Manufacturing technology to fabricate liquid metal-based soft and flexible electronics (sensors, antennas, etc.) in a high-throughput fashion, with fabrication rates that may approach that of the traditional integrated circuit components and circuits, are described. The technique allows creation of liquid-metal-only circuits, as well as seamless integration of solid IC chips into the circuits, in which liquid metal traces are used as flexible interconnects and/or as other circuit elements. The process may be applied at the wafer scale and may be integrated into the traditional microelectronics fabrication processes. Many sensors, antennas, and other circuit elements may be directly created using liquid metal, and when combined with the IC chips, a broad range of electronic functionality may be provided in a flexible, soft circuit that can be conformable, wearable.

A one-step react-on-demand (RoD) method for fabricating flexible circuits with ultra-low sheet resistance, enhanced safety and durability. With the special functionalized substrate, a real-time three-dimensional synthesize of silver plates in micro scale was triggered on-demand right beneath the tip in the water-swelled PVA coating, forming a three-dimensional metal-polymer (3DMP) hybrid structure of 7 m with one single stroke. The as-fabricated silver traces show an enhanced durability and ultralow sheet resistance down to 4 m/sq which is by far the lowest sheet resistance reported in literatures achieved by direct writing. Meanwhile, PVA seal small particles inside the film, adding additional safety to this technology. Since neither nanomaterials nor a harsh fabrication environment are required, the proposed method remains low-cost, user friendly and accessible to end-users. the RoD approach can be extended to various printing systems, offering a particle-free, sintering-free solution for high resolution, high speed production of flexible electronics.

A circuit board for a non-combustion flavor inhaler includes a substrate and an electrically conductive ink pattern printed on the substrate. The substrate includes paper. A percentage weight loss of the paper from room temperature to 290 C. is less than 20% of a percentage weight loss of the paper from room temperature to 900 C. under a condition that allows air to flow at a flow rate of 100 mL/min while elevating a temperature of the air at a speed of 10 C./min.

The present application relates to a transparent electrode and a method for manufacturing the same. The transparent electrode includes a transparent substrate, a self-assembled monolayer on the transparent substrate, and a metal nanowire layer on the self-assembled monolayer. The method includes forming a self-assembled monolayer including a polar functional group on a transparent substrate and forming a metal nanowire layer on the self-assembled monolayer.

A pattern forming method comprises dispensing a curable composition onto an underlayer of a substrate; bringing the curable composition into contact with a mold; irradiating the curable composition with light to form a cured film; and separating the cured film from the mold. The proportion of the number of carbon atoms relative to the total number of atoms in the underlayer is 80% or more. The dispensing step comprises a first dispensing step of dispensing a curable composition (A1) substantially free of a fluorosurfactant onto the underlayer, and a second dispensing step of dripping a droplet of a curable composition (A2) having a fluorosurfactant concentration in components excluding a solvent of 1.1% by mass or less onto the curable composition (A1) discretely.

The present application provides a method for manufacturing a patterned silver nanowire film, a touch screen and a manufacturing method thereof. The method for manufacturing a patterned silver nanowire film, includes: forming a patterned surface modification layer on a substrate; coating a silver nanowire solution on the substrate, the surface modification layer repels the silver nanowire solution, the silver nanowire solution is automatically scattered on the surface modification layer and is gathered onto a portion of the substrate that is not covered by the surface modification layer; and performing a baking process to cure the silver nanowire solution to form the patterned silver nanowire film.

An electronic circuit, including a substrate made of a first polymer having a first glass transition temperature lower than 200 C., the substrate having first and second opposite surfaces; a first layer or first tracks of a second polymer on the first surface; a second layer or second tracks of the second polymer or of a third polymer on the second surface, the second and third polymers being different from the first polymer and having a second glass transition temperature higher than 200 C.; and third electrically-conductive tracks on the first layer or the first tracks.

An electronic device, a method and apparatus for producing an electronic device, and a composition therefor are disclosed. An adhesive material is applied in a first pattern on a surface of a receiver substrate. A carrier having a metal foil disposed thereon is brought into contact with the first substrate such that a portion of the metal foil contacts the adhesive material. The adhesive material includes a first polymer, a second polymer, and a conductive carbon black dispersion, and is activated using at least one of mechanical pressure and heat while the portion of the metal foil is in contact with the adhesive material. The first substrate and the second substrate are separated, whereby the portion of the metal foil is transferred to the first substrate. The adhesive is electrically conductive to maximize the possibility of maintaining electrical connectivity even when there is a break in the metal foil.

Manufacturing technology to fabricate liquid metal-based soft and flexible electronics (sensors, antennas, etc.) in a high-throughput fashion, with fabrication rates that may approach that of the traditional integrated circuit components and circuits, are described. The technique allows creation of liquid-metal-only circuits, as well as seamless integration of solid IC chips into the circuits, in which liquid metal traces are used as flexible interconnects and/or as other circuit elements. The process may be applied at the wafer scale and may be integrated into the traditional microelectronics fabrication processes. Many sensors, antennas, and other circuit elements may be directly created using liquid metal, and when combined with the IC chips, a broad range of electronic functionality may be provided in a flexible, soft circuit that can be conformable, wearable.

A printed circuit board according to an embodiment of the present invention includes a base film containing, as a main component, a polyimide and a conductive pattern disposed on at least one surface of the base film. The conductive pattern includes a copper particle bond layer which is fixed to the base film. An external transmittance for a wavelength of 500 nm in a conductive pattern non-formed region of the base film is 70% or less of an internal transmittance for a wavelength of 500 nm in a middle layer portion of the base film.