Provided is an ink for use in electronic component production making use of screen printing, which is suitable for actually allowing fine lines with high precision to be drawn in screen printing, and for actually allowing successive screen printing operations to be performed. The ink for screen printing of the present invention includes surface-modified silver nanoparticles (A) and a solvent (B), and has a viscosity at a shear rate of 10 (1/s) and 25° C. of 60 Pa.Math.s or more. The surface-modified silver nanoparticles (A) each include a silver nanoparticle and an amine-containing protective agent coating the silver nanoparticle. The solvent (B) includes at least a terpene solvent. In solvent (B), a content of solvents having a boiling point of less than 130° C. is 20 wt % or less based on the total amount of solvents.

An electrical device, comprising a softening polymer layer, an electrode layer on a surface of the softening polymer layer and a cover polymer layer on the surface of the softening polymer layer. An opening in the polymer cover layer is filled with a reflowed solder, one end of the reflowed solder, located inside the opening, contacts a contact pad site portion of the electrode layer, and another end of the reflowed solder contacts an electrical connector electrode of the device.

Various systems, devices, and methods for a vehicle smart brake pad comprising a sensor such as a force sensing device, and a production process thereof. For example, a production process of a vehicle brake pad can include the following steps in time sequence: applying an electrical circuit a support plate; screen printing on the electrical circuit of at least a first electrode; screen printing on the at least first electrode of a sheet of piezoelectric material; screen printing on the sheet of at least a second electrode; applying a friction pad on the support plate; and bulk polarizing the sheet of piezoelectric material by a supply of power to the at least first and second electrodes.

The method for processing a substrate includes the substrate preparation step of preparing the substrate, the pattern formation step of forming dummy patterns extending in an X-direction on the substrate, the mask arrangement step of arranging a stencil mask having multiple opening patterns on the substrate, the coating formation step of forming a metal film on the substrate through the multiple opening patterns, and the separation step of separating the dummy patterns from the substrate to obtain a submount. The dummy pattern has protrusion formed such that a side surface of the submount is exposed and formed close to the side surface with a clearance.

An air-heating type heat not burn heating device, a ceramic heating element and a preparation method thereof are provided. The ceramic heating element includes a honeycomb ceramic body and a heating printed circuit. Porous channels are arranged in the honeycomb ceramic body, and the porous channels are circular holes or polygonal holes. The heating printed circuit is arranged around an outer surface of the honeycomb ceramic body to heat the air passing through the porous channels. According to the ceramic heating element, the surface made of high purity alumina honeycomb ceramic has high compactness, it is able to effectively prevent absorption of smoke dust particles, thus to effectively preventing odd smell; the high-purity alumina honeycomb ceramic has good thermal conductivity, with a thermal conductivity of 33 W/mk; the wall thickness and pore diameter in the honeycomb ceramic structure are both very small, and the thermal conductivity is extremely excellent.

A method is provided for attaching components to pads on a PCB, where total accumulated tolerances are reduced by separating accumulated tolerances into multiple processes. The method includes performing first and second processes having first and second accumulated tolerances, respectively. The first process includes placing a first stencil over the PCB, the first stencil defining first apertures corresponding to the pads; printing solder paste onto the pads using the first stencil; and reflowing the printed solder paste to form corresponding solder bumps on the pads. The second process includes placing a second stencil over the PCB, the second stencil defining second apertures corresponding to the pads; printing flux onto the solder bumps using the second stencil; placing at least one component on the printed flux; and reflowing the printed flux and the solder bumps to form corresponding solder joints between the at least one component and the first pads, respectively.

An inspection system for and method of inspecting deposits printed on workpieces through a printing screen, the system comprising: a camera unit movable relative to a printing screen, where comprising a body including a plurality of apertures, and a workpiece on which deposits are printed through the apertures of the printing screen; and a control unit operable to control the camera unit such as to capture images of at least one pair of corresponding regions of the printing screen and the workpiece, and process the images to determine, for each of a plurality of points defining the image of the printing screen, whether the point is of aperture, and, only where the point is of aperture, determine whether the corresponding point of the corresponding image of the workpiece, as defined by a corresponding plurality of points, is of deposit, thereby enabling a determination of a print characteristic of deposits printed on the workpiece from a relationship of the points determined to be of deposit to the points determined to be of aperture.

A thick film paste comprising at least one particulate platinum (alloy), at least one metal compound, and an organic vehicle, wherein the at least one metal compound is selected from the group consisting of in each case particulate NiO, SiO.sub.2, RuO.sub.2, Rh.sub.2O.sub.3, IrO.sub.2, Cu.sub.2O, CuO, TiO.sub.2, ZrO.sub.2, PbO, SnO.sub.2, CeO.sub.2, Al.sub.2O.sub.3, MgO, MnO.sub.2 and MoO.sub.2, and metal compounds capable of forming a metal oxide on firing, the metal oxide being selected from the group consisting of NiO, SiO.sub.2, RuO.sub.2, Rh.sub.2O.sub.3, IrO.sub.2, Cu.sub.2O, CuO, TiO.sub.2, ZrO.sub.2, PbO, SnO.sub.2, CeO.sub.2, Al.sub.2O.sub.3, MgO, MnO.sub.2 and MoO.sub.2.

A method for producing a copper multi-level metallization on a ceramic substrate consisting of AlN or Al.sub.2O.sub.3. High power regions with metallization having a high current-carrying capacity and low power regions with metallic coatings having a low current-carrying capacity are created on one and the same ceramic substrate. The metallization is printed multiple times in the high power range.

A feedback information generation method for a solder inspection apparatus includes: receiving an input of information on the number of buffers which are disposed between the solder inspection apparatus and a screen printer for printing solder on printed circuit boards and are configured to support the printed circuit boards to be introduced into the solder inspection apparatus so as to put the printed circuit boards on standby; generating feedback information by using the input information and an inspection result of the printed circuit boards by the solder inspection apparatus; and transmitting the feedback information to the screen printer. Feedback information may be generated in consideration of the number of buffers, thereby preventing the feedback information from being excessively generated as well as ensuring the accuracy of the feedback information.