A printed circuit board includes a printed wiring board including an insulative substrate having a first surface and a second surface opposite to the first surface, and wiring provided on the second surface of the insulative substrate to face the through-holes. The insulative substrate has flexibility and through-holes passing through the insulative substrate from the first surface to the second surface. A semiconductor element is mounted on the first surface of the insulative substrate of the printed wiring board and has element terminals interposed between the printed wiring board and the semiconductor element. Conductive members filled in the through-holes connect the element terminals and the wiring. The insulative substrate has elasticity in which an elongation percentage of the insulative substrate is 20% or more. The wiring is formed from a conductive polymer or an elastic conductive paste in which conductive particles are mixed into a resin material.

A connector (100) and assembly of the same, the connector comprises an insulative housing (1) and a plurality of contacts (2) assembled onto the insulative housing (1), the insulative housing (1) defining a mating surface (11) and a mounting surface (12) opposite to the mating surface (11). Each contact (2) including a contact portion (21) arranged in the insulative housing (1) and a mounting portion (22) locating at the mounting surface (12) and protruding sidewardly beyond said insulative housing, the mounting portion (22) defines a soldering surface (222) for being soldered onto to said printed circuit board (200), said soldering surface (222) face toward the mounting surface (12). Therefore, when the connector (100) assembled to the printed circuit board (200), we could make full use of the height space at the up and down direction of the printed circuit board (200), thus greatly reducing the height space occupied by the connector (100).

A component carrier is illustrated and described. The component carrier has i) a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and ii) at least one elastic element attached to the stack and configured to reversibly connect the component carrier with a further component carrier by elastically deforming the at least one elastic element and essentially not deforming the stack and the further component carrier.

A module substrate for a semiconductor module including a wiring substrate having an upper surface and a lower surface opposite to each other and including a wiring formed therein, the wiring substrate having at least one through groove in at least one sidewall and extending in a thickness direction, and a through-groove test terminal including at least one contact pad, a surface of the contact pad being exposed from an inner wall of the through-groove, the contact pad being spaced apart from a vertical plane extending from the sidewall of the wiring substrate may be provided.

A fastening device includes at least one base portion and at least one fastener portion. The base portion is connected to a first object and the fastener portion is slidably assembled to the base portion. The fastener portion cooperates with the base portion to provide a locking and an unlocking function for connecting or disconnecting a second object to or from the base portion. With these arrangements, two objects can be repeatedly and quickly connected to or disconnected from each other.

A board includes: a signal layer; a first layer and a second layer disposed so as to interpose the signal layer; a connector shell portion embedded on a first surface side of the board; a first solder joint portion that brings the connector shell portion and the first layer to be electrically conductive with each other; a contact portion disposed in a state where a center axis line of the contact portion coincides with a center axis line of the connector shell portion and the contact portion is electrically conductive with the signal layer; and an insulating portion disposed around the contact portion.

A filter inductor for high-current applications. The filter inductor includes a magnetic core and a winding. The winding includes a shaped section having opposing ends, a pair of arm sections laterally extending from the opposing ends of the shaped section, respectively, and a pair of inductor pins, each extending perpendicular from an end of a respective arm section. The magnetic core includes a first core portion and a second core portion. The first core portion includes a recessed channel configured to receive the shaped section of the winding. The second core portion includes a pair of recessed regions configured to receive the pair of arm sections of the winding, respectively. The first core portion and the second core portion are coupled in contact to one another to secure the shaped section of the winding within the magnetic core. The filter inductor can be edge-mounted to a printed circuit board.

The present disclosure relates to a coupler and a base station antenna. The coupler comprises: a first coupling member comprising a first substrate, and a first signal path and a first sub-path of a second signal path located on the first substrate, the first sub-path configured to be at least partially coupled with the first signal path to couple a portion of a signal in the first signal path into the second signal path; a second coupling member vertically stacked with the first coupling member, the second coupling member comprising a second substrate, and a second sub-path of the second signal path located on the second substrate; a shielding member disposed between the first substrate and the second substrate so as to shield the first coupling member and the second coupling member from one another, the shielding member being provided with a first connection through-hole; and a first connection member passing through the first connection through-hole and electrically connected between the first sub-path and the second sub-path.

A cable connection board includes a signal layer disposed inside a board, a first layer and a second layer disposed inside the board with the signal layer being interposed therebetween, a cable coupled to the board so as to extend to a first surface of the board, a first solder joint portion that joins an outer conductor included in the cable and the first layer to each other, and a second solder joint portion that joins a front end of an inner conductor included in the cable and the signal layer to each other in the board.

A power supply circuit includes a printed circuit board (PCB), and a transformer coupled to the PCB. The power supply circuit also includes a first inductor assembly coupled to the PCB and electrically connected to the transformer, and a second inductor assembly coupled to the PCB and electrically connected to the transformer. The first inductor assembly has an inner edge and an opposite outer edge, and the second inductor assembly has an inner edge and an opposite outer edge. The inner edge of the second inductor assembly is spaced apart from the inner edge of the first inductor assembly by a gap. The power supply circuit also includes a first magnetic shunt coupled to the outer edge of the first inductor assembly, and a second magnetic shunt coupled to the outer edge of the second inductor assembly.