The invention relates to an electrically conductive film (10) having an electrically nonconductive substrate layer (12), and an electrically conductive metal layer (14) that has a structure produced by material removal and that on a first side is joined, at least in sections, to the substrate layer (12).

A flexible circuit comprises a laminated substrate, a layer of a protective coating, and first and second components. The laminated substrate comprises a support layer and a conductive layer arranged on the support layer. The conductive layer includes conductive traces. Edges of the conductive traces taper outwardly and towards the support layer. The layer of the protective coating is deposited on the conductive traces. The first component is soldered at a first connection point on one of the conductive traces. The soldering sublimates the protective coating. The second component is connected to the conductive layer at a second connection point. The second connection point is free of the protective coating.

A method for forming a printed circuit board includes: forming on a substrate a first conductive layer for a first edge connector pin and a first conductive layer for a second edge connector pin, wherein the first conductive layer for the first edge connector pin and the first conductive layer for the second edge connector pin are electrically coupled to one another via a first conductive layer for an electrical bridging element; electroplating a second conductive layer onto both the first conductive layer for the first edge connector pin and the first conductive layer for the second edge connector pin via a plating current conductor; and removing at least a portion of the electrical bridging element to electrically separate the first edge connector pin from the second edge connector pin.

A method of manufacturing a flexible circuit comprises providing a laminated substrate that includes a conductive layer, an adhesive layer, and a support layer. The method comprises forming conductive traces by removing selected portions of the conductive layer and the adhesive layer by dry milling the laminated substrate. The method comprises applying a protective coating to the conductive traces. The method comprises dispensing a solder material on the protective coating at a first connection point and arranging a first component at the first connection point. The method comprises heating the solder material to remove the protective coating from the first connection point and to connect the first component to one of the conductive traces at the first connection point. The method comprises attaching a second component to the conductive layer at a second connection point that is free of the protective coating by a process other than soldering.

Methods for forming electrical circuitries on three-dimensional (3D) structures and devices made using the methods. A method includes forming selectively shaped 3D structures using additive manufacturing. The method includes forming undercuts on upper-level pedestals of the 3D structures that effectively act as overhanging deposition masks for selectively preventing deposition of a selected material on a corresponding portions of lower levels. The method includes simultaneously forming and electrically isolating materials directionally deposited on the 3D structure.

A method for producing a circuit board and a shaped part for use in this method are provided. To simplify the production of circuit boards, save insulating material and thereby also reduce the height of the circuit board for efficient heat management, the method according to the invention for producing circuit boards comprises the following steps: Step A: providing an electrically conducting shaped part (1) with at least two segments (2a-g), which are integrally connected just by webs of material (M); Step B: embedding the segments (2a-g) in insulating material to form at least one circuit-board substrate (LS); Step C: applying a conductor structure (4a, 4b) to the circuit-board substrate (LS) to form the circuit board (LP); and Step D: releasing the integral connection of the segments (2a-g) by breaking through the webs of material (M).

Embodiments for a circuit board comprising a plurality of electrically conductive layers and a plurality of electrically non-conductive layers in a laminated stack are provided. The laminated stack defines a front face and a back face. A thermal conductive heat body extends from a die bond pad on the front face to an electrically conductive layer on the back face. The die bond pad is configured for a bare die to be mounted thereon. A bonding agent disposed around the thermal conductive heat body adhering the thermal conductive heat body to walls of an opening of the laminated stack and at least one of the plurality of electrically non-conductive layers are a monolithic structure. A plurality of wire bond pads on the front face adjacent to the die bond pad have a surface finish material thereon. The surface finish material is configured for wire bonding thereto.

A communications array includes a support structure configured to array elements, and a plurality of array elements supported by the support structure. Each array element is fabricated from an advanced manufacturing techniques (AMT) process. The support structure may be fabricated from a printed circuit board (PCB) or similar dielectric material. Each array element may include a radiator and/or a beamformer manufactured using the AMT process. The communications array further may include a copper vertical launch (CVL) and/or an electromagnetic boundary.

A method for manufacturing a dual conductor laminated substrate includes providing a first laminate including a first insulating layer and a first conductive layer; defining a first trace pattern including one or more traces in the first laminate; providing a second laminate including a second insulating layer and a second conductive layer; defining a second trace pattern including one or more traces in the second laminate; defining access holes in the second insulating layer; at least one of depositing and stenciling a conductive material in the access holes of the second insulating layer; and aligning and attaching the first laminate to the second laminate to create a laminated substrate.

The invention relates to an electrically conductive film (10) having an electrically nonconductive substrate layer (12), and an electrically conductive metal layer (14) that has a structure produced by material removal and that on a first side is joined, at least in sections, to the substrate layer (12).