In the case where as a communication means among two or more control circuit boards corresponding to an on-vehicle environment, a wire harness is mounted, space-saving efficiency and assembly efficiency pose problems. When a board-to-board connector is utilized, arrangement of the control circuit boards cannot freely be performed, due to restriction of predetermined specific dimensions. An electric-power conversion apparatus includes a cooling device having a first surface, a second surface opposite to the first surface, and a hole penetrating the first surface and the second surface, a first control circuit board provided at the first surface side, a second control circuit board provided at the second surface side, and a pin header having a mold portion that partially wraps a connection pin penetrating the hole so as to connect the first control circuit board with the second control circuit board and that is fixed to the cooling device.

A laser ignition assembly comprises first and second mounting surfaces opposed to each other. A central cavity is formed through the surfaces and sized to receive energetic material therein. A vertical solder bridge is formed between the surfaces and an edge emitting laser diode disposed between the surfaces. The laser diode is oriented such that a light fluence therefrom is directed in a radial direction into the central cavity. The surfaces can be circuit boards, e.g., copper clad, rigid circuit boards, and have an annular shape. The central cavity can be further defined by an interboard gap between the surfaces. The ignition assembly can fit within a primer cup of a munition.

A high voltage power supply can be compact with shielded electronic components. The power supply can include multiple stages separated by circuit boards. Electronic components for each stage can be directly soldered to adjacent circuit boards. Traces can pass through and electrically couple electronic components on each side of the circuit board between them.

An electronic device is provided. The electronic device includes a housing, a first printed circuit board disposed in the inner space of the housing, a second printed circuit board disposed so as to overlap at least a portion of the first printed circuit board, when the first printed circuit board is viewed from above, a first interposer disposed between the first printed circuit board and the second printed circuit board, and electrically connecting the first printed circuit board and the second printed circuit board, and at least one second interposer which is disposed between the first printed circuit board and the second printed circuit board so as to be spaced apart from the first interposer when the first printed circuit board is viewed from above, and which electrically connects the first printed circuit board and the second printed circuit board.

Disclosed are a printed circuit board connector according to an embodiment and a module device including same. The printed circuit board connector comprises: a substrate; holes formed in the substrate at predetermined intervals and coated with a metal material on the inner circumferential surface thereof so as to form a metal layer; a first metal pad formed at one end of the holes and connected to the metal layer; and a second metal pad formed at the other end of the holes and connected to the metal layer.

A multilayer substrate includes a base body including a first main surface, a first external electrode provided on the first main surface and made of metal foil, a first interlayer connection conductor, and a second interlayer connection conductor having higher conductivity than the first interlayer connection conductor. The base body includes insulating base material layers that are stacked on one another. The first interlayer connection conductor is provided at least in an insulating base material layer on which the first external electrode is provided, and is connected to the first external electrode. The second interlayer connection conductor is disposed inside the base body, and is connected to the first external electrode through the first interlayer connection conductor.

Disclosed is an antenna module including a first printed circuit board (PCB) including a first surface facing a first direction and a second surface facing a second direction opposite the first direction, a second PCB including a third surface facing the first direction spaced from the first PCB and a fourth surface facing the second direction spaced from the first surface, a radio frequency integrated circuit (RFIC) disposed on the first surface, and a connection member comprising a conductive material connecting the first surface to the fourth surface. The at least one first conductive pattern is connected to the RFIC. The at least one third conductive pattern is connected to the RFIC via the connection member. The at least one first conductive pattern and the at least one third conductive pattern at least partially overlap with each other at least partly, when viewed from above the second surface.

A power module structure includes a first metal layer, a second metal layer, a third metal layer and a fourth metal layer, wherein the fourth metal layer is connected to the second metal layer via a connecting bridge; at least one first switch including a first end connected to the third metal layer and a second end connected to the second metal layer; and at least one second switch including a third end connected to the fourth metal layer and a fourth end connected to the first metal layer; wherein the projection of the first metal layer and the projection of the third metal layer are overlapped to form a first overlapping area; wherein the direction of the current flowing through the first metal layer is opposite to the direction of the current flowing through the third metal layer.

Interposer printed circuit boards for power modules and associated methods are disclosed. In at least one illustrative embodiment, a printed circuit board assembly may comprise a printed circuit board, an electrical component mounted on a surface of the printed circuit board, and an interposer printed circuit board mounted on the surface of the printed circuit board. The interposer printed circuit board may comprise a first signal path to transmit a first electrical signal and a second signal path to transmit a second electrical signal that is different from the first electrical signal. The interposer printed circuit board may be configured to provide a standoff to prevent the electrical component from contacting a motherboard when the printed circuit board assembly is mounted to the motherboard.

A method and apparatus for conducting heat away from a semiconductor die are disclosed. A board assembly is disclosed that includes a circuit board, a semiconductor die electrically coupled to the circuit board and a Chemical Vapor Deposition Diamond (CVDD) coated wire. A portion of the CVDD-coated wire extends between a hot-spot on the semiconductor die and the circuit board. The board assembly includes a layer of thermally conductive paste that is disposed between the hot-spot on the semiconductor die and the circuit board. The layer of thermally conductive paste is in direct contact with a portion of the CVDD-coated wire.