The present invention relates to a ceramic substrate unit comprising: a ceramic substrate including a ceramic basic material and a circuit pattern formed on the ceramic basic material; an electrode pattern portion included in the circuit pattern on the ceramic substrate and connected to an electrode of a semiconductor chip mounted on the ceramic substrate; and a spacer bonded to the electrode pattern portion of the ceramic substrate by means of a bonding layer, wherein the spacer is made of a metal or alloy having electrical conductivity and thermal conductivity. According to the present invention, a power semiconductor chip can be mounted on a substrate in a form similar to flip-chip bonding, and thus the bonding strength of the bonding surface between a spacer and the substrate is increased to improve the reliability thereof.

The present invention relates to a ceramic substrate unit comprising: a ceramic substrate including a ceramic basic material and a circuit pattern formed on the ceramic basic material; an electrode pattern portion included in the circuit pattern on the ceramic substrate and connected to an electrode of a semiconductor chip mounted on the ceramic substrate; and a spacer bonded to the electrode pattern portion of the ceramic substrate by means of a bonding layer, wherein the spacer is made of a metal or alloy having electrical conductivity and thermal conductivity. According to the present invention, a power semiconductor chip can be mounted on a substrate in a form similar to flip-chip bonding, and thus the bonding strength of the bonding surface between a spacer and the substrate is increased to improve the reliability thereof.

Present embodiment relates to a method for manufacturing a circuit board, and more specifically, to a technique for solving problems that may arise due to etching by injecting epoxy or silicon or inserting a metal block into a gap formed between two or more ceramic substrates.

Present embodiment relates to a method for manufacturing a circuit board, and more specifically, to a technique for solving problems that may arise due to etching by injecting epoxy or silicon or inserting a metal block into a gap formed between two or more ceramic substrates.

The invention relates to a method for manufacturing an electrical circuit board. It includes the provision of a sheet of electrically conductive material and a layer of adhesive material. In order to have a colour appear in spaces cut or etched into the sheet of electrically conductive material, the adhesive material includes a colouring agent. The invention also relates to an electrical circuit board for a smart card, which circuit board is manufactured using this method, and a smart card including such an electrical circuit board.

The invention relates to a method for manufacturing an electrical circuit board. It includes the provision of a sheet of electrically conductive material and a layer of adhesive material. In order to have a colour appear in spaces cut or etched into the sheet of electrically conductive material, the adhesive material includes a colouring agent. The invention also relates to an electrical circuit board for a smart card, which circuit board is manufactured using this method, and a smart card including such an electrical circuit board.

A printed wiring board includes an insulating layer, a conductor layer formed on the insulating layer, an adhesive layer formed on the conductor layer and including organic material, and a resin insulating layer formed on the insulating layer such that the resin insulating layer is covering the adhesive layer on the conductor layer formed on the insulating layer. The resin insulating layer includes resin and inorganic particles dispersed in the resin, and the adhesive layer has a smooth film part and a protruding part including protrusions protruding from the smooth film part such that a number of the inorganic particles in spaces between the protrusions with respect to a predetermined area is smaller than a number of the inorganic particles outside the spaces between the protrusions with respect to the predetermined area.

A wiring substrate includes: a glass substrate, a conductor layer and an insulator. The glass substrate has a first surface and a second surface serving as a back surface of the first surface and is provided with one or more through holes each extending from the first surface to the second surface. The conductor layer is provided on a side wall of each of the one or more through holes and the second surface. The insulator is provided on an inside of each of the one or more through holes. A surface roughness of the conductor layer provided on the side wall of each of the one or more through holes is larger than a surface roughness of the conductor layer provided on the second surface.

A wiring substrate includes: a glass substrate, a conductor layer and an insulator. The glass substrate has a first surface and a second surface serving as a back surface of the first surface and is provided with one or more through holes each extending from the first surface to the second surface. The conductor layer is provided on a side wall of each of the one or more through holes and the second surface. The insulator is provided on an inside of each of the one or more through holes. A surface roughness of the conductor layer provided on the side wall of each of the one or more through holes is larger than a surface roughness of the conductor layer provided on the second surface.

A method for manufacturing a printed wiring board includes forming a resin insulating layer on a first conductor layer, forming a protective film on a surface of the insulating layer, forming an opening through the film and the resin insulating layer, removing the film, treating the surface of the insulating layer, forming a second conductor layer on the surface of the resin insulating layer, and forming a via conductor connecting the first and second conductor layers. The insulating layer includes resin and inorganic particles including first and second particles. The surface of the insulating layer includes a surface of the resin and substantially flat exposed portions of the first particles, and the forming the second conductor layer includes forming a seed layer by sputtering, forming a plating resist using DI exposure, forming an electrolytic plating layer, removing the resist, and removing the seed layer exposed from the electrolytic plating layer.