An image pickup element mounting substrate includes: a frame body composed of an insulating layer, a through hole being defined by an internal periphery of the frame body; an electronic component mounted on a lower surface side of the frame body; and a flat plate which is disposed on a lower surface of the frame body and covers an opening of the through hole while being partly kept in out-of-contact with the electronic component, the flat plate including an image pickup element mounting section at a part of an upper surface thereof which part is surrounded by the frame body, a lower surface of the electronic component being located above a level of a lower surface of the flat plate.

A method produces a conductive paste comprising 15-20% by weight of PDMS and 80-85% by weight of metallic micro-nano particles, wherein the conductive paste is obtained by repeated addition of singular doses of PDMS to a heptane diluted PDMS low viscosity liquid containing the metallic micro-nano particles, wherein the heptane fraction is allowed to evaporate after addition of each of the singular doses of PDMS. A method forms a conductive path on a support layer, wherein the conductive path is encapsulated by an encapsulation layer comprising at least one via through which at least one portion of the conductive path is exposed, the method comprising filling the at least one via with the conductive paste.

Devices and methods related to metallization of ceramic substrates for shielding applications. In some embodiments, a ceramic assembly includes a plurality of layers, the assembly including a boundary between a first region and a second region, the assembly further including a selected layer having a plurality of conductive features along the boundary, each conductive feature extending into the first region and the second region such that when the first region and the second region are separated to form their respective side walls, each side wall includes exposed portions of the conductive features capable of forming electrical connection with a conductive shielding layer.

A method of making a printed circuit board structure including a closed cavity is provided. The method can include the steps of forming a cavity in a core structure of a core layer, laminating each of a top surface and a bottom surface of the core structure with an adhesive layer and a metal layer to prepare a laminate structure and cover the cavity to define a closed cavity. The method also includes forming vias through the laminate structure, and patterning the metal layers in the laminate structure.

A patterned conductive layer on a flexible substrate includes pads for mounting an array of LEDs, conductive strips, and conductive tabs that couple the conductive strips to the pads. The desired circuit configuration is created by removing select tabs by punching holes or otherwise piercing the flexible substrate at the location of the tabs. In some embodiments, the patterned conductive layer is arranged to permit each LED to be mounted in either of two mirrored orientations, and in some embodiments, the patterned conductive layer is arranged to permit a separation between LEDs that is not predefined by the pattern. In some embodiments, the unmodified patterned conductive layer is arranged to provide a parallel circuit configuration, and the modified patterned conductive layer is arranged to provide a series or series-parallel configuration.

A pattern-printed thick film roll and a method for manufacturing the pattern-printed thick film roll can reduce defective products and material loss. The method for manufacturing a pattern-printed thick film roll (5) includes preparing a laminate of a printing substrate film (1) being elongated and comprising resin and a masking film (2) being elongated, comprising resin, having multiple through-holes (2a), and being bonded to a surface of the printing substrate film (1), filling, with ink (32), the through-holes (2a) in the masking film (2) in the laminate of the printing substrate film (1) and the masking film (2) to form an ink film (31), drying the ink film (31) to form a pattern-printed thick film layer (3) having a thickness of 10 to 400 m, and winding a stack (4) including the printing substrate film (1), the masking film (2), and the pattern-printed thick film layer (3) into a roll.

A connection circuit includes a base material, and circuits printed on the base material with conductive ink, in which a part of the base material is folded; at least parts of the circuits are layered in a vertical direction in a plan view; and the base material is interposed between the circuits in the vertical direction.

Disclosed are a flexible printed circuit and a battery pack. The flexible printed circuit comprises a flexible cable, wherein a window portion is formed in the middle of the flexible cable, and a flexible die-cutting circuit is electrically connected to the window portion. The flexible cable is a flexible flat cable. The flexible die-cutting circuit or a small flexible printed circuit is electrically connected to the window portion. The window portion is rectangular. The invention has the beneficial effect that an FCC manufactured by a new process is bendable while original FFCs and FDCs are non-bendable.