include the RF shield guide layer.

An electrical apparatus has an external conductive housing. A printed circuit board is provided (separate to a main circuit board of the apparatus) within a PCB housing. The printed circuit board is mechanically and electrically connected to the external housing and has an arc gap between a first contact which connects electrically to the external housing and a second contact which connects electrically to a power supply terminal. Thus, a dedicated circuit is used to perform a discharge function so that the housing and main circuit board do not need to be redesigned.

A fingerprint sensor package includes a substrate, a fingerprint sensor chip, and a flexible printed circuit board (FPC). The substrate includes a first portion and a second portion. A line layer is disposed on the first portion. The fingerprint sensor chip is disposed on the substrate. The fingerprint sensor chip is electrically connected to the FPC by the line layer. The package is simple, reliable, and easy for manufacturing process, reducing materials and processing costs.

An electrical board-to-board connector including a flexible cable assembly having a low profile or dimensionally reduced configuration. The connector body of a cable assembly may be widened to provide the structural rigidity sufficient to support an array of solder lead connections. Other support elements may be omitted from the cable assembly, which results in a reduced height dimension. The flexible cable assembly may also include a cowling used to retain the cable assembly against a circuit board. The cowling may also be configured to reduce the dimensions or dimensional footprint of the connection.

A printed circuit board with an embedded bridge includes: a first connection structure including a first insulating film; a bridge disposed on the first connection structure and having one surface, in contact with the first insulating film; and a second connection structure disposed on the first connection structure, and including a second insulating film. The second insulating film covers at least a portion of the other surface of the bridge.

A layout method applied to a connector is provided. The connector is electrically connected between a flexible printed circuit (FPC) and a printed circuit board (PCB). The FPC includes M pairs of differential lines and X shield lines. The PCB includes M pairs of differential lines and Z shield lines. The layout method includes following steps. Firstly, M pairs of conductive lines are disposed on the connector. The M conductive lines are correspondingly electrically connected to the M differential lines of the FPC and the M differential lines of the PCB. Then; Y conductive lines are disposed on the connector, wherein Y is smaller than X. Furthermore, at least one of the Y conductive lines is electrically connected to at least one of the X shield lines and at least one of the Z shield lines.

A light emitting device having a plurality of light emitting elements, a first substrate having a plurality of wire layers and mounting the plurality of light emitting elements, a second substrate forming an opening into which the first substrate is inserted, and having smaller thermal conductivity than that of the first substrate, first wires disposed on the uppermost wire layer in the plurality of wire layers on the first substrate, and connected with the plurality of light emitting elements, second wires disposed on a wire layer different from the wire layer on which the first wires are disposed, and connected with the first wires via any of a plurality of through holes formed between the wire layers on which the first and second wires are disposed, third wires disposed on the second substrate, and fourth wires disposed across the boundary between the first substrate and the second substrate, and connecting the first wires with the third wires.

An electricity storage unit includes: an electricity storage device; a circuit portion on which an electronic component is mounted; a heat dissipation member that dissipates heat from the circuit portion; and a holding member that holds the electricity storage device in a state where the electricity storage device, the circuit portion, and the heat dissipation member are stacked, wherein the holding member is provided with a supporting portion that supports the electricity storage device and abuts against the heat dissipation member.

A tiling display device comprises a plurality of display devices, and a main circuit board driving the plurality of display devices. Each of the plurality of display devices includes a display panel that displays an image, a plurality of flexible films bonded to a rear surface of the display panel, and a printed circuit board electrically connected to the plurality of flexible films. A plurality of printed circuit boards of the plurality of display devices are cascaded to each other and the plurality of printed circuit boards have a same shape. Therefore, the efficiency of a manufacturing process of the plurality of printed circuit boards provided in a tiling display device can be improved.

A board-to-board connecting structure which adds no significant thickness to a single printed circuit board includes a first circuit board and a second circuit board. The first circuit board includes first circuit substrate, adhesive layer, and second circuit substrate. The first circuit substrate includes first base layer, first inner wiring layer with first pad, and first outer wiring layer defining a receiving space. The second circuit substrate includes insulating layer and two second outer wiring layers. A conductive via in the second circuit substrate connects the two second outer wiring layers. The second circuit board includes second base layer and also two third outer wiring layers each with a second pad. The second circuit board is laterally disposed in the receiving space and one second pad connects to the conductive via and the other to the first pad.