A touch module and a manufacturing method thereof, and a touch screen are provided. The method of manufacturing a touch module includes: forming a composite electrode, a lead, and a lead pad each of which has a stacked structure of a transparent conductive layer and a metal layer on a substrate by one patterning process, the touch module including a touch area, and a peripheral area and a bonding area located at the periphery of the touch area, the composite electrode being formed in the touch area, the lead being formed in the peripheral area, and the lead pad being formed in the bonding area; forming a protective layer outside the touch area, and etching away the metal layer of the composite electrode to form a transparent touch electrode.

A ceramic circuit substrate having high bonding performance and excellent thermal cycling resistance properties, having a circuit pattern provided on a ceramic substrate with a braze material layer interposed therebetween, and a protruding portion formed by the braze material layer protruding from the outer edge of the circuit pattern, wherein: the braze material layer includes Ag, Cu, Ti, and Sn or In; and an Ag-rich phase is formed continuously for 300 m or more, towards the inside, from an outer edge of the protruding portion, along a bonding interface between the ceramic substrate and the circuit pattern, and has a bonding void ratio of 1.0% or less.

The disclosure relates to a microcircuit forming method. The microcircuit forming method according to the disclosure comprises: a seed-layer forming step for forming a high-reflectivity seed layer on a substrate material by using a conductive material; a pattern-layer forming step for forming a pattern layer on the seed layer, the pattern layer having a pattern hole arranged thereon to allow the seed layer to be selectively exposed therethrough; a plating step for filling the pattern hole with a conductive material; a pattern-layer removing step for removing the pattern layer; and a seed-layer patterning step for removing a part of the seed layer which does not overlap the conductive material in the plating step, wherein the high-reflectivity seed layer has a specular reflection property.

An etch chemistry solution for treating metallic surfaces in which the etch chemistry solution includes an oxidizing agent and gluconic acid. The etch chemistry solution may also include an oxidizing agent and a short-chained polyethylene polymer glycol or a short-chained polyethylene copolymer glycol. The metallic surfaces are usually used in circuits such as flexible circuits.

Disclosed is a stretchable member with a metal foil including a stretchable resin base material, and a conductive metal foil provided on the stretchable resin base material. A surface of the metal foil on the stretchable resin base material side is a roughened surface having surface roughness Ra of 0.1 m to 3 m.

An etching solution for copper and copper alloy surfaces comprising at least one acid, at least one oxidising agent suitable to oxidise copper, at least one source of halide ions and further at least one polyamide containing at least one polymeric moiety according to formula (I) ##STR00001##
wherein each a is independently from each other selected from 1, 2 and 3; each b is an integer independently from each other ranging from 5 to 10000; each R.sup.1 is a monovalent residue independently from each other selected from the group consisting of substituted or unsubstituted C1-C8-alkyl groups and a method for its use are provided. Such etching solution is particularly useful for retaining the shape of treated copper and copper alloy lines.

A method for connecting stacked circuit boards includes: a connecting structure is provided, the connecting structure is a bendable and flexible circuit board; a first circuit board and a plurality of supporting posts are provided, each of the supporting posts is dispersedly fixed to a side surface of the first circuit board; a second circuit board is provided, and two peripheral portions of the connecting structure are respectively fixed to the first circuit board and the second circuit board, the peripheral portions of the connecting structure are respectively near two opposite ends of the connecting structure; the connecting structure is bent to flip the second circuit board super-positioned above the first circuit board, and the second circuit board is connected to a free end of each of the supporting posts.

An etch chemistry solution for treating metallic surfaces in which the etch chemistry solution includes an oxidizing agent and gluconic acid. The etch chemistry solution may also include an oxidizing agent and a short-chained polyethylene polymer glycol or a short-chained polyethylene copolymer glycol. The metallic surfaces are usually used in circuits such as flexible circuits.

A wiring board includes a first insulating layer including a surface having unevenness, a second insulating layer including a surface having unevenness, laminated on the first insulating layer, and made of the same insulating material as that of the first insulating layer, insulating particles contained in the first and second insulating layers at rate of 40 to 80 wt %, a first wiring conductor on a first underlying metal layer surface, and a second wiring conductor on a second underlying metal layer surface. A second level difference of the unevenness in a surface region of the second insulating layer under the second wiring conductor is smaller than a first level difference of the unevenness in a surface region of the first insulating layer under the first wiring conductor, and the second level difference is not more than of an average particle size of the insulating particles.

Flexible electrical devices comprising electrode layers on softening polymers and methods of manufacturing such devices, including lift-off processes for forming electrodes on softening polymers, processes for forming devices with a patterned double softening polymer layer, and solder reflow processes for forming electrical contacts on softening polymers.