The present invention relates to a manufacturing method of a metal PCB assembly for a vehicle lamp and the metal PCB assembly made by the method. The manufacturing method of a metal PCB assembly for a vehicle lamp comprises a step S100 in which a material of a metal PCB 14 is prepared, a step S110 in which a circuit pattern 22 and a plurality of unit patterns 16 are formed and cut from the material of a metal PCB 14 to form a metal PCB 14, a step S120 in which a bending groove 24 is formed on a bottom surface of the metal PCB 14, a step S130 in which each of the unit patterns 16 is protruded forward around the bending groove 24 of the metal PCB 14 such that each of the unit patterns 16 is bent to be inclined from the metal PCB 14, and a step S140 in which a stepwise injection molded products 12 is coupled with the metal PCB 14 while the unit pattern 16 is protruded.

An optical package includes: a Printed Circuit Board (PCB) including a plurality of cut-out sections; a lens, including a first plurality of protrusions corresponding respectively to the plurality of cut-out sections, wherein the first plurality of protrusions includes three protrusions being guide posts, a first protrusion of the first plurality of protrusions is formed on a first side of the lens, and a second protrusion of the first plurality of protrusions is formed on a second side of the lens opposite to the first side, and when the lens is placed under the PCB, the first plurality of protrusions will pass through the cut-out sections; and a sensor for attaching on to the lens and the PCB.

A radio frequency (RF) antenna containing element is provided. The RF antenna containing element includes a reinforced metal foil laminate antenna bonded to a carrier layer. The reinforced metal foil laminate antenna includes a metal foil layer bonded to a reinforcement layer. The reinforcement layer can mitigate tearing of the metal foil layer during formation of the antenna.

A metal foil pattern layered body of the invention includes: a base member; a metal foil including a metal foil pattern formed by an opening and a metal portion; and a protuberance provided at the metal foil and at a boundary between the opening and the metal portion.

A manufacturing method of tape includes the steps of providing a tape including substrate units, providing a die device and a cutting and/or pressing process. Each of the substrate units includes a carrier, a circuit layer, an adhesive and a heat spreader, the heat spreader is attached onto the carrier by the adhesive. In the cutting and/or pressing process, the die device is provided to press the tape to generate separation protrusions on the heat spreader and allow the separation protrusions to protrude from a heat dissipation surface of the heat spreader. When rolling the tape, the separation protrusions can separate the stacked substrate units to prevent the adhesive from being squeezed out to contaminate the tape.

Proposed are a flexible die-cut circuit board including a substrate made of a flexible material, the substrate having a first surface and a second surface opposite to the first surface, at least one trace formed on the first surface of the substrate, a pattern fuse formed as a portion of the trace, the pattern fuse having a smaller thickness than other portions of the trace and being configured to break when excessive current flows, and a protective layer configured to cover the trace and the pattern fuse, wherein the pattern fuse is formed in a pattern having a curved shape in a direction perpendicular to the first surface of the substrate, and a method of manufacturing the same.