A display panel includes an array substrate, a first flexible circuit board, a non-flexible circuit board, a control circuit board and a second flexible circuit board; the first flexible circuit board is electrically connected to the array substrate; the non-flexible circuit board is electrically connected to the first flexible circuit board; the control circuit board is provided on the non-flexible circuit board and is electrically connected with the non-flexible circuit board; the second flexible circuit board is electrically connected to the non-flexible circuit board.

The present disclosure provides a display device and a splicing screen, relating to the field of display equipment. The display device includes a liquid crystal display screen, a lamp board, and a printed circuit board. The lamp board includes a flexible circuit board and a plurality of light-emitting diodes. The flexible circuit board includes a first part and a second part connected to each other. The light-emitting diodes are disposed on the first part, and the first part is disposed on an edge of a front surface of the liquid crystal display screen. The second part extends outside of the liquid crystal display screen to a rear surface of the liquid crystal display screen and is detachably plugged into the printed circuit board disposed on the rear surface. Since the first part is disposed on the edge of the front surface of the liquid crystal display, a picture displayed on the light-emitting diodes can block an edge region of the liquid crystal display screen. Therefore, when a plurality of display devices is spliced into a splicing screen, split seams can be reduced or even eliminated, thereby improving visual effect.

A solid-state drive (SSD) includes a first rigid printed circuit board comprising a surface that defines a first plane. A second rigid printed circuit board of the SSD comprises a surface that defines a second plane that is substantially parallel to the first plane. A flexible interconnect couples the first rigid printed circuit board and the second rigid printed circuit board. The flexible interconnect partially encloses a volume. A capacitor is disposed within the volume.

An electronic device is provided. The electronic device includes a hinge structure, a first housing structure, a second housing structure that is foldable with the first housing structure, a foldable housing, a flexible display, a first mid-plate disposed on one side of the first housing structure, a second mid-plate disposed on one side of the second housing structure, a flexible printed circuit board (FPCB) extending between the first mid-plate and the second mid-plate, a first sealing member that seals a first opening formed in the first mid-plate, and a second sealing member that seals a second opening formed in the second mid-plate.

An integrated circuit includes a nexus and a first, a second, a third, and a fourth circuit board. Each of the first and second circuit boards is coupled to opposing sides of the nexus, and each of the third and fourth circuit boards is coupled to opposing sides of the second circuit board. The integrated circuit is transitionable between a first, open configuration, in which the first, second, third and fourth circuit boards and the nexus are substantially coplanar, and a second configuration, in which the first, second, third and fourth circuit boards and the nexus are coupled to one another to define a cavity therein.

A radar calibration system is for being disposed on a vehicle. The radar calibration system includes a sensing unit and a housing. The sensing unit includes a receiving antenna array, which includes at least four receiving antennas. The receiving antennas are arranged on an antenna plane and have a receiving antenna center. A distance between the receiving antenna center and a ground plane is greater than 40 cm. The receiving antennas are arranged asymmetrically with respect to the receiving antenna center. The housing includes a bottom surface, which is attached on an outer surface of the vehicle. The sensing unit is disposed in the housing. An antenna plane angle between the antenna plane and the outer surface of the vehicle is in a range of 0 degrees to 90 degrees.

A semiconductor module includes a semiconductor device having a first land, a second land, and a third land, a wiring board having a substrate, and a fourth land, a fifth land, and a sixth land disposed on the main surface of the substrate, a chip component having a first electrode and a second electrode disposed across a distance in the longitudinal direction and being disposed between the wiring board and the semiconductor device, a first solder joint for bonding the first land, the fourth land, and the first electrode, a second solder joint for bonding the second land, the fifth land, and the second electrode, and a third solder joint for bonding the third land and the sixth land. The volume of the first solder joint and the volume of the second solder joint are each larger than the volume of the third solder joint.

An integrated millimeter wave antenna module may include at least one antenna array directly connected to a wiring board with a flexible printed circuit without any additional connectors. The integrated module may include an antenna, a flexible printed circuit attached to the antenna on one end and a wiring board on the other end.

An electronic device is provided. The electronic device includes a display panel, a first connection member on which a display driver integrated circuit (DDIC) configured to control the display panel is disposed, a first contact point part disposed on the first connection member, a second contact point part spaced apart from the first contact point part in a second direction perpendicular to the first direction and disposed on the first contact point part, a second connection member disposed adjacent to the first connection member, a third contact point part arranged in the first direction and is disposed on the first layer of the second connection member to be connected to the first contact point part, and a fourth contact point part arranged in the first direction and is arranged on the second layer of the second connection member to be connected to the second contact point part.

A multilayer printed circuit board including a first printed circuit board portion, including a first inserting connector, including a plurality of contacts for creating a first removable bus connection; a second printed circuit board portion, including a second inserting connector, including a plurality of contacts for creating a second removable bus connection; a third printed circuit board portion, connected between the first printed circuit board portion and to the second printed circuit board portion, wherein a rigidity of the third printed circuit board portion is less than a rigidity of each of the first printed circuit board portion and the second printed circuit board portion; wherein the multilayer printed circuit board is foldable along the third printed circuit board portion and, if so folded, the first printed circuit board portion is arranged on top of the second printed circuit board portion.