A sample holder includes a base comprising a support structure and a printed circuit board (PCB) in contact with the base. The PCB has a through hole. The PCB has a cavity in at least a part of the base below the through hole. The support structure that supports a surface of a chip and is electrically connected to the base. The support structure is disposed in the cavity. At least a part of the section supporting the chip in the support structure is not parallel to the back surface of the chip.

Embodiments of the present application provide a laser light source and a laser projection device. The laser light source includes a laser assembly, where the laser assembly includes a laser and a circuit board, the laser includes a substrate and a light emitting chip arranged on the substrate, a lateral surface of the substrate is provided with a plurality of pins extending outwards therefrom, the circuit board is arranged on a side where the pins extend, and the circuit board is electrically connected to the pins. The laser light source of the present application features simple assembling and disassembling, reliable performance and relatively low cost.

The present disclosure relates to an electronic device comprising a wafer comprising a first upper surface having at least one first contact arranged thereon; and at least one die comprising a second upper surface having at least one second contact arranged thereon, and at least one first lateral surface orthogonal to the second upper surface, said first contact being coupled to said second contact by a connector comprising one first conductive pillar formed on said first contact of said wafer; one second conductive pillar formed on said second contact of said die; and at least one conductive ball positioned in contact with at least a first upper portion of said first pillar(s) and in contact with at least one second upper portion of said second pillar(s).

A semiconductor-based capacitor can include a substrate including a semiconductor material, an oxide layer formed on a surface of the substrate, a conductive layer formed over at least a portion of the oxide layer, a plurality of distinct coplanar upper terminals, and at least one lower terminal formed. Each of the upper terminals and the at least one lower terminal can be exposed along the top and bottom surfaces of the substrate, respectively, for embedding the capacitor in a substrate such as a circuit board. The semiconductor-based capacitor can be sufficiently miniaturized to be embeddable within a circuit board while providing superior capacitance values. For example, a ratio of the length to the width of the substrate can be in a range from about 3:1 to about 1:3 and an area of the substrate can be less than about 3 mm.sup.2.

Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel (68a, 68b) manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.

A method for manufacturing a circuit board including the following steps: providing a flexible double-sided metal-clad laminate including a first metal foil, a flexible dielectric layer, and a second metal foil. A carrier is attached to the second metal foil. A first wiring layer including a first wiring region and a second wiring region is formed by the first metal foil. The first wiring region includes a first connecting pad, and the second wiring region includes a connecting pad. A plurality of rigid dielectric blocks surrounded to form an interval and a first groove exposing the first connecting pad is pressed on the flexible dielectric layer to form a rigid dielectric layer. An electronic component is fixed the first groove. The carrier is removed. The intermediate structure is bent along the interval and pressed. A second wiring layer is formed by the second metal foil.

Embodiments are generally directed to module installation on printed circuit boards with embedded trace technology. An embodiment of a printed circuit board includes one or more layers including a top layer; multiple embedded traces that are contained in an area of a surface of a first layer of the one or more layers of the printed circuit board; and a first module, the first module being installed on the plurality of printed traces in the area.

To provide a wiring substrate, an electronic device, and an electronic module the size of which can be easily reduced and the strength of which can be maintained. A wiring substrate includes an insulation substrate and an electrical wiring structure. The insulation substrate includes a recess section in one surface. A frame portion of the insulation substrate that forms a side surface which connects an opened surface and a bottom surface of the recess section to each other includes a first conductive portion having a plate shape in the frame portion.

The present disclosure provides a semiconductor module comprising a semiconductor device removably pressed-fit in a cavity formed in a printed circuit board and methods for manufacturing the same. The semiconductor device and the cavity of the printed circuit board can cooperate with each other and act as an electrical plug and an electrical socket respectively. Soldering the semiconductor device on the printed circuit board can be avoided. Therefore, the packaging process can be more flexible and reliability issues with solder joints can be eliminated. Moreover, heatsink can be mounted on top and/or bottom of the semiconductor device after being received in the cavity of the printed circuit board. Thermal dissipation efficiency can be greatly enhanced.

A sensor lens assembly having a non-reflow configuration is provided. The sensor lens assembly includes a circuit board, an optical module fixed to a surface of the circuit board, a sensor chip assembled to the circuit board, a plurality of wires electrically coupling the sensor chip and the circuit board, a supporting adhesive layer, and a light-permeable sheet. The circuit board has a chip-receiving slot recessed in the surface thereof The sensor chip is arranged in the chip-receiving slot, and a top surface of the sensor chip and the surface of the circuit board have a step difference therebetween that is less than or equal to 10 μm. The supporting adhesive layer is in a ringed shape and is disposed on the top surface of the sensor chip. The light-permeable sheet is disposed on the supporting adhesive layer and faces the sensor chip.