A method of manufacturing an electronic component includes applying a paste at two locations on a board main surface of a board made of alumina and applying a glass paste between the two locations, heating the board, cutting two locations where a fired layer is provided, forming a layer on an outer periphery in a vicinity of a board end surface, forming a plated layer on an outer periphery of the layer, forming a second plated layer on an outer periphery of the plated layer, providing a solder on the board main surface in a vicinity of an electronic element, and providing the electronic element on the board main surface and attaching the electronic element to an interposer board.

A sintering composition, consisting essentially of: a solvent; and a metal complex dissolved in the solvent, wherein: the sintering composition contains at least 60 wt. % of the metal complex, based on the total weight of the sintering composition; and the sintering composition contains at least 20 wt. % of the metal of the metal complex, based on the total weight of the sintering composition.

A component carrier includes a stack including at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a magnetic element assembled to the stack, and a dielectric layer structure on the stack. The magnetic element includes an embedded inductive element. The dielectric layer structure at least partially surrounds the magnetic element. Further, a manufacturing method and a use of photo-imaging are described.

An apparatus for determining the condition of a printed circuit board, including a stencil database for storing a plurality of stencil data files corresponding to stencils of different dimensions, an image capturing device having an area where the printed circuit board is laid thereon for a surface profile of the printed circuit board to be captured for generating a surface data file of the printed circuit board, and a condition determination module that compares data from the surface data file with data from one or more stencil data file as a nominal reference via a matching process to determine the condition of the printed circuit board based on a set of categories. The printed circuit board is sent for further processing (i.e., stencil printing) after being determined to be in a match-successful condition where data from the surface data file falls within a tolerance of the nominal reference.

A glazing includes at least one glass sheet provided on one of the faces with an electrical network having resistance strips and collector strips, in which at least one portion of one face includes at least one strip obtained from an electrically conductive composition including a silver paste, the strip being in contact with another strip obtained from an electrically conductive composition including a copper paste, the other strip obtained from an electrically conductive composition including a copper paste being completely covered with a protective enamel layer.

Flexible electrical devices comprising electrode layers on softening polymers and methods of manufacturing such devices, including lift-off processes for forming electrodes on softening polymers, processes for forming devices with a patterned double softening polymer layer, and solder reflow processes for forming electrical contacts on softening polymers.

A high speed multi-directional 3D printer includes two opposing delta 3D printers set in an opposing configuration, a modified frame to enable both delta 3D printers to slide back and forth, two horizontal/outward printing extruders, and a sliding/locking kernel substrate mount with adhesive for printing against gravity.

Provided is a composition having moderate viscosity for coating properties and ejection properties, being applicable for firing at low temperatures, and leaving an extremely small amount of ash after firing. The composition of the present disclosure contains a miscible material of a compound represented by Formula (1) below and a compound (A) represented by Formula (A) below. In Formula (1) below, R.sup.1 represents a linear aliphatic hydrocarbon group having from 10 to 25 carbons; R.sup.2 and R.sup.3 are identical or different and represent an aliphatic hydrocarbon group having 2, 4, 6, or 8 carbons; R.sup.4 represents an aliphatic hydrocarbon group having from 1 to 8 carbons; R.sup.5 and R.sup.6 are identical or different and represent an aliphatic hydrocarbon group having from 1 to 3 carbons or a hydroxyalkyl ether group; and L.sup.1 to L.sup.3 represent an amide bond. In Formula (A) below, in the formula, R.sup.a and R.sup.c are identical or different and represent a hydrogen atom or an aliphatic hydrocarbon group that has from 1 to 12 carbons and may have a substituent; R.sup.b represents an aliphatic hydrocarbon group that has from 1 to 12 carbons and may have a substituent; and the substituents are each an amino group and/or a hydroxyl group.

A conductive transfer for application to a surface of a wearable item comprises a first non-conductive ink layer and a second non-conductive ink layer. An electrically conductive layer is positioned between the first non-conductive ink layer and the second non-conductive ink layer. The conductive transfer also comprises an adhesive layer for adhering the conductive transfer to the surface of the wearable item. The adhesive layer comprises a larger cross-sectional area than the cross-sectional area of each of the first non-conductive ink layer, the second non-conductive ink layer and the electrically conductive layer.

A reel-to-reel method to laser-ablate a circuitry pattern on the fly in a reel-to-reel machine as part of a process to fabricate a printed flexible circuit. The laser ablation method includes using an appropriate laser to irradiate a metal sheet thus ablating the edges of an intended circuitry pattern. Slugs can be removed by using an optional sacrificial liner, and the slugs can be optionally ablated into smaller parts first. The laser ablation can also include an optional method of creating tie bars to provide structural support to the web of circuitry patterns.