An electronic device includes a first printed circuit board; a second printed circuit board spaced apart from the first printed circuit board; a connection member electrically connecting the first printed circuit board and the second printed circuit board, the connection member including a first connection part connected to the first printed circuit board and a second connection part connected to the second printed circuit board; and a first intermediate member including: a first connector provided on a first surface of the first intermediate member facing the first printed circuit board and electrically connected to the first printed circuit board; and a second connector provided on a second surface of the first intermediate member opposite to the first surface and electrically connected to the connection member and the first connector, wherein the first connector and the second connector are separated from each other in a first direction.

A circuit board module includes a first circuit board, a second circuit board facing the first circuit board, a connecting device fixed between the first circuit board and the second circuit board, and an adapter board fixed to the connecting device and disposed between the first circuit board and the second circuit board. The adapter board is inserted into the first circuit board and the second circuit board.

A substrate layered structure including a first circuit board; a second circuit board overlapping the first circuit board; and interposer blocks interposed between the first circuit board and the second circuit board and spaced apart from each other. Further, each corresponding interposer block includes a dielectric block body; a plurality of signal via holes passing through the dielectric block body and transferring signals between the first circuit board and the second circuit board; and a plurality of signal pads arranged at first ends of the signal via holes and connected to the first circuit board and arranged at second ends of the signal via holes and connected to the second circuit board.

According to various embodiments, a power converter circuit is disclosed. The power converter circuit includes at least two vertically stacked printed circuit boards (PCBs) comprising a top PCB and a bottom PCB. The power converter circuit further includes at least one multiphase coupled inductor placed between the top PCB and the bottom PCB. The top PCB is coupled to the bottom PCB via at least one conductive winding of the multiphase coupled inductor. The power converter circuit further includes at least one circuit module placed above the top PCB and at least one power source placed below the bottom PCB. The multiphase coupled inductor is configured to deliver current vertically from the bottom PCB to the top PCB.

A circuit comprises a first printed circuit board (60) carrying a first set of components and a second printed circuit board (62) carrying a second set of components, with a clearance (64) between the first and second printed circuit boards. A transformer (66) has a primary side connected to the first set of components and a secondary side connected to the second set of components. One of the transformer windings, and its connection to a respective set of components, comprises a triple insulated wire. A glass, ceramic or mica spacer (70) mounted to the first and second printed circuit boards defines and sets the clearance (64) between the first and second printed circuit boards. The clearance requirement is met by providing separate printed circuit boards with spacing between them and the use of a triple insulated wire addresses or overcomes issues of creepage. Thus, high frequency and high voltage operation on the first printed circuit board is possible.

An electronic device may include: a housing forming at least a portion of the exterior of the electronic device; a first printed circuit board (PCB) disposed in a first region formed by the housing; a second printed circuit board disposed in a second region formed by the housing; a first antenna module disposed in a third region formed by the housing and adjacent to at least a portion of the exterior; a bracket which fixes the first antenna module to the housing; a flexible printed circuit board (FPCB) which electrically connects the first printed circuit board to the first antenna module; and at least one coaxial cable which electrically connects the first printed circuit board to the second printed circuit board, wherein the at least one coaxial cable may be disposed so as to be stacked with the first antenna module with respect to the direction perpendicular to the rear surface of the electronic device and may be fixed to the bracket. Other various embodiments are possible.

Examples are disclosed herein that relate to linear magnetic actuators in camera devices. One example provides a camera device comprising an optical sensor, a lens positioned a variable distance away from the optical sensor, a linear magnetic actuator having a coil and a magnet configured for linear relative movement upon driving of current, and an actuator coupling structure. The actuator coupling structure couples the linear magnetic actuator to the lens, such that the lens moves in response to the movement of the linear actuator.

An integrated power module packaging structure includes a plastic housing having a cavity; a plurality of step-shaped pins embedded in the plastic housing, a first printed circuit board disposed in the cavity, and a second printed circuit board disposed above the first printed circuit board in the cavity. Each of the step-shaped pins includes a first L-shaped bending portion and a second L-shaped bending portion connected to each other. The first printed circuit board is disposed with at least a power device and is electrically connected to at least a part of the first L-shaped bending portions. Two opposite surfaces of the second printed circuit board are respectively disposed with at least an electronic device, and the second printed circuit board is electrically connected to at least a part of the second L-shaped bending portions.

The present invention relates to a power module and a method for manufacturing same, the power module comprising: a ceramic substrate including a ceramic base and an electrode pattern formed on the upper and lower surfaces of the ceramic base; a PCB substrate disposed above the ceramic substrate and including an electrode pattern; a plurality of through-holes formed in at least one of the ceramic substrate and the PCB substrate; and a connection pin coupled to the through-holes and connecting the electrode pattern of the ceramic substrate and the electrode pattern of the PCB substrate to each other. The present invention has advantages in that it is easy to fix the connection pin to the ceramic substrate, the position accuracy of the connection pin is improved, and the convenience of assembly is increased.

The embodiments of the present disclosure provide a synchronous rectifier module, comprising: a transformer provided with a plurality of secondary windings, a first circuit board and a second circuit board disposed on opposite sides of the transformer, and a first connecting piece electrically connected to the first circuit board and a second connecting piece electrically connected to the second circuit board; the first connecting piece and the second connecting piece comprise current sharing portions connected to the first circuit board and the second circuit board respectively, and inductor portions which penetrate an inductance core side by side to form an output inductor, resistance values of the current sharing portions of the first connecting piece and the second connecting piece being equal or a resistance difference value therebetween being within a preset range. The present disclosure can quickly, accurately and conveniently improve the efficiency and the heat dissipation of the synchronous rectifier module, and achieve a better current sharing effect of the connecting pieces by adjusting the resistance value numerical range of the two connecting pieces.